June 2010

Selco’s Turnkey Temperature Control Solutions Provide Easy Drop-in-Place Installation
Selco Products’ Turnkey Solutions meet OEM requirements for customized, ready-to-install mechanical thermostats, thermistors and electronic controls.  During the course of production, a product may have to go to several stations for soldering, crimping, kitting or markings.  Selco’s manufacturing capabilities allow assembly of turnkey finished products with the exact configuration that is required by a customer’s application.  OEMs save time in all areas; from engineering, purchasing, receiving, labor and production. 

Special configurations can include epoxy seal and over-mold, mylar sleeving, lead bending, connectors, brackets, wire and cable assembly, probe housings, customer termination labeling/markings, and special packaging. These fully-assembled components help customers speed production by eliminating assembly time and saving on the sourcing and designing costs associated with assembly work. OEMs looking for a special product requirement that will solve their problem can obtain a turn-key component that speeds their production line while saving on in-house labor costs.   

Examples of OEM customization requirements include special switches and sensors specified in the product design, but not available as a stock component, unusual bracket configurations, overmolding to protect a product that will be exposed to water/moisture, and components that involve extensive soldering, crimping or cutting that would otherwise have to be done during the OEM’s production process. 

STMicroelectronics Miniaturizes Digital Temperature Sensors for Protection of Portable Products
STMicroelectronics has announced a super-small and power-efficient temperature sensor allowing portable devices to benefit from features such as intelligent thermal protection.

As today's consumer lifestyles demand unprecedented performance and portability from products such as solid-state drives, notebook computers, eREADERS, smartphones, basestations and digital signage, hard-working electronics are packed into confined spaces and generate heat that can cause failure and poor reliability. ST's new STTS751 Digital Temperature Sensor (DTS) is mounted on the circuit board to feedback accurate temperature data allowing the system to manage its temperature, for example, by activating a cooling fan or shutting down circuitry.

The new sensor is smaller than previous-generation sensors, measuring 2 by 2mm, and has an ultra-low 50-microamp operating current, a power-saving 3-microamp standby current, and a one-shot mode that makes the device ideal for battery-powered devices. One-shot operation allows the sensor to sleep for extended periods, waking only to provide an instantaneous reading when triggered by the system.
The STTS751 is accurate to within 1°C and communicates its temperature data via an industry-standard System-Management Bus (SMBus) interface. This allows the sensor to be easily designed into a wide range of consumer and professional equipment including solid-state drives, large display backlights, smart batteries, servers and routers, telecom and Internet infrastructure and e-readers.

New CE Compliant Cabinet Coolers For Electrical Enclosures
EXAIR’s CE compliant Cabinet Coolers are a new low cost way to purge and cool electrical control panels. The cold air is circulated through the enclosure to eliminate heat damage and control shutdown. Independent laboratory testing certifies that Cabinet Coolers meet the appropriate CE safety requirements that now make them suitable for a wide range of enclosure cooling applications. 

The compact Cabinet Coolers can be installed in minutes through a standard electrical knockout hole. They convert an ordinary supply of compressed air to cold, 20°F air without refrigerants or CFC’s. Cabinet Cooler Systems include a compressed air filter to assure no moisture or dust is introduced inside the panel. Optional thermostat control minimizes compressed air use. Cooling capacities up to 5,600 Btu/hr. are available. Cabinet Coolers are UL Listed and maintain the NEMA 12, 4, and 4X rating of the electrical enclosure. There are no moving parts to wear out and no maintenance is required.

Honeywell Debuts Thermal Management Materials for Portable Computing Devices
Honeywell Electronic Materials has released a new printable thermal management material designed to help manage the tremendous heat produced by increasingly powerful semiconductors in portable computing devices such as laptops and netbooks.

In typical mobile computing applications, chip temperature rises steeply at start-up and remains high during operations. Honeywell’s PCM45M-SP is designed to meet these specific thermal management requirements, delivering reliable power cycling performance where other thermal materials would typically fail.

PCM45M-SP can withstand more than 1,000 hours at 150°C without degradation and more than 1,000 temperature cycles. The application is not limited to heat sink design, and the material may be applied to a component, heat sink or thermal spreader in any shape built into the printing screen. Additionally, the enhanced stability of this new material minimizes or eliminates the need for pre-mixing, conserving time and resources.

The PCM45M-SP phase change thermal interface consists of a sophisticated thermally conductive material with optimum filler size distribution to achieve maximum packing density compared with conventional phase change materials. PCM45M-SP changes phase at 45°C to ensure maximum surface conformance.

Kooltronic Expands Line of NEMA 4 or 4/4X Air Conditioners
Kooltronic, Inc. has added three new models to the Guardian/GuardianX series air conditioners. Offering 14,000, 18,000 and 26,000 BTU/H, these new models extend existing NEMA 4 Guardian and NEMA 4/4X GuardianX series capacities, which range from 5,000 to 9,000 BTU/H. Specifically designed to cool the interior of electronics cabinets, these NEMA 4 or 4/4X Rated air conditioners are well sutied for both indoor and outdoor applications where weather and corrosion resistance is required.

Epoxy-coated condenser coils and painted galvanized sheet metal in the Guardian series allow them to be used in corrosive and other hostile environments. The NEMA 4/4X interface makes these models well suited for applications such as food and beverage processing plants, where procedures require routine high pressure wash downs and electronic systems need to be housed in NEMA 4 or 4/4X rated enclosures. All models in the Guardian/GuardianX Series are UL/CUL Listed and use environmentally-friendly refrigerants.

Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
Orion Fans has experienced extensive growth with its 10-inch AC fans designed specifically to move a large amount of air through confined spaces. The OA254 series AC fans measure 254 mm by 89 mm and feature airflow of 547 CFM on the standard model, and up to 850 CFM on the XC high performance model. Designed for applications involving confined spaces including rack and panel and cabinet enclosures, these fans produce a significant amount of backpressure at the high CFM rating.

Available in 115 VAC and 230 VAC versions, the OA254 series fans feature voltage ranges from 80 to 130 VAC, and 160 to 260 VAC, respectively. Rated power for the standard model is 35 W and up to 75 W on the XC high performance model.  Rated speed ranges from 1,650 to 2,700 RPM. The fans feature a dual ball-bearing system, impedance and thermally protected motor, and die cast aluminum frame with a PBT, UL94V-0 plastic impeller.

Maximum static pressure for the OA254 AC fans is 0.39 inches H2O for the standard version and up to 1.14 inches H2O for the high performance model, with noise levels to 69 dB and operating temperature range from -20°C to +80°C. The fans feature a life expectancy of 60,000 hours at 40°C (L10).

Thermacore Acquires PMT and Expands Thermal Capabilities
Thermacore has completed its acquisition of Pittsburgh Materials Technology (PMT). As a result of this acquisition, Thermacore gains a range of in-house materials fabrication capabilities and materials expertise to add to their existing thermal management products and services. PMT joins Thermacore as a division. 

 Focusing on solutions for many of the same industrial, aerospace and military applications as Thermacore, PMT specializes in and has earned a reputation for expertise in complex material joining, refractory metal alloy development and characterization, mechanical testing to 2,000°C (3,600°F) and above, and most recently, cryomilling of aluminum to achieve dramatically higher material strengths.

Among the capabilities that PMT will add to Thermacore's existing strengths is vacuum brazing of complex aluminum cold plates and heat exchangers used in electronic systems. Specifically, the key elements of PMT's vacuum brazing capabilities include a number of vacuum braze furnaces for applications with temperatures ranging from 600°C to 1,900°C (1,100°F to 3,300°F) , complex joint design and assembly, helium leak testing and post braze heat treatment.

PMT's experience with refractory metal alloys will help Thermacore's engineers apply thermal management solutions in high temperature applications. PMT's experience in high temperature metal alloys, and ultra high vacuum environments began with the successful Nuclear Engine for Rocket Vehicle Application (NERVA) space reactor.  The NERVA project's purpose was to move men and material from earth orbit to the outer planets. From this effort came a focus on the invention and characterization of refractory metal alloys and their use in space and on earth.

In addition, PMT offers the engineering expertise to apply high and ultra-high vacuum technology to material processing and testing. More recently, PMT's material processing experience has enabled them to participate in an innovative Department of Defense project that strengthens an aluminum composite alloy fivefold. 

Lockheed Martin Subsidiary Signs Agreement With Owens Corning to Develop Next-Generation Composites
Applied NanoStructured Solutions LLC (ANS), a wholly-owned subsidiary of Lockheed Martin Corp and Owens Corning have signed a joint development agreement to support the commercialization of carbon-enhanced reinforcements.

Under the agreement, the companies plan to combine the carbon infusion technology of ANS with Owens Corning's reinforcements expertise to create a family of next-generation composite materials. The companies expect the carbon-enhanced reinforcements to be scalable to meet the demands of large-volume applications and provide mechanical properties with customizable electrical and thermal conductivity.

"Joining together with Owens Corning is a natural next step as we look to scale up our production capabilities," said Jeff Napoliello, president of ANS. "We expect that this agreement will permit us to shorten the development time to produce customizable material attributes for commercial and defense applications."

"This agreement builds on key strengths of both companies to drive the speed and efficiency in bringing new materials to market," said Chuck Dana, president of the Owens Corning Composite Solutions Business. "Potential applications range from wind turbines for renewable energy to protective packaging for electronics to composite armor for defense applications."

CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
CoolIT Systems has announced that MainGear Computers has selected a custom Dual ECO ALC solution to liquid cool the new Quantum SHIFT Xeon workstation PC. CoolIT’s technology will help ensure that MainGear’s workstation users have powerful computing performance at lowered acoustic levels.

“In designing Quantum SHIFT we strived to meet and exceed all of the high performance computing demands of creative professionals” said Wallace Santos, CEO and gounder of MainGear. “Every component selected is geared to deliver the optimal experience with Adobe CS5 and CoolIT was the ideal liquid cooling solution for our dual CPU X58 configuration.”

“Our liquid cooling technology is perfect for the graphics or video professional that wants to take full advantage of Adobe’s latest Creative Suite” said Geoff Lyon, CEO of CoolIT Systems. “This custom solution delivers maximum heat dissipation for the dual CPU Xeon configuration and minimizes thermal levels within the chassis by fitting 240 mm radiator performance into a single 120 mm fan mount which provides a cool, quiet computing ecosystem.”

Thermal Management and Technology Symposium – Register During the Month of June for Deep Registration Discounts
Being held October 19-20 in Dallas, Texas, the 2010 Thermal Management & Technology Symposium is a conference highlighting the latest advancements in thermal technology for product design, system development and process management. This year, the conference will focus on thermal management for electronics, thermal sensing, thermal testing & measurement and thermal materials. The event will feature presentations and panel discussions from industry leaders as well as numerous networking opportunities for industry professionals.

For the month of June only, you can register for the Thermal Management &Technology Symposium at rates that are drastically lower than the full registration rate of $995. But don’t delay: Savings will decrease as the month goes on. If you register anytime in the month of June, you’ll pay less than the regular early-bird rate, but the longer you hold out, the less you’ll save. (Register here.) Weekly savings are listed below:

If you register from:

June 15 – 21: Single registrations will run $595, teams of two will pay $495 each, and teams of three or more will pay $395 each.

June 22 – 30: Single registrations will run $645, teams of two will pay $545 each, and teams of three or more will pay $445 each.

Registration codes: You must use the proper registration code below to receive the discounted registration rates for June.

Single registrations: Use code THE200
Teams of two: Use code THE400
Teams of three: Use code THE600
Teams of four or more: Contact Aaron Butzen for your registration code.

Visit the Conference Registration page to register now!

Program

Upcoming and Emerging Technologies for Thermal Management
Nathan Muoio, Mechanical Engineer, Purcell Systems

Thermal Management by Alumina – A 'New' Old Material
Dr. Wolfgang Tschanun, Head Micro Systems Technologies activities, Reinhardt Microtech

Synthetic Jet:  Extremely Reliable, Efficient and Flexible Thermal Management Solutions for Chip and LED products
Brandon Noska, Applications Engineering Manager, Nuventix

Thermal Management in Today’s PCB Design and Fabrication for the Emerging LED Lighting Markets
Pratish Patel, President and CEO, Electronic Interconnect

Advanced Nano-particle Coolant for Electronics and Battery Cooling
D. Patrick McMullen, Business Development Manager, Dynalene, Inc.

Thermal Efficiency Study of Heat Shield Materials in Automotive Applications
Venugopal Vengala, Design Engineer, Cummins, Inc.

Copper Foam Wicks and Their Influence on the Performance of High-Powered, Ultra-Thin Heat Pipes for Thermal Management of Consumer Electronics
Dominic Pilon, Founder and CTO, Metafoam Technologies, Inc.

July
13-15 - SemiconWest 2010, San Francisco, Calif.

August
1-5 - SPIE Optics + Photonics 2010, San Diego, CA

September
8-10 - SEMICON Taiwan 2010
21-23 -Atlantic Manufacturing Technology Show (AMTS), Halifax, Nova Scotia
28-30 -Design & Manufacturing Midwest, Rosemont, Ill.

October
19-20 Thermal Management & Technology Symposium 2010, Dallas, Texas
20-21 Manufacturing Innovations – Aerospace/Defense, Orlando, Fla.

SEMICON West 2010
July 13-15, 2010
Moscone Center, San Francisco, Calif.

SEMICON West 2010 will be the hub of activity for products and technologies for the design and manufacture of microelectronics,themicroelectronics supply chain and emerging markets and technologies. Hear keynote speakers from Intel, Applied Materials, IBM andLAM.  Attend the Extreme Electronics mini-conferences on MEMS, photovoltaics, flexible electronics and displays, nano-electronics and solid state lighting (LEDs). Spend time at the TechXPOTs, which feature sessions on key industry segments, technologies and trends, or the new TechSITEs with short sessions on a wide variety of topics and invited technical presentations and non-commercial exhibitor demonstrations. Stop by the exhibitor booths. Be part of the excitement. Join the thousands of semiconductor professionals this year at SEMICON West. For more information, visit www.semiconwest.org.

SPIE Optics + Photonics
August 1-5
San Diego, Calif.

SPIE Optics + Photonics is the largest international, multidisciplinary optical sciences and technology meeting in North America.

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