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Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials

Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH
Torsten Lubenow, AT Electronics, Evonik Nutrition & Care GmbH

Abstract
Epoxy resins commonly used for the encapsulation of electronic materials are often filled with various inorganic materials to reduce the coefficient of thermal expansion (CTE), improve thermal conductivity and feature other  mechanical properties. The increase in viscosity that accompanies the increase in filler loading, limits the amount of filler that can be added to a liquid encapsulation system. As a result, highly filled systems are difficult to use in applications that require better flow characteristics such as, flip chip under-fills, transfer molding masses and encapsulates. Moreover, trends of miniaturization require encapsulation systems with much lower viscosity, but with more efficient thermal management. MORE

Taking Full Advantage of Computational Fluid Dynamics in Electrical and Thermal Energy Technology Innovation

Kuninori Masushige and Yuka Takahashi
Siemens PLM Software, Japan

Seasoned engineers from the Thermal System Technology Department in the Application Technology Research Center at Fuji Electric Co., Ltd. (Fuji Electric) are applying computer-aided engineering (CAE) to the performance reviews and design development technology of various products developed by the company. In this article, Fuji Electric simulation experts Tsutomu Yamamoto, Yoshiaki Enami, and Kimihisa Kaneko discuss how they apply CFD. MORE

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