July 2008

Tempil Introduces Electronic Temperature Indicator

Tempil has introduced an electronic contact temperature indicator that provides an instantaneous digital readout of surface temperature at the point of contact.  It is not necessary to know the emissivity of the surface material to obtain an accurate reading. 

Developed for critical temperature measurement applications, the patented E-Stik design combines the latest in micro, thermocouple technology with a bold digital readout to instantly display the surface temperature with an accuracy of +/- 1 percent. This new Tempil E-Stik technology provides high accuracy and consistency of surface temperature measurement of ridged, polished or non-polished surfaces.

Designed to easily fit into a pocket, the Tempil E-Stik is quick. Aactivate the I/O switch on the side of the E-Stik and touch the contacts to a work surface. The temperature is instantly displayed on the easy to read digital display located on the top of the unit.  Multiple measurements are made by moving the contact point to another area and the new temperature is displayed.

The E-Stik is constructed of durable thermal plastics with an integrated safety shield that slides over the thermocouples when the unit is not in use.

Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent

C-MAC MicroTechnology used Flomerics’ Flotherm thermal simulation software to determine that the thermal requirements of a stacked module could be met with a potting compound that cost only half the amount of the default choice. “Our engineer simulated the junction temperatures of the devices in the stacked modules while using three different potting compounds,” said Bob Hunt, head of Engineering for C-MAC. “Simulation was much faster and less expensive than the alternative of building and testing prototypes.”

C-MAC, an electronics design and manufacturing company based the United Kingdom, recently developed a stacked module for a critical defense application. Prior to building prototypes, C-MAC engineers performed thermal simulation on the initial concept design and discovered that junction temperatures on the module ranged up to 125oC, well above the 100oC maximum. They realized they needed a potting compound to reduce thermal resistance and wanted to select the least expensive formulation that would meet the thermal requirements of the application.

“Without simulation we would have been faced with two unattractive alternatives,” said C-MAC senior engineer Jonathan Crossley. “We could have undertaken a much lengthier and more expensive physical testing process to identify the potting compound that provided the best mix of performance and price. Or, we could have foregone this process and used the best potting compound because we were fairly confident that it would have delivered acceptable thermal performance.”

Instead, Crossley performed thermal simulation on the initial design using Flotherm software. “We use Flotherm because it provides many built-in functions that reduce the time required to module complex stacked module designs,” Crossley said. “The most important of these is the Flopack Web-based wizard, which quickly produces accurate models of integrated circuits and other components.”

Crossley used the Flomerics Flopack Web-based wizard to generate models of each of the components. “Using the Flopack wizard all I had to do was enter basic design parameters such as the die size, die flag size and lead frame clearance. Flopack generated models of the components that were almost complete. I was able to create a thermal model for this stacked module with Flopack in a 10th of the time that would have been required using conventional modeling methods.”

Crossley ran thermal simulations of the stacked module with three different potting compounds which are referred to here as: standard, enhanced and best. “Simulation demonstrated that both the enhanced and best potting compounds brought the core temperature down to acceptable levels with ample safety margin on the die junction temperatures,” Hunt said. “So we were able to specify the enhanced potting compound at a cost of about half of the best potting compound. Thermal simulation helped us engineer an optimized solution while minimizing our engineering costs and leadtime.”

KNF Specialized Diaphragm Pumps for Hot Gases Prevent Condensation and Contamination

KNF specialized diaphragm pumps for transferring hot gases to analyzers have been designed to maintain specified gas temperatures without cooling to prevent condensation and potentially faulty results. Oil-free operation and inert wetted materials additionally contribute to reliable sampling and accurate analysis by eliminating any risk of gas contamination.

The complete product range includes temperature-resistant and heated-head types well suited for environmental emissions sampling and analytical instrumentation applications, among others. Custom designs can be developed to satisfy particular application requirements.

Heat-resistant models can resist temperatures up to 240ºC (or 460ºF) without heating and heated-head types (for gas temperatures up to 240ºC) can be equipped either with thermostatic temperature control or programmable electronic temperature control. Flows up to 3.5 SCFM and vacuums of 24 in. Hg. (or deeper) can be achieved, depending on model. All pumps are energy-efficient and easy to operate.

Optimized construction incorporates 316 stainless steel to resist corrosive gases, PTFE to withstand potential melting from extremely hot gases and isolation of bearings and motor to protect against overheating. Improved insulation engineering promotes consistent temperature control, power efficiency, minimized heat loss and worker safety.

Pumps with electronic temperature control offer added capabilities to operate remotely (via computer hookup and supplied Windows software) and generate timely reports and logs.

New Zeotherm 110-70B Provides Noise and Vibration Dampening in a Cost-Effective, 150°C-Capable Thermoplastic Elastomer 

Automotive and industrial Design Engineers have a new option with the commercialization of Zeotherm 110-70B, the latest in ZEON’s extensive line-up of 150°C-capable thermoplastic elastomers.

Well suited for injection molded applications requiring noise and vibration dampening as well as 150°C heat and oil resistance, Zeotherm 110-70B is a cost-effective choice for cuffs on automotive air ducts, vibration mounts, fasteners, industrial grips, body and pass-thru plugs and close-out seals.

With cost a key issue for design engineers and purchasing managers, Zeotherm 110-70B has been designed to achieve a lower cost than other 100-series grades in ZEON’s line of Zeotherm TPEs. ZEON’s analysis of typical parts shows that Zeotherm 110-70B enables a significant reduction in part cost when compared to AEM thermoset rubber. 

Capable of continuous heat exposure to 140°C and excursions to 150°C, Zeotherm 110-70B offers resistance to automotive oils and greases such as engine, transmission and lubricating greases. In addition, the new TPE can be welded (hot-plate, spin) or overmolded directly to polyamides.

Compared to conventional thermoplastic elastomers including those that are EPDM-, polypropylene- or copolyesters, the new Zeotherm 110-70B offers superior heat and oil resistance as well as superior adhesion to polyamides while retaining flexibility.

For applications requiring continuous exposure to 150°C and above, ZEON recommends its Zeotherm 100-series and 131-series grades, which provide improved oil resistance and sealing performance, as well as withstanding repeated exposure to temperatures up to 175°C.

Multi-Language Web Site for Precision Induction Heating Solutions
The Ambrell group of companies launched a new multi-language Web site for precision induction heating solutions. The new site, www.ambrell.com, features innovative products, application white papers, solutions, videos and news. From the home page visitors choose content in English, French, Spanish, Italian German or Dutch.

“Ambrell resources located throughout the world conduct business in the local languages of our customer base on a daily basis. This new Web site reinforces this capability and provides the best possible interaction from the moment we are found on the Internet,” states Vernon Perkins, director of Business Development.

The Ambrell group of companies manufactures induction heating systems for manufacturing and research applications. Induction heating provides a quick, clean and efficient source of heat without loud noises, harmful emissions or gaseous exhaust. Ambrell provides complimentary feasibility testing and system recommendation through its worldwide application laboratories.

Agilent Technologies Acquires RVM Scientific

Agilent Technologies, Inc. has completed the acquisition of RVM Scientific, Inc., a manufacturer of rapid, direct heating/cooling systems for gas chromatography (GC) capillary columns. Financial details were not disclosed.

RVM Scientific’s patented technology expands Agilent’s portfolio of GC platform solutions and continues to position Agilent as the premier workflow solutions partner to research, testing and quality-control labs. The technology interweaves heating and temperature sensing components wound directly around a capillary column for rapid and efficient heating/cooling. This technology greatly reduces GC and GC/MS analytical cycle times, addressing customers’ demand for greater productivity, lower power consumption and a reduced footprint.

Data Loggers Aid Indoor Air Quality Research in Test Homes Across the US

Relative humidity levels are often ignored in homes despite the fact that unsuitable levels can be unhealthy, increase heating and cooling costs, damage building components and affect comfort levels.

Research has shown that high-relative humidity levels also support the growth of dust mites, molds and bugs that can lead to increased allergy symptoms and reduce indoor air quality (IAQ). However, little to no measured data is available on actual indoor humidity levels in homes across the US.

Concerned about the impact that relative humidity has on a building’s performance, the US Department of Housing and Urban Development paired up with Steven Winter Associates, Inc. (SWA), an architectural and engineering research and consulting firm, to gather temperature and humidity data in more than 50 homes across the country.

Three different regions are being targeted for the study – the warm, humid southeast, the cold northeast and the Pacific Northwest. To complete the study, household characteristic data will also be collected during the initial site-visit to the home, including occupancy levels, insulation levels, equipment efficiencies, envelope leakage and duct leakage.

To monitor temperature and humidity levels, SWA engineers selected HOBO U12 data loggers from Onset Computer Corp.

The battery-powered devices will measure and record humidity levels around-the clock – even during power outages – and accompanying HOBOware Pro software will convert the data into time-stamped graphs that can be displayed on a PC or Mac.

The data collected from this study will support efforts already underway by the ASHRAE Standard Committee 160P on “Design Criteria for Preventing Moisture Damage in Buildings” and others to develop moisture modeling tools and related technical standards. These models and standards will help improve a home’s performance by minimizing conditions associated with high moisture levels. Test homes for this study are currently being identified, and most initial site visits and data logger installations should be complete by the beginning of this summer.

Thermal Management & Technology Symposium 2008
Sept. 25-26
Hyatt Regency Austin in Austin, Texas

Thermal Management and Technology Symposium 2008 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held September 25-26 in Austin, Texas.

This event will feature presentations on thermal manufacturing technology, materials and R&D. Topics will include new thermal technology as well as the latest market trends affecting the industry. The conference is designed for design engineers, system engineers, process engineers, material scientists and R&D managers with organizations in a variety of industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

If you are involved in electronics, semiconductor, manufacturing, process industries, food, healthcare, R&D or temperature control industries, this is a must attend event.

Register by August 1st and Save $300. Click Here to register today!

August
12-14 Optics & Photonics 2008, San Diego
10-14 2008 ASME Summer Heat Transfer Conference, Jacksonville, Fla.
17-21 SMTAI 2008, Orlando, Fla.

SEMICON West 2008
July 15-17
San Francisco, Calif.

SEMICON West 2008–Infinite Innovations, Infinite Ideas SEMICON West is the place to see the companies, technologies, and people driving the future of micro design and manufacturing. No other event this year has more new products, more new technologies, and more solutions than SEMICON West.
From the latest developments in cutting-edge materials, to the systems and technologies driving semiconductor designs to the limits of Moore's Law, you'll find everything and everyone in the industry at SEMICON West.

Registration is now open! Plan now to participate and get ready to discover the infinite opportunities shaping the design and manufacture of semiconductors, MEMS, photovoltaics, flexible electronics, and more!

For more information, visit www.semiconwest.org.

SMTA International
August 17-21, 2008
Orlando, Florida

What’s New at SMTA International?
 
In addition to 130 exhibitors in the Technology Showcase and another outstanding technical conference, SMTAI, August 17-21 in Orlando, Florida…….What’s NEW in 2008?????.
 
An Alternative Energy Symposium will focus on Fuel and Solar Cells as they enter high volume manufacturing.  This symposium includes a keynote lunch address by Prismark Partners on Photovoltaics The Next Great Electronics Market.
 
Counterfeit electronics are becoming a huge issue in our industry.  Join us for the Opening Ceremony and get the latest information.
 
Our Harsh Environments Workshop is co-located with SMTAI and features a keynote by Harris Corporation on Design Challenges for Harsh Environment Military Applications.
 
The SMTA Annual Meeting speaker will be Dr. Sharon Nunes , Vice President of IBM addressing Big Green Innovations.  Learn how information technology addresses environmental concerns around the world.
 
It’s happening.  Come. Focus.  SMTA International.

Click Here for more info

Design Engineering Show and Conference at National Manufacturing Week
September 23-25, 2008
Rosemont, IL

Few investments in time deliver the return you’ll receive by attending Design Engineering at National Manufacturing Week.  Design Engineering is the only event that connects you with the systems, products, and solutions for the entire manufacturing enterprise. Meet knowledgeable suppliers and find the fresh ideas and new technologies you need to remain competitive in today’s global marketplace. Register online today for complimentary expo hall admission and your visitor badge includes access to nine industry-related shows taking place under one roof. Innovation in advanced design and manufacturing starts here!
 www.ManufacturingWeek.com

PRiME 2008
October 12-17, 2008
Honolulu, Hawaii

Joint international meeting: 214th Meeting of ECS — The Electrochemical Society
2008 Fall Meeting of The Electrochemical Society of Japan
and with the technical co-sponsorship of the Japan Society of Applied Physics, the Korean Electrochemical Society, the Electrochemistry Division of the Royal Australian Chemical Institute, and the Chinese Society of Electrochemistry.

To learn more and to register visit:  www.electrochem.org/meetings/biannual/curr_mtg.htm.

AVS 55th International Symposium and Exhibition
October 19-24, 2008
Boston, Massachusetts

The AVS 55th International Symposium and Exhibition, October 19-24, in Boston, Massachusetts will feature technical sessions and an exhibition with scientific instrumentation, components, accessories, tools and services. This program includes applications and products in fields such as surface analysis and engineering; biomaterials; MEMS/NEMS; nanotechnology; plasma science; thin film; vacuum technology; and electronic materials and processing. Exhibit attendance is free. For more information, visit http://www2.avs.org/symposium  

IMAPS 2008
41st International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
November 2-6, 2008
Rhode Island Convention Center - Providence, Rhode Island, USA

The 41st International Symposium on Microelectronics will be held at the Rhode Island Convention Center, Providence, Rhode Island – USA and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Sessions are tentatively planned to highlight the major contributions of the work in each these four areas of concentration.

http://www.imaps.org/imaps2008/index.htm

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