April 2010

Balluff’s New High-Temperature RFID Tag Well-Suited for Industrial Manufacturing
Balluff has created a new industrial radio frequency identification (RFID) tag designed to withstand temperatures as high as 200°C (392°F) for limited exposure times. This very compact tag, only 40 mm by 22 mm by 6.5 mm in size, is designed to be easily mounted in many different locations and complies with the open ISO 15693 standard. These features offer greater hardware flexibility while providing the data reliability that Balluff RFID users are accustomed to.

The high-temperature tag is commonly used for applications where users need to track parts and get traceability of the manufacturing process. This is needed for quality improvement and error-proofing as well as for maximizing the reusability of product carriers such as pallets or conveyor segments. A typical application is painting and coating operations where heat sealing, oven drying or curing may occur. In this type of application, the data carriers are not active during high-temperature exposure, and therefore, data is reliably preserved. Reading and writing data usually takes place outside of the high-temperature areas at temperatures of 70°C (158°F) or lower. The tag also allows unlimited reading and writing of data with user memory of up to 112 numerical bytes or ASCII characters.

Integrating all popular communication protocols, this high-temperature RFID data carrier can communicate with all popular control platforms. Compatible read and write heads are available in many sizes and configurations to fit most applications.

E Instruments International Introduces TH300 Humidity and Temperature Transmitter
E Instruments International’s new TH300 humidity and temperature transmitter is well-suited for pharmaceutical and many industrial applications. The TH300 is a highly sensitive and accurate instrument that includes functions for relative and absolute humidity, dew point, wet and dry temperature and enthalpy.

Some of the TH300’s key features include: measuring ranges from 0 to 100 percent relative humidity and -40 to 356 °F, accuracy as tight as ±1.5 percent RH and ±0.3 percent Rdg ±0.45 °F, resolution of 0.1 percent RH and 0.1°F /°C, configurable intermediate and center zero ranges, Smart-Pro system interchangeable probes (PC or stainless steel), on-site calibration, simultaneous display of one to four parameters, two output 4-20 mA or 0-10 V (4 wires), RS 232, 2 RCR relays 6A/230VAC, external transmitter inputs, MODBUS network RS485 system and two visual (dual-color LED) and audible (buzzer) alarms.

Fujipoly Sarcon GR-HF Gap Filler Pads Reinforced for Versatility
Fujipoly has announced the availability of Sarcon GR-HF gap filler pads. These thermal interface materials are manufactured with a hardened top surface as well as a reinforced nylon mesh layer. The added reinforcement and less tacky surface treatments dramatically reduce tearing, elongation and damage during complex assembly and rework operations. These characteristics also make the TIM well-suited for applications that require intricate die-cutting.

Depending on the selected formulation, Sarcon GR-HF exhibits a thermal conductivity of up to 2.8 W/m°K and a thermal resistance as low as .67 °Cin2/W. This flame-retardant gap filler pad is manufactured in sheets up to 200 mm by 300 mm with thickness options from 1 mm to 5 mm.

THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
The partners in a new EU-funded research project have announced details of the multinational/multidisciplinary program: “THERMINATOR — Modeling, Control and Management of Thermal Effects in Electronic Circuits of the Future.” This three-year project is designed to maintain the strong positions that Europe’s semiconductor and electronics equipment companies have achieved in highly competitive application areas such as automotive systems and factory automation where the semiconductor devices are often required to work under harsh conditions with temperatures in excess of 100 °C.

Thermal effects have always been important in determining the performance, cost and reliability of both the device itself as well as for the application in which it is used. For example, packages that are able to sustain high temperatures are expensive, as are heat-sinks and cooling systems. In addition, high operating temperatures tend to cause performance degradation or even malfunctioning of circuits and components, thus reducing the reliability of the end application. For this reason, models that predict the thermal characteristics of semiconductor devices have long been included in the EDA (Electronic Design Automation) software that chip manufacturers use to design their devices. However, these existing design tools are not sufficient in terms of being able to handle the new materials and extremely small structures that will be required in future applications and technologies where heat and power management is of vital importance.

“European companies have achieved strong positions in important markets such as automotive and industrial electronics,” said Salvatore Rinaudo, THERMINATOR project coordinator and Industrial and Multisegment Sector CAD R&D Director at STMicroelectronics. “To enable them to fully exploit the opportunities opened up by the semiconductor technologies of the future, including CMOS and alternatives to CMOS, new, thermal-aware design paradigms are required.”

The project will draw on the complementary expertise of industrial partners (semiconductor manufacturers and EDA suppliers), research institutions and universities to meet three key goals: 1) Devise innovative thermal models, usable at different levels of abstraction, and interface/integrate them into existing simulation and design frameworks; 2) develop new, thermal-aware design solutions, customized for the different technologies and application domains of interest; and 3) enhance existing EDA solutions via thermal-aware add-on tools that will enable designers to address temperature issues more effectively using their existing design flows.
The total cost of the project is €11M, part of which will be contributed by the European Union under the Information and Communication Technologies (ICT) theme of the Seventh Framework Programme (FP7).

The partners involved in the project and their locations are: STMicroelectronics (Italy), Infineon Technologies (Germany), NXP Semiconductors (The Netherlands and Germany), Chipvision Design Systems AG (Germany), Gradient Design Automation, Inc. (US), Muneda Gmbh (Germany), Synopsys, Inc. (Armenia And Switzerland), Budapesti Muszaki Es Gazdasagtudomanyi Egyetem (Hungary), Csem Centre Suisse D'electronique Et De Microtechnique Sa (Switzerland), Fraunhofer-Gesellschaft Zur Foerderung Der Angewandten Forschung E.V And Its Iis Dresden And Iisb Erlangen Institutes (Germany), Imec (Belgium), Cea Leti  (France), Offis E.V. Germany, Politecnico Di Torino (Italy), and Alma Mater Studiorum-Universita Di Bologna (Italy).

Rehm Thermal Systems America to Begin User-Specific Condensation Reflow Process Characterizations
Rehm Thermal Systems has begun offering its customers in North America product-specific process characterizations utilizing its void free Condenso Soldering systems.

The new Applications Center, opened last year in the Atlanta suburb of Roswell, Ga., has been designed to provide Rehm customers with everything needed to perform reflow process characterizations on their own products. Rehm has begun showcasing its uniquely designed, void-free, vacuum-capable Condenso soldering system.

By incorporating a totally hermetic locked vacuum chamber, Condenso can combine vacuum with the heating process without board movement throughout the total soldering process from preheat until cooling, thus eliminating the risk of component movement typical of continuous motion system designs. This results in measurably lower scrap rates and improved cost of ownership. By not moving the product between soldering and vacuum, there is also no time or heat lost between these process steps. The Condenso system is unique in that vacuum can be applied directly and without delay at the point where the required temperature is reached.

Rehm Thermal Systems, celebrating its 20th anniversary this year, has operated directly in North America for over a decade, and the Roswell Applications Center is a continuation of its ongoing global infrastructure growth plan. With thousands of reflow ovens in operation throughout the world, Rehm remains the only single source for both convection and condensation soldering systems.

“We’re excited to now be offering even better opportunities to enable next generation reflow processes for our expanding customer base in North America,” said Rehm General Manager John Bashe. “New lead-free conversions and complex high thermal mass products stress most traditional reflow processes. Rehm has a 20-year history delivering advanced thermal solutions to meet these kinds of challenges.”

Laird Technologies Launches New Online EMI, Thermal Management and Wireless M2M Solutions Stock Locator
Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, has announced the launch of its online stock locator system for EMI, Thermal Management and Wireless M2M product lines.

The online stock locator provides Laird Technologies’ customers an electronic platform to directly access qualified distributors and their available inventory through the Lairdtech.com website. This launch completes the integration of the entire Laird Technologies standard product portfolio inventory into the online stock locator system.

“Laird Technologies’ online stock locator system provides customers a direct method in which to view EMI and Thermal Management product inventory and order directly from the distributors,” said Ingrid Braeuninger, Laird Technologies’ Director of Sales and Strategic Accounts. “The system greatly increases the speed of response time by specifically fitting the order to the customer, enabling them to buy it now and get it now.”

The system provides a single destination for online users to search the EMI, Thermal Management and Wireless M2M inventory of several select distributors at the same time. The system can identify all Laird Technologies EMI, Thermal Management and Wireless M2M products based on partial or entire part numbers, as well as by global region of availability.

“The online stock locator is a system that benefits online users looking for Wireless M2M product solutions,” said Sean Dycus, Laird Technologies’ Telematics and Wireless M2M Channel Manager. “The system identifies stock location with ease, allowing customers to directly purchase products from Laird Technologies and its select distributors.”

The online locator adds ease and efficiency to obtaining Laird Technologies EMI, Thermal Management and Wireless M2M products. Results from the part number search offer customers several simple options from requesting a quote to, in some cases, the ability to directly purchase the product online from the distributor or distributors that best fit their needs. To utilize the browser-based interface, log on to Lairdtech.com and click on the “Stock Locator” button prominently placed in the Standard Products Categories section on the lower left of the Lairdtech.com home page. The stock locator is also accessible through the product level pages of the site, including the EMI Solutions, Thermal Management and Wireless M2M & Telematics sections of the website.

Thermal Management & Technology Symposium 2010 Announces New Speakers
Limited speaking slots still available

The 2010 Thermal Management & Technology Symposium conference committee is pleased to announce several speakers for this year's event, part of a steadily expanding program that will focus on the latest advancements in thermal management for electronics, thermal sensing and thermal materials. Slated for October 19 and 20 in Dallas, Texas, the conference will cover next-generation thermal technology, heat transfer and worldwide technology trends. Confirmed presentations include:

Thermal Management in Today’s PCB Design and Fabrication for the Emerging LED Lighting Markets
Pratish Patel, President & CEO, Electronic Interconnect

Synthetic Jet: Extremely Reliable, Efficient and Flexible Thermal Management Solutions for Chip and LED products
Brandon Noska, Applications Engineering Manager, Nuventix

Advanced Nano-particle Coolant for Electronics and Battery Cooling
D. Patrick McMullen, Business Development Manager, Dynalene, Inc.

Thermal Efficiency Study of Heat Shield Materials in Automotive Applications
Venugopal Vengala, Design Engineer, Cummins, Inc.

Thermal Management by Alumina – A 'New' Old Material
Dr. Wolfgang Tschanun, Head Micro Systems Technologies activities, Reinhardt Microtech

More speakers will be announced in the coming weeks. For more information on these presentations or to see the latest program lineup, visit http://www.thermalnews.com/conf_10/TN10_program.php

There are still limited speaking slots available. Contact Aaron Butzen or visit the Call for Presentations page for more information.

April
26-29 Embedded Systems Conference, San Jose, Calif., San Jose, Calif.

May
11-13 EDS, Las Vegas, Nev.
11-14 National Manufacturing Week, Sydney, Australia
12-14 LightFair, Las Vegas, Nev.
23-28 SID Display Week, Seattle, Wash.
25-29 Interop, Las Vegas, Nev.

June
7-9 Sensors Expo & Conference, Rosemont, Ill.
7-10 MDM East, New York, N.Y.

July
13-15 SemiconWest 2010, San Francisco, Calif.

Electronic Components and Technology Conference
June 1-4, 2010
Las Vegas, Nev.

The premier international packaging and components conference, the Electronic Components and Technology Conference (ECTC), has published its Advanced Program. It includes 40 technical sessions (six of which are dedicated to 3D Si TSV fabrication, bonding, and processing issues), 16 CEU-approved professional development courses, and a technology corner with more than 70 exhibitors. There are also four special/invited sessions covering upcoming technologies such as packaging of medical devices, very fine pitch bumping, RFID technology, and the evolution of Mobile processing architecture.

The 60th ECTC will be held June 1-4, 2010 at the Paris Las Vegas Hotel, Las Vegas, Nevada, USA. For more information and to register, visit www.ectc.net.

SEMICON West 2010
July 13-15, 2010
Moscone Center, San Francisco, Calif.

SEMICON West 2010 will be the hub of activity for products and technologies for the design and manufacture of microelectronics,themicroelectronics supply chain and emerging markets and technologies. Hear keynote speakers from Intel, Applied Materials, IBM andLAM.  Attend the Extreme Electronics mini-conferences on MEMS, photovoltaics, flexible electronics and displays, nano-electronics and solid state lighting (LEDs). Spend time at the TechXPOTs, which feature sessions on key industry segments, technologies and trends, or the new TechSITEs with short sessions on a wide variety of topics and invited technical presentations and non-commercial exhibitor demonstrations. Stop by the exhibitor booths. Be part of the excitement. Join the thousands of semiconductor professionals this year at SEMICON West. For more information, visit www.semiconwest.org.

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