New Kalrez 8900 Parts to Help Increase Uptime and Improve Wafer Yields in Semiconductor Thermal Processes
DuPont Performance Elastomers will introduce Kalrez 8900 perfluoroelastomer parts specifically designed for semiconductor thermal processes. Kalrez 8900 parts demonstrate longer seal life in higher temperature semiconductor manufacturing processes and help cut costly downtime and reduce cost of ownership.
Kalrez 8900 parts are for static and dynamic sealing applications in thermal processes such as oxidation, diffusion furnace, metal CVD, ALD and LPCVD. A combination of properties effectively extends seal life, produces higher quality devices and greater yields. Kalrez 8900 parts have thermal stability with maximum continuous service temperature of 325°C, low outgassing properties and excellent response to temperature cycling effects.
Kalrez 8900 parts have been tested in a variety of demanding semiconductor process applications where temperatures routinely rise to above 300°C. Suggested applications include quartz tube seals, plenum seals, chamber seals and center ring seals.
DuPont Performance Elastomers also has integrated manufacturing back to the polymer, enhancing quality control and product development. Kalrez parts are manufactured in ISO 9000 registered facilities and are available in a wide variety of finished products from conventional seal shapes and bonded door seals to custom geometrics. Kalrez perfluorelastomer parts are specially cleaned and double packaged in Class 100 workstations to significantly reduce the potential for contamination. Each item is individually packaged in a bar-coded bag for full traceability and is available as O-rings, sheets and custom parts.
Jaro Thermal Releases New Neon-Sink 
Jaro Thermal's new 52 mm by 52 mm by 12 mm Neon fan/heatsink combination is both high performing and low profile. Because of a unique, synergistic marriage of fan to open fin heat sink, the Neon series dissipates 0.275 watts / degrees C. This results in an exceptional level of thermal resistance.
The Neon series is designed for semiconductor applications, including FPGA, XPGA, VGA and most other low profile applications. The life expectancy is 50,000 hours of life at 25°C. Options include alarm output, tachometer output, thermistor control or the user’s choice of a pre-applied connector. Standardized mounting holes and pre-applied spring-loaded fasteners allow for quick application.
Lord Corp. Develops Thermally-Conductive Flip Chip Underfill Technology
Lord Corp., supplier of thermal management materials, adhesives, coatings and encapsulants to the electronics industry, has developed a thermally-conductive flip chip underfill that offers an improved thermal path for heat reduction.
Even though a typical thermal solution for a flip chip package uses thermal interface materials to drive the heat to the heat sink, some of today’s complicated flip chip packaging constraints do not allow for dissipating the heat through the back side of the die. In response to this scenario, Lord Corp. ME-542, a specifically formulated material designed to achieve high reliability for in-package or chip-on-board applications, was developed to increase thermal dissipation from the die into the substrate. With high copper content in the substrate, driving the dissipation of heat into this layer is a very effective alternative to relying on heat dissipation solely through the solder joints to the substrate metallization.
Lord Corp. research & development used the latest in Finite Element Analysis (FEA) to accelerate the development of new products such as ME-542. Using FEA modeling of the package properties allows better understanding of how a product will perform before the final package is constructed. Unlike competing thermally conductive materials, ME-542 is jettable with minimal wear to the jet nozzle and it offers a fast flow without voiding under large die.
Jim Greig, Lord Corp. Electronics market manager, said that in order to ensure reliable performance, an underfill encapsulant is needed to eliminate the failures caused by stress generated during flip chip operating cycles. Since the underfills need to be easy to apply, they must offer rapid and fault-free flow into the decreasing gap sizes and through the densely populated interconnect arrays under today’s flip chip ICs, he said.
Lord ME-542 has a thermal conductivity of 0.8 W/mK, a 500 percent increase over standard underfill products. The new underfill material is engineered to quickly flow into gaps less than 25 microns with minimal filler settling and no voiding, encapsulating the fully populated interconnect arrays with a reliable layer of protective polymer.
AKCP Launches Daisy-Chainable Temperature Sensor
AKCP, Inc., manufacturer of SNMP-based devices for environmental and security monitoring solutions has released the daisyTemp. The AKCP daisyTemp is a daisy-chainable temperature sensor solution designed for efficient temperature monitoring.
Up to eight daisyTemp sensors can be stringed together and plugged into one securityProbe Intelligent Sensor port enabling the unit to measure up to a maximum of 64 temperature points. The daisyTemp can measure temperatures between -55°C to 75°C with a ±0.5°C accuracy.
Collected temperature values can be used to trigger alerts like e-mail, SMS, phone calls and SNMP traps. With the securityProbe unique mapping feature you can place these sensors on a map so you can quickly identify where you may have hotspots. Each temperature sensor has its own SNMP OID so that the data can be collected over the network using any Network Management System.
Each daisyTemp comes with a free five-foot sensor cable. The sensor cables can be extended using Ethernet cable with a maximum total daisy-chain length of 500 feet.
Tellurex Corp. Releases New Thermoelectric Dual Cupholder in the 2009 Cadillac Escalade Platinum
The Tellurex cup holder that cools and heats beverages is now in GM’s 2009 Cadillac Escalade Platinum models. By touching a switch, the Tellurex cup holder can either heat or cool beverages.
Tellurex Corp.’s new dual cup holder can be independently-controlled by the driver or passenger, and one cupholder can be heating while the other is cooling. LED-lighted switches indicate which mode each cup holder is in, red for heat, blue for cooling and white when the car ignition is on but the cupholders are not. The entire unit drops right into the center console from above.
Powered by the Tellurex’s Z-Max thermoelectric module and sub-assembly, the unit chills beverages to 40°F below the interior temperature of the car. In the heating mode, it keeps coffee, tea or other liquids at a maximum limit of 140°F.
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