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Thermocouple Conditioning Circuit Design Considerations

Kevin Tretter, Principal Product Marketing Engineer
Microchip Technology, Inc. 

Temperature is by far the most commonly measured physical condition, spanning common applications such as HVAC systems, refrigerators and ovens, to more complex systems such as petrochemical plants and factory automation. In addition to the varying array of temperature sensing applications, there is also a wide range of sensor types, from simple bi-metallic temperature switches to complex, highly-accurate digital solutions. This article will focus on one of the most common temperature sensing elements, the thermocouple, and explore the design challenges associated with this type of sensor. MORE

Understanding 3D Vertical Vapor Chambers (“L” and “U” Shapes)

George Meyer, CEO
Celsia, Inc.

Until the mid-2000’s heat pipes were really the only option when designing a high heat-flux heat sink whose condenser was oriented vertically above a horizontal heat source. That’s because they’re easily bent post-production into a variety of shapes including “L” or “U” configurations. Despite the advantages to vapor chambers, better spreading and less thermal resistance, these devices were for all practical purposes unable to be manufactured in these shapes. Why? MORE

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