Thick Print Copper Technology Increases Thermal Reliability

Ryan Persons, Technical Services Engineer, Heraeus Electronics
Dr. Paul Gundel,
Product Manager, Heraeus Electronics

To meet the increasing demands of the power electronics market for high reliability under harsh environmental conditions, designers are striving to maximize the thermal performance of high-power applications. Currently, Direct Bonded Copper (DBC) is the principal technology used for building these circuits. However, DBC poses several disadvantages in the circuit building process. DBC has weaknesses in its thermal mechanical reliability and lacks the flexibility to allow multiple copper thicknesses for power and signal functions in the same design. MORE

Solving the Solver: The New Generation of Thermal Simulation

Tom Gregory, 6SigmaET Product Specialist

As consumers demand every smaller yet more powerful devices, engineers are faced with an increasingly difficult balancing act between device size, power, battery life and even environmental sustainability.For those of us working in the field of thermal simulation, the role that thermal management can play in achieving these goals may seem obvious. MORE

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