play mega moolah slot online



Fanless Thermal Solution Design Guide for IoT Applications

Mike Schroeder – Intel Corp IoT Thermal Mechanical Systems Eng.
Jacob Fritsch – Intel Corp IoT Thermal Mechanical Systems Eng.
Erich Ewy – Intel Corp IoT Thermal Mechanical Systems Mgr.

The internet of things (IoT) network of interconnected devices is driving an explosion of integrated-electronic components (IC) for embedded applications. Compute and wireless systems and sensors will be deployed at the IoT edge, where environmental considerations have challenging implications for thermal and mechanical design. In order to function reliably in harsh environments with extended operating ambient temperature ranges, electronics housings for IoT solutions that support low-power components with fan-less designs in sealed enclosures will be desirable. This paper is intended to be a practical guide for the thermal designer to quickly size and implement an optimized fanless thermal solution that is feasible for high volume manufacturing. MORE

Cooling Towers Offer Water and Energy Savings as Part of Efficient Data Center Cooling Systems

Douglas Bougher and Kent Martens, P.E.
SPX Cooling Technologies, Inc.

The number of data centers in the United States continues to grow in response to the enormous amount of digital information stored and streamed. The massive computer power within these data centers generates heat, making efficient cooling a key building system requirement. Evaporative cooling towers are an integral part of many data center cooling systems. MORE

SPX Cooling Technologies Adds Account Manager Evan Huddy and Technical Specialist Bertoni Marc
Ventec’s Martin Cotton joins speaker line-up at Advancements in Thermal Management Conference 2017
Intertec’s Explosion-Proof Heaters are Certified by INMETRO
Pasternack Debuts Line of RF and Microwave Power Amplifier Accessories
SPX Cooling Technologies Announces Redesigned Marley AV Cooling Tower
Vortec Enclosure Coolers Keep Sensitive Electronics Cool In All Environments
Easy to Apply Form-in-Place Thermal Gap Filler
Extremely Soft TIM Delivers Low Thermal Resistance
Dow Corning Optical Silicone Binder Extends Thermal and Optical Performance for Chip-Scale LED Package Designs
Fluke Expands the Condition Monitoring System to Include Thermal Monitoring
Intertec’s Explosion-Proof Heaters are Certified by INMETRO
Ruskin Introduces TDP05K Advanced Thermal Dispersion Air Measurement System