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The Five Stages of System and Component Thermal Design

Matt Romig, Analog Packaging Co-Design and Roadmap Manager
Texas Instruments

Thermal-performance questions for power-management components seem very simple at first. But many component engineers and system designers for applications such as industrial, automotive, communications and enterprise equipment have found that things can get complicated very quickly. MORE

Benefits of Temporary Wafer Bonding

William Nicholson, Application Engineer
AI Technology Inc. (AIT)

Traditional temporary bonding adhesives have had significant drawbacks in high temperature applications where solvents are present, begging the question, how do you make adhesives that both “adhere” as well as release on demand? You use temporary bonding liquids and films for 3D wafer processing. Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration.  MORE

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