February 2008

Warner Instruments’ New Thermal Cooling Module Includes Quiet Features

Warner Instruments has introduced the NEW TCM-1 Thermal Cooling Module. The complete, self contained heat exchanger, the TCM-1 is designed to circulate water through a fan/radiator housing that easily and quietly removes excess heat from all Warner’s Peltier driven devices as well as any other apparatus.

The TCM-1 is a versatile and simple to use Thermal Cooling Module that features a pump rate of 180 L/hr (47.6 gal/hr). It is mechanically and electrically quiet and comes with a one-year warranty.
Warner Instruments is a designer and manufacturer of biomedical devices for the electrophysiological, cellular and neurological sciences.

The R300 Series uses resistance temperature detector (RTD) technology and features a robust, stainless steel closed-tip design to enhance reliability in aggressive environments. It provides an excellent response time as demonstrated by validation testing required by the transportation industry. The R300 also features an integral connector.

The R300 Series Temperature Sensor expands Honeywell’s existing temperature probe product portfolio designed for the transportation industry, namely the ES110-, ES115- and ES120-Series. The R300 Series is designed for potential use in heavy duty vehicle engine (oil, coolant, fuel and air inlet temperature sensing) applications.

New Temperature/Humidity Monitoring Tools for Engineers

Engineers tracking temperature or humidity conditions can now have both real-time data and the ability to download data for further analysis with the redesigned Dickson Graph-at-a-Glance Flat Panel Temperature and Humidity Data Loggers. The Graph-at-a-Glance data loggers are paperless chart recorders that provide a digital graph enabling engineers to immediately visualize environmental trends.

Features of the redesigned Graph-at-a Glance data loggers include:

• 36 percent greater data resolution in a Jumbo 4.5” by 3.4” (114.3 mm by 86.36 mm) display screen.
• Up to 37 percent price reduction
• Flash memory card data transfer capability
• USB-enabled triple speed downloading
• User-defined display settings
• 32 KB storage
• Audio/Visual Alarms

Dickson’s graph-at-a-glance flat panel data logger models include: FT300 and FT325 for temperature only; and FH 320 and FH325 for temperature and humidity.

New Cost Effective, Space Saving, Dual Zone Temperature Controller for Runnerless Molding Applications

Laird Technologies, Inc. Acquires Ezurio, Ltd.

Laird Technologies, Inc., a designer and supplier of critical components and systems for advanced electronics and wireless products, has announced its acquisition of Ezurio, Ltd., a privately-held company and leading supplier of short range wireless M2M (Machine-to-Machine) solutions. Ezurio’s sales revenues in the 12 months ending Dec. 31, 2007, were approximately $8 million, an increase of 24 percent more than the same period in 2006.

Ezurio is a supplier of Bluetooth and 802.11 (WiFi) embedded RF modules, as well as M2M solutions for wireless data communication applications serving the retail, automotive, healthcare and other market segments including EPOS (Electronic Point of Sale). RF modules allow customers to incorporate wireless data communications solutions into their products.

Amtech Systems, Inc., a supplier of production and automation systems and related supplies for the manufacture of solar cells, semiconductors and silicon wafers, has announced that its subsidiary, Tempress Systems, Inc., has received an additional $4.3 million in orders for diffusion processing systems from the solar cell industry.

These new orders consist of two new German customers and a follow-on order from an existing customer basedin the Asia-Pacific market. Amtech expects the $4.3 million in orders to ship in fiscal 2008, which began Oct. 1, 2007. Since Oct. 1, 2007, Amtech has received solar orders totaling approximately $33 million.

Skyworks Solutions, Inc., an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity, has expanded its position in (GPRS) front-end modules (FEMs) through strategic engagements with leading system on chip (SoC) providers. To date, Skyworks has shipped more than 750 million GPRS power amplifiers (PAs) and FEMs, supporting the increasing demand for entry-level handsets in emerging markets.

Part of Skyworks’ InteraLite portfolio of solutions, the low cost and small-form factor FEMs are now in volume production with several leading SOC providers including Infineon, MediaTek, Texas Instruments and NXP Semiconductors.

Integrating a PA, PA controller and a switch, the FEMs leverage the company’s manufacturing techniques to reduce the radio frequency (RF) footprint and overall bill-of-materials, two key challenges original equipment manufacturers (OEMs) face when designing low-cost phones. In emerging markets, both consumers and operators require handsets that are inexpensive, yet meet or exceed specific requirements for size, quality and reliability. Given its high-power efficiency, these solutions also maintain overall thermal performance and improve battery life.

The InteraLite Portfolio is led by three key devices. The SKY77318 module is designed for quad-band cellular GSM850/900, DCS1800 and PCS1900 handset applications, while the SKY77518 is a Tx-Rx FEM with integrated PA control (iPAC) for dual-band cellular handsets comprising GSM900 and DCS1900 operation. Both solutions support GPRS multi-slot operation. The SKY77531, now in volume production, is a high-power efficiency Tx-Rx quad-band FEM with iPAC that contains a quad-band gallium arsenide (GaAs) heterojunction bipolar (HBT) PA, a 1P6T switch to enable flexible phone layout, and an integrated complementary metal-oxide semiconductor (CMOS)-based controller to manage the PA and switch.

The Thermal Management & Technology Symposium 2008 committee is currently accepting abstracts. Being held September 26 in Austin, Texas, this premiere event will explore the latest advancements in thermal technology for product design, system development and process management. The deadline for submitting an abstract is April 4, 2008.

Attendees will include, design engineers, system engineers, process engineers, material scientists and R&D managers.

Here are some of the topics we are looking for:

• Market Trends
  
• Next-Generation Thermal Technology
  
• Thermal Management & Integration
  
• Advancements in Heat Transfer Technology
  
• Thermal Materials
  
• Temperature Products

Full-conference registration fees will be waived for all confirmed speakers.

May 14, 2008 (1 p.m. to 5 p.m.) - Beverages and Course Materials Provided

The workshop will start with an overview of the various types of intellectual property, including patents, trademark, copyrights, trade secrets, non-competes and publishing. It will feature a detailed discussion of patents, including type of patents, what is patentable, patent laws and rules, the patenting process and patent strategy. Also covered will be the integration of the patenting process with the new product development process and discussion of critical patent strategy issues. It will conclude with a practical training session for writing technical disclosures for patenting purposes.

For more details about what attendees can expect to learn from this workshop visit http://www.magneticsmagazine.com/mag_conf08_workshops.htm#akc.

• Register before March 14, 2008 - $395

• Register after March 14, 2008 - $495

Register Now!

Visit http://www.magneticsmagazine.com/mag_conf08_workshop_reg.php/.

Thermal Management & Technology Symposium 2008
Sept. 26
Austin, Texas

Webcom Communications is pleased to announce Thermal Management and Technology Symposium 2008, an inaugural annual event organized by THERMAL News Magazine. The one-day conference, on Sept. 26th at the Hyatt Regency Austin, will highlight the latest advancements in thermal technology for product design, system development and process management. Workshops and boot camps will be held Sept. 25th. If you are involved in electronics, semiconductor, manufacturing, process industries, food, healthcare, R&D or temperature control industries, this is a must attend event.

http://www.thermalnews.com/TN08_index.php

Our Industry’s Own Event — The world’s premier technical conference and exhibition for printed circuit boards, design and electronics manufacturing and test, IPC Printed Circuits Expo®, APEX® and Designers Summit is moving to Las Vegas in 2008.

More than 150 technical conference sessions and professional development workshops are designed keep you on top of emerging developments, technologies and research impacting our industry.

More than 80 standards development committee meetings will be held to provide discourse on standards influencing all aspects of printed boards and electronics assembly and manufacturing.

The world’s top suppliers to our industry will showcase the latest equipment, chemicals, materials, software and services.

Join your colleagues and an international audience of more than 13,000 for education, valuable networking, and critical industry standards development.  

For more information, visit www.GoIPCShows.org

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