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 eNewsletter
December 2009
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Product News
- Nextreme Releases High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling
- Dickson Publishes Print and Video Support Guides for Chart Recorders and Data Loggers on Web
- Model 44900 Space Qualified Thermistors Feature High Sensitivity and Interchangeability
- High Temperature USB Data Logger in Stainless Steel Housing
- Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies
Industry News
- Thermal Management and Technology Symposium 2010 Accepting Papers
- AdaptivCool and Bluestone Energy Expand Data Center Efficiency Partnership
- PI System Used in Test of Leading Cooling Technologies for Data Centers
Event Listing
- Motor, Drive & Automation Systems 2010 Customizable to Match Your Areas of Interest
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| Sponsored Announcement - Click here to have your company's message featured! |
 Electronics Thermal Management Report
Based on hundreds of on-site visits and interviews, this report delves into the common thermal design mistakes by companies focused on consumer and commercial electronics and offers recommendations to help your company unlock the power of next-generation Computer-Aided Engineering solutions. Download this PDF Report.
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| PRODUCT NEWS |
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 Nextreme Releases High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling
Nextreme Thermal Solutions has released an updated version of the OptoCooler HV14 that enables assembly temperatures as high as 320°C. These assembly temperatures make the HV14 compatible with eutectic gold-tin (AuSn) solder, which is the industry standard process for packaging optoelectronic devices that require tight tolerances. Specific applications include laser diodes, semiconductor optical amplifiers and sensors.
The OptoCooler HV14 module is a high heat pumping thermoelectric device that is designed for standard electrical power requirements. At 85°C, the HV14 operates at a maximum of 2.7 V and can pump 1.7 watts of heat in a footprint of 3 mm². The module can create a temperature differential of up to 50°C between its hot and cold sides, making it suited for the cooling and temperature control of optoelectronic devices such as laser diodes.
AuSn solder provides improved joint strength, strain resistance and thermal conductivity. After the initial reflow during device assembly, the melting point of this particular AuSn solder is 320°C, enabling subsequent attachment of laser diodes and other devices to Nextreme's thermoelectric modules at lower temperatures, typically at 283°C, which is the industry standard. The use of this strain resistant material is particularly important for the laser diodes where movement of solder as little as 10 microns can cause significant alignment issues.
 Dickson Publishes Print and Video Support Guides for Chart Recorders and Data Loggers on Web
Dickson has introduced Web publications of online support guides, both in downloadable PDF formats and as videos on YouTube and the Dickson Web site to help its customers to monitor temperature, humidity, pressure and other electronic signal “events” important to critical storage.
These video or print support guides can be accessed via the “Support” tab on each product page at www.dicksondata.com.
 Model 44900 Space Qualified Thermistors Feature High Sensitivity and Interchangeability
Measurement Specialties has introduced the 44900 series thermistors, which feature high sensitivity and interchangeability to ± 0.1°C. These NASA Qualified epoxy encapsulated precision NTC thermistors are well suited for use in extended flight applications. These flight qualified thermistors feature resistance of 2252 Ohm to 30K Ohm at 25ºC. Thermally conductive epoxy coating exhibits <0.66 percent TML, <0.01 percent CVCM, 0.10 percent WVR when tested per ASTM E-specs, making these components well suited for extended space applications, low and mid-range temperature applications, tight tolerance instrumentation, applications requiring sensing of small changes in temperature, applications with degassing requirements and more.
 High Temperature USB Data Logger in Stainless Steel Housing
Lascar Electronics has released the EL-USB-1-PRO, a high temperature USB data logger capable of measuring and recording more than 32,000 temperature readings from -40°F to 257°F / -40°C to 125°C. Housed in a waterproof, stainless steel enclosure that protects the logger from corrosion, impact and moisture, the unit is rated to IP67 / NEMA 4X standards and can be used in extremely hostile environments. The EL-USB-1-PRO data logger is supplied with a long life, replaceable lithium battery that allows logging for up to three years.
The free configuration and download software provided with each logger makes programming the unit easy. Plug the logger directly into a USB port and use the EasyLog software to choose a logger name, set a sample rate, program high and low alarms, and select immediate or delayed logging start. The unit can then be placed in the chosen logging location. When logging is complete, plug the EL-USB-1-PRO back in the computer’s USB port and download the data, which can be graphed, printed or exported to other spreadsheet applications.
Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies
Laird Technologies, Inc. has introduced its newly modified Tunnel series Thermoelectric Assemblies (TEAs). The Tunnel series TEAs are designed with a patented, high-performance cross flow technology maximizing heat transfer when pulling air through a heat exchanger. Heat is absorbed and dissipated through a high density heat sink equipped with sheet metal shrouds and fans. The number of airflow paths required is minimized when compared to traditional impingement flow TEAs. The Thermoelectric Modules (TEMs) are custom designed to achieve a high coefficient of performance (COP) to minimize power consumption with reliable solid-state operation that does not use a compressor or CFC refrigerants.
“Conventional TEAs use impingement flow to convect heat from heat exchangers. This can pose a challenge for medical, analytical and photonics instruments with tight geometric space constraints,” stated Andrew Dereka, Laird Technologies Thermoelectrics product manager. “The Tunnel Series are compact TEAs that maximize cooling capacity and efficiency, while minimizing the number of air circulation paths required to operate properly.”
The Tunnel series TEAs are well suited for use in cooling applications with tight geometric space constraints by offering greater performance, higher reliability and low cost of ownership. Their advanced capabilities are aided by new material technologies, thinner profiles and automated assembly. |
| INDUSTRY NEWS |
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Thermal Management and Technology Symposium 2010 Accepting Papers
The Thermal Management and Technology Symposium 2010 conference committee is currently accepting abstracts. Being held October 19-20 in Dallas, Texas, the 2010 event will explore the important topics impacting the thermal management industry from materials to heat transfer.
There is a limited number of speaking slots in each track. Submit your abstract before the deadline on March 12, 2010.
Thermal Management and Technology Symposium 2010 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
Topics the planning committee is seeking:
• Market Trends
• Next-Generation Thermal Technology
• Thermal Technology by Market
• Thermal Management & Integration
• Advancements in Heat Transfer Technology
• Thermal Materials
• Temperature Products
Click here for more information.
AdaptivCool and Bluestone Energy Expand Data Center Efficiency Partnership
AdaptivCool and Bluestone Energy Services today announced an exclusive partnership to provide data center energy-efficiency solutions in National Grid and NSTAR territories. The collaboration will strengthen AdaptivCool and Bluestone’s ability to help clients implement data center efficiency best practices. The partnership, building on a similar agreement made in March of 2009, will leverage AdaptivCool’s expertise in adaptive-cooling technologies such as Room Scale Intelligent Cooling (RSIC) and Bluestone’s expertise in designing solutions that earn financial incentives from local utilities.
AdaptivCool and Bluestone recently collaborated on a data center efficiency project for a biotechnology company in Cambridge, Mass. The project qualified for a significant incentive from NSTAR, saves 40 percent of the annual data center cooling energy and resulted in a simple payback of less than two years. PI System Used in Test of Leading Cooling Technologies for Data Centers Chill Off 2 (CO2) team has released that the OSIsoft PI System, an enterprise infrastructure for management of time-series data and events, had been a critical component to the successful capture and analysis of Chill Off data used to evaluate leading cooling technologies for data centers.
The CO2 project “could not have done it without them,” according to a report from the team, which noted that it had successfully completed seven out of 13 tests scheduled for the two year program. The CO2 PI System is used to collect, aggregate and present data out of the MEP and IT systems.
Datacenter Pulse, with sponsorship from the Silicon Valley Leadership Group (SVLG) and Lawrence Berkeley National Labs, started the CO2 program in 2008. CO2 has the following test goals:
- Evaluate current data center cooling technology efficiencies with compute loads between 6kW-30kW/rack
- Compare cooling performance with various server air inlet and chilled water temperatures with a varying workload
- Develop a controlled test environment to enable equal, comparative testing between different data center solutions
- Test in an identical manner to produce defensible, unbiased data and share this data with the community.
CO2 is scheduled to complete in early 2010.
"The key to green IT will be improved energy efficiency throughout the data center,” noted Martin Otterson, Vice President of sales, EMEA, at OSIsoft. “OSIsoft is excited that the PI System infrastructure has contributed to the success of CO2 as groups like this shape best practices for the industry." |
| EVENT LISTING |
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Motor, Drive & Automation Systems 2010 Customizable to Match Your Areas of Interest
Motor, Drive & Automation Systems 2010, January 28-29 in Orlando, will feature presentations from some of the leading market and technical experts in the world on motor, drive and automation systems. Attendees return year after year to this conference for the latest information on technical advancements and market trends that affect end users and manufacturers involved in motor, drive and automation technologies.
Motor, Drive & Automation Systems 2010 will have up to two tracks running simultaneously so the event can be customized to fit your particular interests, from motor and drive materials components to OEM and end-user requirements.
Click Here to Register
More than 25 presentations will be given, including:
• Economic Outlook and Strategies for Success
• Advancements in Motor and Drive Systems Panel
• Motors, Drives and Motion Control - Global Market Update
• CleanTech Motor and Drive Panel
• Motor Systems Efficiency and Advancements
• New Motor and Drive Technology Provides Energy Savings and Improved Reliability for Cooling Tower Installations
• Real-Time Simulation Technologies to Improve the Development of Electric Motor Drives
• An Exploration of Ultra-Low Cost Motor Drive Design
• Smart Sensor Bearing for Efficient e-Motor Drives
• Technical Improvements in Industrial IGBT Modules Required for Reliable Operation in Vehicle Traction Drives
• Automation on a Budget
• Single and Multiple Axis Linear Motion Systems |
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