September 2009

Indium Corp. Introduces a Thermal Interface Material for IGBT Modules
Indium Corp. has released the Heat-Spring metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACK IGBT modules.

Many applications call for a TIM that can be placed against a backing plate and a cooling solution. Indium’s Heat-Spring is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications.

Heat-Spring has been tested for the latest PrimePACK configurations and has been optimized to reduce thermal resistance below that of other more traditional thermal interface materials.

Because of the increased number of fasteners used in the PrimePACK and its decreased width base plate, the Heat-Spring is well suited for this IGBT module.

Heat-Springs are soft metal preforms that are compressible, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out, which can occur with thermal greases and other viscous materials.

Heat-Springs are stable, easy to handle and require no special mounting apparatus. They are highly conductive both thermally and electrically.  Heat-Springs are also made of 100 percent recyclable and reclaimable metal and are considered a green interface material.

From design through assembly, Indium’s Heat-Spring delivers improved performance and overall finished goods reliability.

New TCS 1200 High Accuracy Dry Block Calibrator
The new TCS 1200 is an accurate and portable dry block calibrator featuring a temperature range up to 1,200°C. It is designed to verify and calibrate sensors, thermometers and process transmitters both in the field and in the laboratory. It can also be used as a black body source for infrared thermometers.

Features of the TCS 1200 include:

• Temperature range from 150°C to 1,200°C
• Stability of ±0.2°C @ 1,100°C
• Radial uniformity of ±0.2°C @ 1,100°C
• Heating speed of 100°C to 1,100°C in 20 minutes
• Cooling speed of 1,100°C to 800°C in 50 minutes
• Stabilization time of 15 minutes
• Four hole 80 mm deep metal block insert
• Optional CalPMan software plans, manages and documents all calibrations and certifications

Pfannenberg Introduces New DTT Series Top Mount Cooling Units
Pfannenberg has introduced the DTT series top mount cooling units. Units feature condensate technology, which protects electronics housed in enclosures from exposure to moisture and are available in three sizes with performance ranges from 1,200 to 14,000 Btu/h, for a total of six new models. The small size and condensate protection make the DTT Series well suited for installation where space is at a premium or enclosures are built in a row, such as narrow production lines.

The condensate management system was designed with several features, which safely route or completely prevent the formation of condensation, thus protecting the electronics from damage.  Unlike other models, the cold internal cooling circuit is located above the warm external circuit. This prevents large temperature differences from occurring between the surfaces of the cooling unit and enclosure – eliminating the possibility of condensate forming on the ceiling of the enclosure and dripping down onto valuable electronics. Condensate instead forms at the top of the unit and is routed to an active integrated condensate evaporator, standard to all Pfannenberg units, which uses a heating element to evaporate condensate. This also prevents the need for a vessel to hold stagnate condensate and the time and manpower to regularly empty it. Also in this design, the evaporator and the cold air passage are naturally insulated from the heated are of the unit, preventing condensation. Lastly, the DTT eliminates the need for an air routing duct by using high performance fans to create special air channels and the resulting increase in air speed to ensure cold air is routed to the bottom of the enclosure, aiding natural convection.
  
The DTT models also offer ease of installation and service. Tool-free installation (with the optional quick-mount frame) and easy access for filter or fuse replacement means no downtime of machines and greater cost savings. DTT models are environmentally friendly providing an estimated 20 percent energy efficiency improvement due to the streamlined design and use of more efficient components, as well as main parts constructed of recyclable material.

Laird Technologies Releases the First in a Series of Thermal Management Application Notes
Laird Technologies, Inc. has released its new application note titled Thermoelectric Assemblies for Medical Applications.  This application note is the first in a series of notes describing the role of Thermal Management in numerous market segments.

The application note describes why Thermoelectric Assemblies (TEAs) are a well suited thermal management solution for medical applications such as laser system optics, clinical diagnostic systems, digital radiography, MRIs, medical centrifuges and portable medical cockpits.  A wide range of small-and medium-sized heat pumping TEAs handle most medical device requirements including temperature regulation of samples and stabilization of sensitive instruments with the use of temperature controllers.
Simple thermal management solutions such as passive cooling, adding a fan and heat sink, are no longer typically viable to meet required performance and reliability specifications.  In today’s complex medical operating environment, TEAs are necessary to provide precise temperature control via cooling and heating in a variety of modular platforms.

TEAs combine special benefits that make them the only effective solution for many medical thermal management applications by offering greater performance, higher reliability, and low cost of ownership.  Their advanced capabilities are aided by new material technologies, thinner profiles, and automated assembly.

Non-Silicone Thermal Grease
Fujipoly America has released two non-silicone thermally conductive grease compounds.   The polysynthetic-based thermal interface material is well suited for thin bond line applications that are also adverse to silicone contamination.

The low-bleed, low-resistance grease is infused with unique heat-conductive metal oxides to deliver thermal conductivity from 0.75 to 2.6 W/m°K.  Sarcon non-silicone greases offer low evaporation characteristics and are engineered to deliver consistent performance across temperatures from -55°C to 205°C. 

Multiple packaging options include pre-filled 3 cc (6 g), 10 cc (28 g) and 30 cc (72 g) syringes and 1 lb. (454 g) jars for easy stenciling and automated application.

Nextreme and Lockheed Martin Announce Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
Nextreme Thermal Solutions, a company focused on microscale thermal and power management products for the electronics industry, and Lockheed Martin, have entered into a cooperation agreement to develop new products based on Nextreme's thin-film thermoelectric materials.
           
The agreement allows Lockheed Martin to use Nextreme's thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.

Nextreme’s team of engineers offers thermal modeling, design and engineering services to deliver fully optimized microscale thermal and power management solutions using standard and customized products.

Nextreme uses its thermal bump technology to produce discrete and integrated cooling and power generation devices. Nextreme currently offers several thermoelectric coolers, such as the OptoCooler HV14 and UPF40, that are capable of cooling and heating in ranges from 0.4 watts to 4 watts, with plans to provide higher heat pumping in the near future. Modules for electronics cooling and power generation are available for order now and pricing is available upon request.

Behr America Forms New Battery Cooling Group
In support of the company’s development activities within the fast-growing hybrid and electric vehicle market, Behr America has formed a Battery Cooling Group at its headquarters in Troy to meet the increasing demand for thermal-management technology.

The new group, managed by Fred Pumper, manager, Thermal Solutions and Validation Test, Behr America, will focus on growing the company’s battery cooling activities as well as support Behr’s Group in Stuttgart, Germany.

Tepas noted that one of the main technological challenges of battery-powered vehicles is maintaining optimum battery temperature -- crucial for top battery performance and longevity. Behr has developed a significant expertise in this area, both in Europe and in the US and has considerable experience in three different technical solutions for battery cooling: cooled air; refrigerant and secondary loop solutions.

All three approaches require the integration of battery cooling into the air-conditioning circuit. Vehicle architecture and other technical requirements determine which solution best fits a specific vehicle platform. Behr’s extensive system integration expertise gives the company a unique technological advantage in providing solutions for battery thermal management.

A 2008 LED Projection Systems Report Focuses on the Roadmaps for LED Devices and Supporting Thermal Management and Driving Systems
Research and Markets has added the 2008 LED Projection Systems Report to its offering. Most microdisplay-based projection systems built to date have used an HID lamp such as the UHP as a light source. LEDs have begun to penetrate the projection market and currently LED-based rear projection TV, companion pico-projectors and ultra-portable projectors are commercially available. This penetration of LEDs into the projection market is expected to continue and LED-based home theater projectors have already been announced while development of LED illumination for several other projector categories is ongoing. As a result, there is a need for an evaluation of LEDs in terms of technology, price and performance and comparison of these parameters to the existing and forecast markets for projection systems across a range of potential applications.

This report focuses on the roadmaps for LED devices and supporting thermal management and driving systems. This data is then applied to the analysis of specific LED projection markets and applications in six separate and stand alone Market Segment Analyses.

The objective of this report is to provide technologists, managers, product planners, engineers and researchers with the information needed to evaluate LED technology in proposed projection displays. The required information needed to make these decisions include performance data, cost information and availability, all forecasted from 2008 to 2012. Since the projection market includes segments that range from very low end to very high end, this report evaluates LEDs suitable for projectors ranging from a few lumens up to about 2,000 lumens.

Because of the negative effect of temperature on virtually all properties of a HB-LED, there is an extensive discussion of thermal packaging to maintain the lowest possible temperature. A technology forecast for HB-LEDs including changes in the technology that can be expected through 2012 is covered in the report.

Pre-Conference Workshops, October 19th: Register by Friday, Sept. 18th and Get $100 Discount!

Arrive in Denver a day early and take advantage of pre-conference workshops being offered in conjunction with Thermal Management and Technology Symposium 2009. Choose from one of two full-day pre-conference workshops being offered on October 19th.

Register for a pre-conference workshop by September 18th and get a $100 discount!

Thermal Management and Technology Symposium Pre-Conference Workshops:

Thermal Management of Electronic/Telecommunications Systems and Components
October 19th, 8:00 a.m. - 5:00 p.m. with a one hour lunch break (lunch provided)
Maurice J. Marongiu is the owner and founder of MJM Engineering Co.
Note: a separate registration is required

“Thermal Management of Electronic/Telecommunications Systems and Components” is a one-day workshop that will help attendees gain an understanding of the issues involved in the thermal management of electronic and telecommunication systems. Attendees will discover the principles and the tools available to the design engineer. The course is designed to help engineers and technicians with some thermal background (but new to the electronics, telecommunications field) understand the thermal challenges and demands of the electronics fields. Experienced engineers will also find the course very instructive and useful. Students will also gain a good understanding of the heat transfer and fluid mechanics principles affecting proper thermal management of electric, electronic and telecommunications systems and components. They will develop techniques that will be effective in the dissipation of heat generated in these systems.

Introduction to Thermal Systems Modeling with Excel/VBA
Matt Moran, Owner, Isotherm Technologies LLC
October 19th, 8:00 a.m. - 5:00 p.m. with a one hour lunch break (lunch provided)
Note: a separate registration is required

This one-day workshop is for engineers, scientists, and others interested in developing custom thermal system models. Principles and practices are established for creating integrated models using Excel and its built-in programming environment, Visual Basic for Applications (VBA). Real-world techniques and tips not found in any other course, book or other resource are revealed. Step-by-step implementation, instructor-led interactive examples, and integrated participant exercises solidify the concepts introduced.

Co-Located with Battery Power 2009
Battery Power 2009 will be co-located with Thermal Management and Technology Symposium 2009 and share a combined exhibit hall. For a nominal fee, Thermal Management attendees can upgrade their registration pass and get access to the Battery Power conference and the conference proceedings.

This international conference will highlight the latest developments and technologies in the battery industry, and will be held October 20-21 in Denver, Colorado.

Battery Power 2009 is a seventh annual event that will feature more than 30 presentations on portable, stationary and automotive battery technology, as well as battery manufacturing, materials and research & development. Topics will include new battery designs, emerging technologies, battery materials, power management, charging and testing systems, battery health, as well as the latest market trends affecting the industry.

Click here to learn more about Battery Power 2009.

NEBS 2009: Optimization of Telecom Networks Through Energy Efficiency
Oct. 27-28
Baltimore, Md.

The Verizon 2009 NEBS conference is in its 15th year.  Each year Verizon provide a venue where suppliers, labs and carriers can gather to hear the carriers latest technical purchasing requirements and network with industry professionals.  Coming off Verizon’s announcement last year to institute a set of energy reduction requirements, this year we will introduce the road map for our suppliers to reach this goal.  Part of the plan is to introduce its first ever Thermal Management, Simulation and Test (TMST) requirements. The new TMST program will focus on building energy efficiency thermal modeling into the pre-prototype builds utilizing Computational Fluid Dynamics (CFD) software programs to execute the heat flow calculations based on a representative physical model of the equipment. Verizon will also be introducing its new policy document on RoHS testing, which will positively impact the work designers, manufacturers and laboratory personnel do daily.  Additionally, AT&T, Verizon and key industry players will present their respective technical views of the expanding communications and broadband industry, with added emphasis being placed on optimizing for increased energy efficiency. For a complete agenda and registration please go to: www.verizonnebs.com.

September
13-16 International Conference and Exhibition on High Temperature Electronics Network, Oxford, UK
22-24 Design & Manufacturing Midwest, Rosemont, Ill.
30-Oct. 2 SEMICON Taiwan

IMAPS 2009
11/1 - 11/5, 2009
San Jose, CA

IMAPS 2009 will be largest symposium in the world related to the microelectronics packaging. IMAPS 2009 will feature a powerful technical program, known for years as one of the best in the industry, a state-of-the-art exposition, progressive professional development courses, another informative Global Business Council Marketing Forum, and many other events and activities to share the latest developments in microelectronics. The 42nd Annual International Symposium on Microelectronics attracts over 3,000 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

AVS International Symposium and Exhibition
11/8 -11/13
San Jose, CA

The AVS 56th International Symposium and Exhibition, November 8-13, 2009, in San Jose, California will feature technical sessions and an exhibition with scientific instrumentation, components, accessories, tools and services. This program includes applications and products in fields such as surface analysis and engineering; biomaterials; MEMS/NEMS; nanotechnology; plasma science; thin film; vacuum technology; and electronic materials and processing. Exhibit attendance is free. For more information, visit www.avs.org.

Informex USA 2010
February 16-19
San Francisco, Calif.

Since it's inception in 1983, Informex has built the leading North American event for the chemical industry. Focusing on the business of fine and custom chemistry, Informex is bringing together serious buyers and sellers of chemicals, chemical technologies, and related services.

The best networking. The best events. The best business can be found at Informex 2010.

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