Themal News Magazine

   
       eNewsletter

November 2007

In This Issue:

Product News

  • Horizontal Conveyorized Gas-Fired and Electrically Heated Drying and Curing Systems Feature Improvements
  • Heating Block Performance and Utility Compared in New Technical Bulletin
  • CPI’s N-Series TeraFrame Network Cabinet Ss Preserving Network Infrastructure Survival
  • Advanced Copper-and-Brass Heat Exchangers Well Suited for Clean Diesel Passenger Vehicles
  • Nuventix Introduces Two New Cooling Modules for LED Thermal Management
  • New Thermal Interface Sleeves for Semiconductor Packages and Thermistors

Industry News

  • Laird Technologies Relocates Corporate Headquarters
  • Nextreme Expands Manufacturing Capacity to Meet Flip Chip Demand
  • RIMA Elects New Board for 2008-2009

Event Listing

  • Materials Research Society Fall Meeting on Nov. 26.-30 in Boston, Mass.

Job Posting

  • Find your dream job at CareerBuilder.com

Advertisers

 
Sponsored Announcement - Click here to have your company's message featured!
Heat-Spring Offers Outstanding Thermal Connectivity

Indium Corporation’s Heat-Spring Thermal Interface Material (TIM). Heat-Spring, with its patent-pending compressible interface design, provides optimized surface contact, improved thermal conductivity, and enhanced heat flow.
 
Heat-Spring has a bulk thermal conductivity of 86W/mK, superior to standard thermal interface materials. As a soft metal alloy thermal interface material (SMA-TIM), Heat-Spring offers uniform thermal resistance at lower applied stresses when used in compressed interfaces.
 
The Heat-Spring offers significant advantages over thermal grease in that the Heat-Spring will not bake-out or pump out. In addition, it leaves no residue and is reworkable.  SMA-TIM products are used for hand placement and are also available in tape & reel packaging for automated placement.
 
Indium Corporation is a four-time Frost & Sullivan Award-winning supplier of electronics assembly and semiconductor packaging materials, including solder pastes, solder preforms, fluxes, Pb-Free solder alloys, underfill materials, die-attach materials, and more. The company is also the world’s premiere supplier of commercial grade and high-purity indium.  Factories are located in the USA, the United Kingdom, Singapore, and China. Founded in 1934, the company is ISO 9001 registered.
 
PRODUCT NEWS

Horizontal Conveyorized Gas-Fired and Electrically Heated Drying and Curing Systems Feature Improvements

David Weisman, L.L.C. has introduced its latest Horizontal Conveyorized Gas Fired and Electrically Heated Hot Air Convection Drying and Curing Systems design for customers to dry water off of and/or cure liquid and powder coatings on a wide range of products processed horizontally. The system features great temperature uniformity utilizing bottom up, horizontal or top down air flow and controls, an air recirculation and exhaust system, and a complete energy efficient insulated oven enclosure. The system can be used as a stand-alone complete horizontal conveyorized drying or cure oven system or in conjunction with coating application equipment and incoming and outgoing conveyors. 


Heating Block Performance and Utility Compared in New Technical Bulletin

Brinkmann Instruments, Inc., has announced a new Technical Bulletin that describes a series of controlled heating tests comparing the heat-up times and energy consumption of its Radleys Heat-On heating blocks with another leading brand.

Today, scientists are increasingly turning to specially designed aluminum blocks located on stirring hotplates as a safer, cleaner and faster way of heating standard round-bottomed flasks (10 to 5,000 ml). The new Technical Bulletin, TDS02S, demonstrates that not all heating block designs are the same.

In the energy consumption test, comparative experimental data is provided demonstrating that Heat-On uses up to 30 percent less energy to heat up a stirred solution to 100ºC. To compare heat-up performance, comparative tests were performed in 100 ml, 500 ml and 2,000 ml blocks.  Experimental data is provided that demonstrates Heat-On heats up to 66 percent faster than the other heating block design.

The report concludes that the lower thermal mass of the Heat-On produces significantly faster heat-up times and faster post-synthesis cool down times. In addition, the Heat-On proprietary well design, which eliminates sticking and cracking of flasks associated with other heating block designs, maximizes the heated surface area further contributing to improved heat-up times. Because of these thermal features Heat-On is more efficient, using less energy to achieve the same results, saving money and reducing the environmental impact.


CPI’s N-Series TeraFrame Network Cabinet Ss Preserving Network Infrastructure Survival

Chatsworth Products, Inc. (CPI), a manufacturer that provides structural support to organize, store and secure IT infrastructure equipment, has released the N-Series TeraFrame Network Cabinet to overcome thermal challenges associated with network switches with side-to-side airflow.

When deploying switches with side-to-side airflow, the N-Series TeraFrame can be equipped with CPI’s Network Switch Exhaust Duct. The exhaust duct removes hot air by isolating and re-directing it out the back of the cabinet and into the hot aisle, minimizing hot air re-circulation and essentially converting side-to-side airflow into a front-to-rear airflow pattern. By running the entire height of the cabinet, one Network Switch Exhaust Duct can support exhaust from up to three network switches and provides freedom to organize and move equipment as needed. Serving as a complete and cost-effective solution for high-density applications, this passive cooling solution allows customers to maximize energy efficiency by including no active components to increase maintenance cost and compromise redundancy, while decreasing total cost of ownership.

The N-Series TeraFrame features advanced cable management solutions that simplify installation and maintenance while providing maximum cable management capacity. The cabinet is designed to accept cables through openings located on the top and bottom of the cabinet, while special T-shaped cable guides and cable management spools align with each RMU, precisely dividing and organizing cables as they enter and exit the rack-mount space. With the ability to manage 48 Cat 6a UTP cables per RMU, the N-Series TeraFrame supplies abundant cabling opportunities.

In order to route and manage large quantities of cable, the N-Series TeraFrame contains Standoff Brackets that support offset doors and side panels, thereby creating added space between the cabinet frame, side panels and doors. Cabinet doors and side panels are easy to remove and provide full access to equipment and cabling, while the ability to route cables around the frame instead of through it offers a simple way to trace cables during moves, add and changes.


Advanced Copper-and-Brass Heat Exchangers Well Suited for Clean Diesel Passenger Vehicles

The availability of new fuels and new exhaust treatment systems has ignited interest in diesel engines for passenger vehicles, SUV and light trucks. According to the International Copper Association, durability and high cooling efficiency make CuproBraze heat exchangers especially well suited to these new small “clean diesel” engine applications.

Diesel engines have long been recognized for their superior fuel efficiency compared to spark ignition engines. Now that ultra-low emission diesel engines have been developed and ultra low-sulfur diesel fuel is widely available, diesel engines will be used in a growing number of vehicle classes.

Cooling systems for new diesel engines must operate at elevated temperatures and pressures. CuproBraze heat exchangers, which are made of brazed copper-and-brass, offer more design options, because copper and brass can withstand higher temperatures than aluminum, and cooling efficiency is greater for copper-and-brass heat exchangers.
Clean diesel engines are available now to meet current international emission requirements, and manufacturers are already considering the modifications that must be made to meet the next generation of standards.


Nuventix Introduces Two New Cooling Modules for LED Thermal Management

Nuventix has released two new LED cooling modules. These two products, utilizing Nuventix’s SynJet technology, provide high reliability, low audible noise and low power consumption cooling technology for two industry standard lighting configurations. Using the SynJet approach allows twice the light output compared to passive LED thermal management designs.
 
The MR-16 SynJet cooling module was developed by Nuventix for cooling 15 W heat source in an LED lighting application. The cooler is designed to fit the form factor of an MR-16 bulb and provides 300,000 hours L10 life at 60°C.

The PAR-38 is also a SynJet cooling module developed by Nuventix for active cooling of an LED PAR-38 light source. It can be integrated with a wide array of electronic and optical solutions in the PAR-38 form factor. The module cools 35 to 50 watts, provides 300,000 hours L10 life at 60°C and meets PAR-38 form factor while providing near silent acoustics.

“Finally the LED Industry has a cooling technology that is perfectly suited for LED illumination,” said Jim Balthazar, president and CEO, Nuventix. “General lighting LED solutions today are limited by the amount of heat that can be cooled. SynJet technology will allow the LED industry to double its light output in general lighting today, without compromising power efficiency and reliability.”


New Thermal Interface Sleeves for Semiconductor Packages and Thermistors

Fujipoly America has introduced a stock series of 14 sleeve-shaped thermal interface extrusions for semiconductor packages and thermistors. The efficient thermal transfer sleeves are available in three Sarcon formulations and will fit TO-220, TO-3PF and TO-3PL type transistors as well as similar shaped electronic components. In addition to its shape, users can also select from multiple sleeve lengths, inside diameters and material thickness options to best accommodate application requirements.

The flexible sleeves easily slide over and conform to most standard size transistors and electronic components. The snug fit and inherent performance characteristics of the specially-formulated silicone material, allows efficient transfer of unwanted heat from its source to nearby heat sinks. Depending on Sarcon material selection, thermal conductivity across the product line ranges from 1.2 to 2.6 W/m°K with a thermal resistance between .26 and 1.35°Cin2/W. 

INDUSTRY NEWS

Laird Technologies Relocates Corporate Headquarters

Laird Technologies’ Corporate Headquarters has moved to a new location within the St. Louis, Mo. metropolitan area. This move occurred to provide additional space and updated facilities in response to the rapid growth of the company and the expected future growth.

The new address is:
Laird Technologies
16401 Swingley Ridge Road
Suite 700
Chesterfield, MO 63017
Main telephone number: (636) 898-6000

The original St. Louis area facility, located in Earth City, Mo., housed production, engineering, research and development as well as corporate management operations and staff. All corporate management operations and staff have moved to the new office, including executive management, business management, IT, product management, sales and marketing management, supply chain management and customer service. Production, engineering, research and development, along with support functions including site human resources and accounting will remain in the Earth City location.

Electronic mail addresses for employees will not change as a result of the move, and phones will be forwarded from the old numbers to the new numbers for an interim period.


Nextreme Expands Manufacturing Capacity to Meet Flip Chip Demand

Nextreme, a manufacturer of micro-scale thermal and power management products for the electronics industry, has relocated and expanded its North American corporate headquarters and manufacturing facility within Research Triangle Park. Increasing Nextreme’s production capacity, the 14,000 square-foot, facility includes semiconductor grade clean rooms and an advanced application laboratory to better serve customer needs as Nextreme enters product qualification, pilot production and ultimately volume production.


RIMA Elects New Board for 2008-2009

The Reflective Insulation Manufacturers Association (RIMA) held elections for a two-year term for several board of director positions with the following board members being elected to serve beginning Jan. 1, 2008:

The executive officers will be President Bobby Byrd of Martco Limited Partnership, Vice President Robert Wadsworth of Innovative Energy and Secretary/Treasurer Monty Millspaugh of Reflectix, Inc.

Directors will be Bill Lippy of Fi-Foil Company, Dan Russell of Innovative Insulation and Tom Miller of ESP/Low-E.

The new international director will be Guy Delcroix of KdB Isolation SA and the associate director will be William Mitchell of Dunmore Corp.

EVENT LISTING

Materials Research Society Fall Meeting
Nov. 26 – 30, 2007
Boston, Mass.

The 2007 MRS Fall Meeting will feature more than 40 technical symposia in seven topical clusters, an international exhibit highlighting products and services of interest to the materials community, as well as much more.

JOB POSTING
Upcoming Industry Events - Click here to view full Calendar

December

2-7 Thermal Performance of the Exterior Envelopes of Whole Buildings X International Conference, Clearwater Beach, Fla.
4-7 International Maintenance Conference, Daytona Beach, Fla.


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