August 2009

New Induction Heating Systems Are Versatile, Powerful, Small
Ambrell has released new models to the Ekoheat family of induction heating systems. With a condensed form factor, the Ekoheat compact models are versatile and rugged and easily integrated into existing manufacturing cells. The Ekoheat power control system delivers output power from 100 W to 15 kW with 100 percent duty cycle at output frequencies from 50 kHz to 150 kHz.

The Ekoheat Compact system is CE marked and is packaged in a NEMA 12 enclosure. A wide range of features and functions are standard. The work head where the heating occurs can be located up to 30 meters from the power supply making it well suited for a variety of production environments.

Target heat temperatures are achieved quickly and efficiently. Ambrell’s new, optional AutoTap technology is used for challenging applications where steel is heated through Curie temperature (where material loses its permanent magnetism), automatically adjusting for the varying electrical load during this transition.

Repeatable, efficient and non-contact heating is provided for brazing, annealing, bonding, soldering, curing and many more applications.

Next Generation Electronic Cooling Software Streamlines Model Creation, Gridding, Solving and Post-Processing
Future Facilities has released 6SigmaET, the next generation of electronic cooling software. “6SigmaET was developed by some of the industry’s leading software designers with many years experience of the application of CFD to electronics cooling. They were given the opportunity to start from scratch without the restrictions involved in working with software that was developed originally a decade ago,” said Sherman Ikemoto, North American General Manager of Future Facilities. “The result is that 6SigmaET provides capabilities unmatched by previous-generation products such as building the model entirely from intelligent objects which speeds up model creation, enables automatic gridding and simplifies post-processing.

“Another key advantage of 6SigmaET is support for the recent trend of redefining the form factor of electronic products by erasing the traditional boundaries between the box, rack and room. With 6SigmaET for example, PCB level design can be done in the context of the data center as the final application. This opens the door to a whole new range of products such as rack-based systems, containerized or custom data centers. ”
6SigmaET streamlines model creation, gridding, solving and post-processing. An automated process is used to completely convert incoming computer aided design data to intelligent objects such as the chips, capacitors, resistors and other components on a printed circuit board and complex shaped heatsinks. A heatsink can be snapped onto a chip and a chip can be snapped onto a board, eliminating much of the cumbersome positioning required with primitive-based electronics cooling software. The intelligence contained in every aspect of the model enables automatic meshing such as increasing the grid density in critical areas.

The next generation design of 6SigmaET overcomes limitations of complex geometry. 6SigmaET solves the conduction equations required to accurately simulate rotated or angled geometry such as angled DIMMs. 6SigmaET also provides an updated user interface that greatly reduces learning time and also reduces the time required to perform nearly all basic modeling and reporting tasks.

Advanced multigrid solver technology makes the solution process faster and more robust. 6SigmaET bases reporting on the intelligent objects in the model, such as the electronic components, rather than abstract, geometric constructs, greatly reducing the time needed to obtain information necessary to evaluate or characterize the design.

Thermally Conductive Two Part Epoxy for Enhanced Heat Dissipation
Master Bond's EP30BN is a two-part boron nitride epoxy adhesive offering improved thermal management of heat generating components. EP30BN is a medium viscosity epoxy system with good flow characteristics, making it well suited for thermally conductive adhesive for bonding, sealing and potting applications. Featuring high thermal conductivity and electrical insulation properties, the thermal epoxy is designed to optimize heat dissipation of aerospace, defense and microelectronic assemblies with minimal weight penalty. It is formulated to cure at room temperature or more rapidly at elevated temperatures to a tough, thermoset, dimensionally stable plastic. Attractive mechanical strength properties and outstanding chemical resistance are maintained over the wide temperature range of -60°F to 300°F.

New Technology Released in Intelligent Heating
Mouser Electronics, Inc. has signed a distribution agreement with Conflux, a Swedish developer and manufacturer of revolutionary technology for heating products – the SIP compound and the ZPZ design.

Mouser’s Conflux product line features new technology in intelligent heating that is cost-effective, energy saving and environmentally friendly. The unique and patented technologies with built-in intelligence deliver efficient heating where it’s needed and when it’s needed. The ZPZ Foil is based on the SIP compound (Superimposed Impedance Polymer) that provides heating technology with the characteristic that it cannot overheat.

Stock includes ultra thin, low-cost polymer PTC Discs that are available in AC or DC in 12 V, 24 V and 48 V. In addition, Mouser is stocking 6/12 V LCD heaters in 3.5-inch and 7-inch standard sizes. ZPZ foil is also available in 12 V and 48 V.

EasyHeat Goes Live with Updated Website
EasyHeat, an innovative leader in industrial pipe tracing, roof and gutter deicing, and Warm Tiles floor warming, has launched a redesigned Web site located at www.easyheat.com. The new site upgrades the ability of customers to find the technical information they need about EasyHeat's full compliment of heat tracing products and the value that they bring to their organizations.

The site offers quick access to the most up-to-date EasyHeat information, from PDF catalogs and datasheets to helping customers find local representatives, plus it provides EasyHeat distributors with the timesaving benefits of on-line assistance via a new Members Only service.

Alfa Laval Group Acquires Heat Exchanger Service Company in Brazil
Alfa Laval Group, a company focused on heat transfer, centrifugal separation and fluid handling, has acquired PHE Indústria e Comércio de Equipamentos Ltda. in Brazil, a company that services plate heat exchangers in a variety of industries. The company will be integrated into Tranter.

PHE Indústria e Comércio de Equipamentos Ltda. was consolidated in the Alfa Laval Group from Aug. 1, 2009.

Alfa Laval is a global provider of specialized products and engineering solutions based on its key technologies of heat transfer, separation and fluid handling.

The company’s equipment, systems and services are dedicated to assisting customers in optimizing the performance of their processes. The solutions help them to heat, cool, separate and transport products in industries that produce food and beverages, chemicals and petrochemicals, pharmaceuticals, starch, sugar and ethanol.

New Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
Nextreme Thermal Solutions, a company focused on microscale thermal and power management products for the electronics industry, and Lockheed Martin, have entered into a cooperation agreement to develop new products based on Nextreme's thin-film thermoelectric materials.

The agreement allows Lockheed Martin to use Nextreme's thin-film thermoelectric products and thermal and power management design services in solutions it is developing for government and civil applications.

Nextreme’s team of engineers offers thermal modeling, design and engineering services to deliver fully optimized microscale thermal and power management solutions using standard and customized products.

Nextreme uses its thermal bump technology to produce discrete and integrated cooling and power generation devices. Nextreme currently offers several thermoelectric coolers, such as the OptoCooler HV14 and UPF40, that are capable of cooling and heating in ranges from 0.4 watts to 4 watts, with plans to provide higher heat pumping in the near future. Modules for electronics cooling and power generation are available for order now and pricing is available upon request.

Arlington Capital Partners Acquires J.A. Reinhardt and Company Incorporated
Arlington Capital Partners has acquired J.A. Reinhardt and Company Inc. (J.A. Reinhardt), located in Mountainhome, Pa. The combination of J.A. Reinhardt and the TSI Group, Inc. (TSI) further enhances the defense and aerospace portfolio of Arlington Capital Partners. J.A. Reinhardt designs, engineers and manufactures thermal and mechanical products such as avionics chassis, cold plates, complex electronic housings with integrated cold walls, heat exchangers and microwave antennas for the defense and aerospace industries.

Greg Tucker, CEO of TSI, said, “The acquisition of J.A. Reinhardt reaffirms TSI as the industry leader in thermal management and electronics cooling. I am excited to leverage the expertise of existing TSI brazing companies with J.A. Reinhardt to enhance our thermal solution offerings and improve our value offering to our customers.”

Lockheed Martin Selects Cuming Lehman Chambers
Cuming-Lehman Chambers (CLCI) was awarded a contract to construct an advanced PIM Test Facility for Lockheed Martin Space Systems at its Newtown, Pa. facility. The Passive Intermodulation (PIM) shielded test chamber will support development and testing for several of Lockheed Martin’s next-generation technologies including GPS III and MUOS. According to recent Lockheed Martin press releases, these technologies represent in excess of $3.5 billion in new contracts for the company.

CLCI will utilize advanced RF absorbers developed by its parent company, Cuming Microwave, as well as proprietary building techniques in the design and construction of the 2,668 sq/ft, 53 ft. tall PIM Test Facility.

GPS III is a $1.46 billion program to build the next-generation Global Positioning System. The development contract was awarded to the Lockheed Martin team by the US Air Force Space and Missile Systems Center, Los Angeles Air Force Base.

California. GPS III will improve position, navigation and timing services and provide advanced anti-jam capabilities yielding improved system security, accuracy and reliability. The next generation GPS IIIA satellites will deliver significant improvements over current GPS space vehicles, including a new international civil signal (L1C) and increased M-Code antijam power with full earth coverage for military users.

Only Three Days Left to Register at the Reduced Early Bird Rate!
Register by Aug. 20th and save $300 on single full-conference passes. Group, military and government discounts are also available as well as Single Day and Expo Only Passes.

Thermal Management and Technology Symposium 2009 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held October 20-21 in Denver, Colorado.

Register Today!

Two New Sessions Added
The Thermal Management & Technology Symposium 2009 program has been expanded to include two more sessions.

• Guy Wagner, senior thermal consultant at Electronic Cooling Solutions Inc., will present, “Designing with Thermoelectric Coolers and Generators.” This presentation will cover the advantages and limitations of designing with and using TECs and TEGs as well as the use of TEGs to generate electric power from the waste exhaust gas heat of an internal combustion engine and solar electric power generation using TEGs. 

Click here to read more about this session.

• Brandon Noska, Thermal Application Engineer at Nuventix, will present, “Active vs. Passive Cooling, the Synthetic Jet Cooling Solution.” As products become more complex, an active cooling solution becomes necessary. This presentation will include results and effective new active cooling solutions for thermal management design, focusing on synthetic jet active cooling instead of the classic fan solution. 

Click here to read more about this session.

Co-Located with Battery Power 2009
Battery Power 2009 will be co-located with Thermal Management and Technology Symposium 2009 and share a combined exhibit hall. For a nominal fee, Thermal Management attendees can upgrade their registration pass and get access to the Battery Power conference and the conference proceedings.

This international conference will highlight the latest developments and technologies in the battery industry, and will be held October 20-21 in Denver, Colorado.

Battery Power 2009 is a seventh annual event that will feature more than 30 presentations on portable, stationary and automotive battery technology, as well as battery manufacturing, materials and research & development. Topics will include new battery designs, emerging technologies, battery materials, power management, charging and testing systems, battery health, as well as the latest market trends affecting the industry.

Click here to learn more about Battery Power 2009.

Arrive in Denver a day early and take advantage of pre-conference workshops being offered in conjunction with Thermal Management and Technology Symposium 2009. Choose from one of two full-day pre-conference workshops being offered on October 19th.

Introduction to Thermal Systems Modeling with Excel/VBA
Presented by: Matt Moran, Owner, Isotherm Technologies LLC
When: October 19th, 8:00 a.m. - 5:00 p.m. with a one hour lunch break (lunch provided)
Click here to read more about this workshop.

Thermal Management of Electronic/Telecommunications Systems and Components
Presented by: Maurice J. Marongiu, Owner, MJM Engineering Co.
When: October 19th, 8:00 a.m. - 5:00 p.m. with a one hour lunch break (lunch provided)
Click here to read more about this workshop.

Register for a pre-conference workshop by September 18th and get a $100 discount!

August
29-Sept. 2 30th International Thermal Conductivity Conference and the 18th
International Thermal Expansion Symposium, Pittsburgh, Penn.

September
22-24 Design & Manufacturing Midwest, Rosemont, Ill.
30-Oct. 2 SEMICON Taiwan

IMAPS 2009
11/1 - 11/5, 2009
San Jose, CA

IMAPS 2009 will be largest symposium in the world related to the microelectronics packaging. IMAPS 2009 will feature a powerful technical program, known for years as one of the best in the industry, a state-of-the-art exposition, progressive professional development courses, another informative Global Business Council Marketing Forum, and many other events and activities to share the latest developments in microelectronics. The 42nd Annual International Symposium on Microelectronics attracts over 3,000 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

AVS International Symposium and Exhibition
11/8 -11/13
San Jose, CA

The AVS 56th International Symposium and Exhibition, November 8-13, 2009, in San Jose, California will feature technical sessions and an exhibition with scientific instrumentation, components, accessories, tools and services. This program includes applications and products in fields such as surface analysis and engineering; biomaterials; MEMS/NEMS; nanotechnology; plasma science; thin film; vacuum technology; and electronic materials and processing. Exhibit attendance is free. For more information, visit www.avs.org.

Informex USA 2010
February 16-19
San Francisco, Calif.

Since it's inception in 1983, Informex has built the leading North American event for the chemical industry. Focusing on the business of fine and custom chemistry, Informex is bringing together serious buyers and sellers of chemicals, chemical technologies, and related services.

The best networking. The best events. The best business can be found at Informex 2010.

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