eNewsletter

January 2009

In This Issue:
Indium
Product News
  • Omega Engineering, Inc. Releases New Fan Heater
  • Ircon Introduces IR Thermometer with New Signal Detection and Attenuation Alarming Capabilities
  • Silicone-Free Interface Material Provides High Thermal Conductivity
  • Kooltronic Releases Compact Solution for Electronic Cabinet Cooling

Industry News

  • New ABB Catalog Details Temperature Instrumentation
  • Thermacore to Develop Active Heat Sink Technology
  • Alfa Laval Strengthens Presence in South Korea, Acquires Local System Builder
  • Nextreme Controls Polymerase Chain Reaction Process with Microscopic Peltier Heat Pump
  • IBM Technology Licensed by Vette Receives Patent Approval
  • Share Your Knowledge about the Industry in Web-Broadcasted Seminars

Event Listing

  • Thermal Management of Electronic/Telecommunications Systems and Components Webinar

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PRODUCT NEWS

Omega Engineering, Inc. Releases New Fan Heater
The DIN Rail mountable design of this fan heater makes it a well suited accessory for enclosures. The heating power of the CE compliant CR027 adjusts to ambient temperature and features integrated adjustable thermostat and control light.

It comes equipped with a built-in temperature limit in case of fan fire. This compact heater in PTC technology maintains minimum operating temperatures in enclosures and helps to prevent failure of electronic components caused by condensation and corrosion. Price starts at $155.


Ircon Introduces IR Thermometer with New Signal Detection and Attenuation Alarming Capabilities
Ircon, a company focused on infrared (IR) noncontact temperature measurement, has introduced an improved version of its Modline 5R Infrared Thermometer with advanced signal detection and attenuation alarming capabilities. The new Modline 5 series 5R Ratio Sensors are designed for non-contact infrared temperature measurement applications involving harsh industrial environments.

The Ircon Modline 5 series 5R Ratio Sensors utilize a dual detector assembly that measures temperature by comparing infrared radiation levels in two wavelength bands (0.85 microns to 1.05 microns and 1 micron to 1.1 microns). Temperature readings are based on the ratio of the two signals in these bands. Because the sensors measure the ratio of radiation intensities at two wavelengths rather than the absolute intensity of radiation at a single wavelength, they are almost immune to error caused by loss of signal. Small targets that do not fill the field of view, and partial obstructions from bursts of steam, dust and solid objects in their sight path, can be tolerated.

The Modline 5 series also provides a new attenuation alarming capability based on the proprietary Raytek signal attenuation measurement algorithm allowing users to adjust the alarm sensitivity level. By measuring the attenuation, the sensor can provide a notification alarm when attenuation levels exceed a user-defined setpoint limit.

The Modline 5 attenuation adjustment alarming feature operates independent from the optional dirty window detector, which will monitor the sensor window for contamination. It enables users to monitor any kind of signal attenuation caused by dirty viewports or other external windows. Attenuation alarm settings are configurable from 5 percent to 95 percent, from either the back panel of the sensing head or from the Ircon Modview program. When an alarm condition is detected, relay outputs provide notification to external process control instrumentation.

When the attenuation adjustment alarming feature is enabled, the user can monitor attenuation levels in a graphical format in the Modview program providing a historical view of the levels. In addition, attenuation levels are available through the Modline 5 RS-485 output fed into an external device.


Silicone-Free Interface Material Provides High Thermal Conductivity
MH&W International has introduced Keratherm U 90 thermal interface material for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices.

U 90 material consists of a ceramic-filled polyurethane film with thermal conductivity of 6.0 W/mK and thermal impedance of just 0.05 Kin2/W. The material has a high voltage breakdown property of 4.0 kV. It provides strong perforation protection with a tensile strength of 2.5 N/mm2 and a Shore A hardness of 70.

Typical applications for silicone-free U 90 thermal interface pads include medical devices, laser equipment, lighting systems, solar energy, disc drives and aerospace electronics.

MH&W’s Keratherm U 90 interface material is available in 0.100 mm and 0.200 mm thicknesses (3.9 mil and 7.8 mil). Standard and custom shapes are available in continuous rolls for automated or manual application. Pricing for U 90 thermal interface pads starts at $0.15 for 1 inch square, 0.200 mm thick pads in high volume quantities.


Kooltronic Releases Compact Solution for Electronic Cabinet Cooling
Kooltronic, Inc. has released the Profile Guardian DP15 Series Air Conditioner, designed to cool the interior of electronic cabinets.

Heat is the enemy of sensitive electronic components. Kooltronic can help solve this problem by cooling the enclosure using a Profile Guardian Series DP15 Air Conditioner. Benefits of cooling include extending useful component life, helping them operate at maximum efficiency and isolating them from dirt and other contaminants. Our newest addition to the Guardian family of units, the DP15 is our smallest Profile unit yet. Designed for use where mounting space is limited and measuring only 15 inches high and 8 inches wide and rated for 1,000 BTU/H, it is well suited for many types of applications where NEMA 12, 3R, 4 or 4X enclosure interface is required. Typical applications include telecommunications, kiosk, waste and water treatment and various industrial controls.

The entire Profile Series consists of air conditioners ranging in heights from 15 inches to 60 inches and capacities from 1,000 BTU/H to 26,000 BTU/H. Available in 115 VAC and 230 VAC (50 or 60 Hz), with three 480 Volt models, the Profile Series is UL/CUL Listed and uses environmentally-friendly CFC-free R134a refrigerant.

INDUSTRY NEWS

New ABB Catalog Details Temperature Instrumentation
"Temperature Catalog: Sensors, Thermowells and Transmitters," is the new 80-page catalog that covers sensors, thermowells and transmitters available from ABB Instrumentation. The calalog opens by noting that ABB offers a wide range of high quality RTD and thermocouple sensor assemblies with and without thermowells, plus a series of world class temperature transmitters. Sanitary sensors are available with and without thermowells and are built from standardized components.

The catalog divides into 11 sections, covering sensor assemblies with and without thermowells, high temperature sensors, transmitters, thermowells, connection heads and custom designs. Temperature transmitters come in head, field and rail mounts. The catalog offers detailed dimensions, schematics and ordering information for the many varieties and models available.


Thermacore to Develop Active Heat Sink Technology
Thermacore, Inc. has been awarded a $9.5 million contract, if all options are exercised, by the Defense Advanced Research Projects Agency (DARPA) for the development of Micro-technologies for Air-Cooled Exchangers (MACE). The successful development of this technology will significantly improve the thermal performance of military electronic systems such as telecommunications, active sensing and imaging, radar and other platforms. The goal of the MACE program is the development and demonstration of micro-technologies that will enable thermal performance improvements and reduce electrical consumption of air-cooled heat exchangers. The MACE program is a two-phase effort designed to run 48 months through the fourth quarter of 2013.

To support this development effort, Thermacore assembled a team of academic and industrial partners that will each bring their technology and platform experience to bear on the proposed solution. Thermacore will coordinate these efforts and attempt to move these technologies into an "applied product" to support the current and future needs of the US Military.


Alfa Laval Strengthens Presence in South Korea, Acquires Local System Builder
Alfa Laval, a company focused on heat transfer, centrifugal separation and fluid handling, has acquired Onnuri Industrial Machinery Co., Ltd., a South Korean system provider to the shipbuilding and diesel power markets.

“By acquiring Onnuri, we increase our local presence which makes us even more fit to meet demands from the important Asian shipbuilding and engine builder markets,” said Lars Renström, President and CEO of the Alfa Laval Group.


Nextreme Controls Polymerase Chain Reaction Process with Microscopic Peltier Heat Pump
Nextreme Thermal Solutions, a company focused on microscale thermal and power management products for the electronics industry, has demonstrated the application of thin-film thermoelectric devices for temperature control of the polymerase chain reaction (PCR) process used for DNA amplification. The microscopic size and millisecond response time of Nextreme's thin-film eTEC thermoelectric modules enable significantly shorter throughput times for DNA sequencing equipment. DNA replication represents one of several applications of Nextreme's product line for the test and measurement and healthcare industries.

Nextreme has successfully demonstrated short cycle time temperature control using two eTEC UPF40 thermoelectric modules that perform as microscopic heat pumps. The module uses the thermoelectric effect to heat or cool objects simply by changing the direction of current flow. A UPF40 module can pump a heat flux up to 80 W/cm2 at 25°C and is extremely thin, with a 0.650 mm profile and a small 2.5 mm by 5.1 mm footprint. Customers can expect 4.1 watts of cooling and heating from a Nextreme device with less than a 2 msec response time at the device level. In the micro-PCR application, where Nextreme was heating and cooling a plastic vial with water in it, this translated into an ability to heat the water up to 90°C in 15 seconds and cool it back down to 55°C in under 10 seconds.

PCR is a technique widely used in molecular biology to produce millions of copies of a specific DNA sequence in a short period of time. PCR-based testing is used in the diagnosis of hereditary diseases; the identification of genetic fingerprints (used in forensic sciences and paternity testing); and the detection and diagnosis of infectious diseases. The vast majority of PCR methods use thermal cycling, i.e., alternately heating and cooling of the DNA sample based on a predefined series of temperature steps.

A thermal cycler is an automated instrument specifically designed for this purpose. A typical device consists of a metal block with holes where plastic vials holding the PCR reaction mixtures are inserted. The instrument has an integrated heating/cooling unit that is used to systematically raise and lower the temperature of the block. Due to their low mass, Nextreme's thermoelectric devices are particularly well suited to achieve fast temperature changes while also achieving a uniform temperature distribution throughout the block. In addition, the microscopic size of the Nextreme eTEC enables different temperatures in different parts of the block - something that cannot be achieved with conventional technology. This is particularly useful when testing suitable annealing temperatures for primers, which are required for initiation of the DNA replication sequence.


IBM Technology Licensed by Vette Receives Patent Approval
Vette Corp., an IBM Business Partner and global provider of thermal management solutions, has announced that IBM was awarded a patent by the US Patent Office for the Cool Blue Rear Door Heat Exchanger. In 2007, Vette began working with IBM to license the chilled water Rear Door Heat Exchanger technology. Vette manufactures Rear Door Heat Exchangers to fit the IBM NetBAY42 Enterprise Rack, the IBM 42U S2 Standard Rack and for a variety of leading thirdparty equipment enclosures. In addition to manufacturing Rear Door Heat Exchangers, Vette provides turnkey datacom facility cooling solutions, installation and support services.

IBM's Rear Door Heat Exchanger is a passive, water-cooled door that mounts to the back of an IT enclosure to cool computer equipment exhaust air before it re-enters the data center operating environment. The IBM Rear Door Heat Exchanger patent includes a low impedance fin and tube heat exchanger that does not utilize fans, moving parts or electrical connections of any kind. It is designed to cool a variety of computer, storage and communications equipment loads. IBM's Rear Door Heat Exchanger is also designed to provide 100 percent sensible, noncondensing cooling by using supply water that is maintained above the data center's dew point.

Vette has worked with IBM to develop a full suite of water-cooled Rear Door Heat Exchanger solutions that address a wide variety of common data center cooling problems. Vette Rear Door Heat Exchangers are a well suited solution for existing data centers that are power and cooling capacity constrained, have space limitations or are experiencing hot spots. Vette liquid cooling solutions are non-invasive and can be deployed easily in new data center builds and within data center retrofit projects, especially where redeployment of racks and movement or shutdown of IT gear is undesirable or impossible. Vette's Rear Door Heat Exchangers are designed to integrate seamlessly with third party cooling solutions, such as perimeter computer room air-conditioning (CRAC) and in-row cooling products - delivering up to a 25 percent reduction in comparative Total Cost of Ownership (TCO). For customers with green data center initiatives, Vette Rear Door Heat Exchangers may be able to reduce cooling energy consumption by at least 50 percent compared to next-in-class products and can even be deployed using computer room air conditioning return water or cooling tower return water.


Share Your Knowledge about the Industry in Web-Broadcasted Seminars
THERMAL News now offers relevant, insightful Web-based discussions on the latest technical advancements, best practices, products and services, as well as training courses and mini-bootcamps for the industries we serve.

What are the advantages to attendees? Attend technical presentations and training sessions and stay up to date with the latest industry best practices, as well as network with business colleagues without leaving your office.

For vendors, market analysts and consultants, with the new webinar capability, you will be able to produce your own webinar. You will have the ability to reach and engage targeted attendees from organizations worldwide. Our extensive range of industry publications and databases enable us to market to your defined audience.

For more information on hosting a Webinar, please contact Joanna Larez at 720-528-3770 ext 126 or via e-mail or Jeremy Fleming at 720-528-3770 ext 121 or via e-mail.

EVENT LISTING
Upcoming Webinars presented by Thermal News

Thermal Management of Electronic/Telecommunications Systems and Components
March 11, 2009
10-11 a.m. Mountain Standard Time
Presented by Maurice J. Marongiu, Owner MJM Engineering Co.

This webinar will provide an understanding of the issues involved in the thermal management of electronic and telecommunication systems. Attendees will learn about the principles and the tools available to the design engineer. This course is designed to help engineers and technicians with some thermal background (but new to the electronics, telecommunications field) understand the thermal challenges and demands of the electronics fields. Experienced engineers will also find the course very instructive and useful. Attendees will have a good understanding of the heat transfer and fluid mechanics principles affecting proper thermal management of electric, electronic, and telecommunications systems and components. They will also develop techniques that will be effective in the dissipation of heat generated in these systems. Attendees will develop skills in the proper evaluation and selection of design tools such as CFD software and of thermal dissipating equipment such as heat sinks, heat pipes, PCMs, heat exchangers.

Click here to learn more about this and other webinars presented by Thermal News.
Click here to register today!

JOB LISTING
Upcoming Industry Events - Click here to view full Calendar

January
24-29 Photonics West, San Jose, Calif.
26-28 AHR Expo, Chicago, Ill.

February
9-12 MDM West, Anaheim, Calif.
15-19 APEC, Washington, D.C.
19 Semiconductor Packaging – Impacting the Age of Consumer Electronics, San Jose, Calif.
24-25 Data Center World, London


2009 IPC APEX EXPO
3/29 - 4/2
Las Vegas, NV

It's Your Show!

2009 IPC APEX EXPO™ — the world’s premier technical conference and exhibition for printed boards, design and electronics manufacturing and test held in exciting Las Vegas!

More than 150 technical conference papers and professional development workshops are designed keep you on top of emerging developments, technologies and research impacting our industry.

More than 80 standards development committee meetings make it possible for you to participate in the development of the standards that influence all aspects of printed boards and electronics assembly and manufacturing.

The world’s top suppliers to our industry will showcase the latest equipment, chemicals, materials, software and services.

Join your colleagues and an international audience of more than 13,000 for education, valuable networking, and critical industry standards development.

Learn more at www.IPCAPEXEXPO.org

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