EIC Solutions Introduces 3,200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to EIC’s 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes for new installations. Hot side depth is increased a modest 1.75 inches to allow for the expanded array of fans required to ensure maximum heat removal.
Unit weight is only 11 lbs. more than the existing 2,500 BTU model and the case rigidity is increased to accommodate the new heavier design. The power supply operates on input voltages from 200 to 264 VAC. As with all our thermoelectric air conditioners, the 3,200 BTU model can be mounted in almost any orientation as long as condensate is properly managed.
AdvanTech International Ceramic Injection Molded Heat Sink
AdvanTech International, Inc. has released a new ceramic powder injection molded (PIM) heat sink. Power injection molded aluminum nitride yields excellent heat dissipation that is ten times that of copper, with 1/5 the linear thermal expansion ratio. The unit is light weight, hard and can be directly mounted without insulation.
Additional features include molded fins for added heat dissipation, electrical insulation and metalizing can be added to the surface for electrical conductivity. PIM also allows for molding in other complex shapes.
Applied Nanotech Unveils Family of Thermally-Conductive Bonding Materials
Applied Nanotech Holdings, Inc. has unveiled a family of thermally-conductive bonding and printed materials called ThercoBond for power electronics and photonics applications. ThercoBond materials are designed for power electronic device packaging and dielectric coating, with a combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability and printability.
ThercoBond materials can be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs. The first two products in the family are polymer-based (DTC-P) and ceramic-based (DTC-C).
DTC-P is a line of thermally conductive, electrically insulating materials that are based on dielectric polymers modified to maximize thermal conductivity with added adhesion and wettability to metals, semiconductors and graphitic substrates. DTC-P is one-part bonding material and has a working temperature up to 300°C.
DTC-C is a line of thermally conductive, electrically insulating materials that are based on dielectric ceramics modified to maximize thermal conductivity to semiconductors, and graphitic substrates. DTC-C has a low CTE (< 7 ppm/K after curing), and is highly heat resistive with a working temperature up to 400°C.
Ohmite Manufacturing Releases C Series Extension
Ohmite Manufacturing Company has announced that the Ohmite C series heat sink now supports most resistor package sizes from TO-126 to TO-264. Designed for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, this heat sink provides tool and fixture free assembly operation, large surface area and small space occupation.
Ohmite’s C series heatsink features modified clips to attach smaller devices (TO-126), as well as additional fins for improved cooling. The standard product is offered in two finishes, degreased and black anodized. Customers can customize the heat sink with longer lengths and additional clips to secure multiple devices.
As with all C series heat sinks, the integrated clip eliminates the need for hand tools or screw holes. These camming clips all offer maximum repeatability, providing a constant spring force even after repeated assembly/disassembly. The resilient spring action locks the component in place securely.
RTP Company Introduces Thermally Conductive Compounds for Enhanced LED Luminaires
RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires. The compounds have been formulated to increase the thermal management design options available for LED lighting as it expands into a broader range of end-use markets including automotive, industrial, retail and consumer goods.
RTP Company’s thermally conductive compounds offer many benefits including reduced weight by up to 50 percent, injection molding processing simplifies and lowers manufacturing costs, inherent color eliminates the need for painting or secondary operations and heat sink life is increased in wet environments due to plastics corrosion resistance.
RTP Company has the ability to modify these thermally conductive compounds to meet the performance requirements of specific LED lighting applications. A variety of additives achieve in-plane thermal conductivity up to 35 W/(m·K) and allow the compounds to be either electrically insulative or conductive. Additionally, UL94 flame retardance, white colors with reflectivity greater than 95 percent and UV resistance can be included to optimize each formulation. Thermally conductive properties can be incorporated into a variety of thermoplastic resin systems including nylon 6 and 6/6, polyphenylene sulfide (PPS), and polycarbonate (PC) among others.