Adam Meyer, Sales Manager
Technical Systems, Inc.
Every year, the amount of electronic data that companies process and store grows exponentially. Data centers cannot economically increase the physical space available to keep pace with the growth, and are now challenged to provide more computer power in the same amount of space. The higher levels of microprocessing power in the same physical footprint increases heat density, so owners need more efficient cooling systems that will keep up with the market need without breaking the bank. One technology receiving attention is adiabatic cooling, which uses up to 90 percent less water than other systems. MORE
Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH
Torsten Lubenow, AT Electronics, Evonik Nutrition & Care GmbH
Epoxy resins commonly used for the encapsulation of electronic materials are often filled with various inorganic materials to reduce the coefficient of thermal expansion (CTE), improve thermal conductivity and feature other mechanical properties. The increase in viscosity that accompanies the increase in filler loading, limits the amount of filler that can be added to a liquid encapsulation system. As a result, highly filled systems are difficult to use in applications that require better flow characteristics such as, flip chip under-fills, transfer molding masses and encapsulates. Moreover, trends of miniaturization require encapsulation systems with much lower viscosity, but with more efficient thermal management. MORE