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Meeting the Thermal Management Needs of Evolving Electronics Applications

Hong Min Huang, Chris Lee, Hyo Xi, Yaqun Liu, Linda Shen
Honeywell Electronic Materials

We live in an exciting era of seemingly endless advances in electronics technologies that drive how we work and play. Servers, gaming, telecommunications, tablets, smart phones and countless other devices are core to the modern lifestyle, and so is the expectation for even more electronics innovations, better performance and faster speeds. MORE

Improvements to Thermal Conductivity Using Thinner Die-Attach Film

Richard Amigh
AI Technology, Inc. (AIT)

Die-Attach Film (DAF) adhesive has been around for the last twenty years when it became popular with stack chip manufacturing to achieve larger capacities in 3-D packaging of flash memory devices.  Additionally, using DAF at the wafer-level has become increasingly prevalent in die-attach for memory modules. DAF also insulates die-attach adhesives to properly handle interfacial stresses in stacking chips with bond-lines as thin as 8 to 10 microns or less, achieving even lower profiles. MORE

articles
Thermacore Recertified to AS9100 and ISO9001 Quality Standards
Air Force, Small Business Develop Technologies That Help Electronics Stay Cool
Phononic Raises $44.5 Million in Funding
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Jaro Releases Powerful “Fan to Sink” Coolers
Celsia Achieves 1,000 w/cm2 with New Hybrid Two-Phase Cooling Design
New ChillyBox Panel Chiller Keeps Components Safe
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Honeywell’s Thermal Management Materials Now Being Used for PC Graphics Systems
Built-In Advantages for New Thermal Interface Materials
Indium Corp. Heat-Spring for LED Manufacturing
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Lascar Electronics Introduces new Dual Channel Temperature WiFi Sensors
FLIR Systems Announces AX8 Temperature Sensor for Industrial Automation
Onset Releases Bluetooth Smart Temperature/Humidity Data Logger
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