July 2012




Feature Article



Finding the Hot Spots: Thermal Imaging Cameras in Data Center Preventive Maintenance
Today’s data centers are high-density environments, stacked with powerful equipment. As a result, there is a greater emphasis on condition monitoring and preventative maintenance strategies to avoid downtime. Infrared thermography is an important sensing technology that will help identify problems that could impact a data center’s energy performance and operations.


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  Sponsored Announcement

Advancements in Thermal Management 2012 - Register by July 26 & Save!

If you're planning on attending the Advancements in Thermal Management 2012 conference, be sure to sign up by July 26th and save $300!  The Thermal 2012 technical program is packed with educational sessions from leading national laboratories, universities, government agencies and will host some of the brightest minds in the industry. Click here to register today!


Click Here to View the Full Program
For more information about sponsoring or exhibiting contact Jeremy Fleming.

  New Products

EIC Solutions Introduces 3,200 BTU Thermoelectric Air Conditioner
EIC Solutions has introduced a 3,200 BTU thermoelectric air conditioner. The air conditioner employs 50 percent more thermoelectric chips (TECs) with a minimal change in the overall dimensions of the unit. The footprint is identical to EIC’s 2,500 BTU model allowing for simple changeovers to achieve increased cooling capacity in existing applications or minimal design changes for new installations.  Hot side depth is increased a modest 1.75 inches to allow for the expanded array of fans required to ensure maximum heat removal.


Unit weight is only 11 lbs. more than the existing 2,500 BTU model and the case rigidity is increased to accommodate the new heavier design. The power supply operates on input voltages from 200 to 264 VAC. As with all our thermoelectric air conditioners, the 3,200 BTU model can be mounted in almost any orientation as long as condensate is properly managed.

AdvanTech International Ceramic Injection Molded Heat Sink

AdvanTech International, Inc. has released a new ceramic powder injection molded (PIM) heat sink. Power injection molded aluminum nitride yields excellent heat dissipation that is ten times that of copper, with 1/5 the linear thermal expansion ratio. The unit is light weight, hard and can be directly mounted without insulation.


Additional features include molded fins for added heat dissipation, electrical insulation and metalizing can be added to the surface for electrical conductivity. PIM also allows for molding in other complex shapes.

Applied Nanotech Unveils Family of Thermally-Conductive Bonding Materials
Applied Nanotech Holdings, Inc. has unveiled a family of thermally-conductive bonding and printed materials called ThercoBond for power electronics and photonics applications. ThercoBond materials are designed for power electronic device packaging and dielectric coating, with a combination of thermal conductivity, thermal diffusivity, thermal expansion, dielectric and insulating properties, wettability and printability.

ThercoBond materials can be applied on various substrates by conventional screen printing, drawdown, and even inkjet and other printing approaches to form thermally conductive dielectric layers for printed circuit board (PCB) applications as well as other electronic packaging needs. The first two products in the family are polymer-based (DTC-P) and ceramic-based (DTC-C).

DTC-P is a line of thermally conductive, electrically insulating materials that are based on dielectric polymers modified to maximize thermal conductivity with added adhesion and wettability to metals, semiconductors and graphitic substrates. DTC-P is one-part bonding material and has a working temperature up to 300°C.

DTC-C is a line of thermally conductive, electrically insulating materials that are based on dielectric ceramics modified to maximize thermal conductivity to semiconductors, and graphitic substrates. DTC-C has a low CTE (< 7 ppm/K after curing), and is highly heat resistive with a working temperature up to 400°C.

Ohmite Manufacturing Releases C Series Extension
Ohmite Manufacturing Company has announced that the Ohmite C series heat sink now supports most resistor package sizes from TO-126 to TO-264. Designed for high power density and small size (1U or 2U) electronic packaging with forced convection cooling, this heat sink provides tool and fixture free assembly operation, large surface area and small space occupation.


Ohmite’s C series heatsink features modified clips to attach smaller devices (TO-126), as well as additional fins for improved cooling. The standard product is offered in two finishes, degreased and black anodized. Customers can customize the heat sink with longer lengths and additional clips to secure multiple devices.


As with all C series heat sinks, the integrated clip eliminates the need for hand tools or screw holes. These camming clips all offer maximum repeatability, providing a constant spring force even after repeated assembly/disassembly. The resilient spring action locks the component in place securely.

RTP Company Introduces Thermally Conductive Compounds for Enhanced LED Luminaires

RTP Company has introduced a line of thermally conductive compounds for replacing metal heat sinks and housings in light-emitting diode (LED) luminaires.  The compounds have been formulated to increase the thermal management design options available for LED lighting as it expands into a broader range of end-use markets including automotive, industrial, retail and consumer goods.


RTP Company’s thermally conductive compounds offer many benefits including reduced weight by up to 50 percent, injection molding processing simplifies and lowers manufacturing costs, inherent color eliminates the need for painting or secondary operations and heat sink life is increased in wet environments due to plastics corrosion resistance.


RTP Company has the ability to modify these thermally conductive compounds to meet the performance requirements of specific LED lighting applications. A variety of additives achieve in-plane thermal conductivity up to 35 W/(m·K) and allow the compounds to be either electrically insulative or conductive. Additionally, UL94 flame retardance, white colors with reflectivity greater than 95 percent and UV resistance can be included to optimize each formulation. Thermally conductive properties can be incorporated into a variety of thermoplastic resin systems including nylon 6 and 6/6, polyphenylene sulfide (PPS), and polycarbonate (PC) among others. 

  Industry News

MovinCool Updates Spot Air Conditioner Product Selector Online Tool
MovinCool has updated its online spot air conditioner product selector to include the company’s latest ceiling-mount and water-cooled units, in addition to its other portable air-cooled models. The product selector saves customers time and effort in deciding which MovinCool spot air conditioning equipment best fits their individual needs.

Users are guided through a series of easy-to-answer questions that result in a recommendation of the most suitable MovinCool spot air conditioner and compatible accessories, along with the manufacturer’s suggested list price for each component. As an added convenience, users can immediately request a quote from their local MovinCool distributor.

“Our online product selector makes it quick and easy for customers to find the right equipment and accessories for their needs,” said David Keller, manager, Heat Management Department, MovinCool. “Now with our new ceiling-mount and water-cooled units included, it’s an even more useful tool.”

The MovinCool online product selector is located at

Townsend-AllCell Joint Venture Announced to Commercialize Battery Thermal Management Technology

AllCell Technologies, LLC and Townsend Ventures, LLC have formed a venture, Townsend-AllCell Technologies, LLC, (Townsend-AllCell) to commercialize AllCell’s passive thermal management technology for advanced battery systems and packs.  Townsend-AllCell will have the exclusive world-wide rights to commercialize AllCell’s patented technology for automotive battery applications plus additional rights for other markets including grid energy storage applications. AllCell’s technology makes use of phase change materials (PCM) to extend battery life and prevent overheating and battery fires.


A number of recent high-profile incidents involving lithium-ion battery systems have emphasized to the industry how integral thermal management is to the future of electric vehicles (EVs).  Lithium-ion batteries generate heat as a by-product of discharge. If that heat is not safely removed, the battery cells degrade, reducing battery life and can ultimately catch on fire or explode. 


AllCell’s PCM technology  currently under evaluation by several global automakers.  The PCM technology can absorb large amounts of heat, allowing auto battery designers to eliminate the bulky, expensive and inefficient liquid cooling systems common in current EVs.  AllCell’s PCM involves no moving parts, requires no power to operate and continues to protect batteries from overheating even when the vehicle is parked.  This passive protection can be essential to vehicle safety after accidents or when other systems on the vehicle fail.


Passive thermal management is similarly critical for stationary energy storage, particularly systems that are exposed to high ambient temperatures and solar loading.  Beyond managing the internal heat generated during battery discharge, phase change materials are well suited to absorb environmental heat during the day and release it back to the atmosphere when temperatures drop at night. 

Looking for Ways to Keep LEDs Cool? Ask Other Engineers on the FabricoForum

Fabrico is hosting a discussion on thermal management and LEDs on its site. The good news is LEDs generate more light from less power. They are compact and well-suited for today’s smaller, more complex designs. The bad news is they get very hot, which can result in thermal runaway and failure. How can you as a design engineer take full advantage of LED technology and still beat the heat? See what Craig McClenachan and Peg Roberts suggest on

The FabricoForum is an open dialog where design engineers and others interested in materials technology and product assembly can read opinions and weigh-in on current topics. Other subjects on the Forum include the benefits of medical grade adhesives and structural adhesives as a replacement for mechanical fasteners.



Event Listings




IMAPS 2012
September 9 - 13, 2012, San Diego, California, USA

IMAPS 2012 is the largest symposium related to the microelectronics packaging industry in the world. IMAPS 2012 will feature a powerful technical program, a state-of-the-art exposition, progressive professional development courses, another informative Global Business Council Marketing Forum and many other events and activities to share the latest developments in microelectronics.

The Annual IMAPS Symposium attracts approximately 1,500 attendees who represent all facets of the microelectronics and electronic packaging industries. These include: engineers, technicians, R&D, purchasing, manufacturing, management, and many more. They represent the automotive, communications, medical, aerospace, computer, defense, homeland security and consumer industries.

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