Ventec International Group, a world leader in the production of polyimide & high reliability epoxy laminates and prepregs, will present a paper on Advanced IMS Material Solutions at the Advancements in Thermal Management Conference from 9-10 August 2017 in Denver, USA.
Martin Cotton, Ventecís Director of OEM Technology will be presenting his technical paper entitled ĎAdvanced Thermal Material Solutionsí on Wednesday, 9 August at 11am at the DoubleTree by Hilton Denver Tech Center.
Thermal issues in Printed Circuit Boards and their related assemblies are becoming as important as the Signal Integrity in the design and manufacture of Printed Circuit Boards. The relationship between the materials used and the thermal functionality is a key focus as industry sectors tackle issues of reliability, aging and functionality. Costs and the value analysis between thermal transfer rates and materials used are fast becoming a design discipline that has huge effects on final assembly cost and thermal functionality.
Martinís presentation sets out to introduce new generation materials, their background and what current solutions are being used by various market sectors. Discussion on the next generation of Insulated Metal Substrates (IMS) and prepregs for Printed Circuit Boards and Hybrid constructions will be covered. Design and the Value Analysis required to lower cost in the final assembly while maintaining thermal function will be reviewed. Finally, the myths and misunderstandings around thermal materials and how to use them will be explained.
Martin will be joined by Jack Pattie, President of Ventec USA.