play mega moolah slot online



Adiabatic Technology Helps Cooling Keep Pace with Data Center Growth

Adam Meyer, Sales Manager
Technical Systems, Inc.

Every year, the amount of electronic data that companies process and store grows exponentially. Data centers cannot economically increase the physical space available to keep pace with the growth, and are now challenged to provide more computer power in the same amount of space. The higher levels of microprocessing power in the same physical footprint increases heat density, so owners need more efficient cooling systems that will keep up with the market need without breaking the bank. One technology receiving attention is adiabatic cooling, which uses up to 90 percent less water than other systems. MORE

Smart Electronic Adhesives for Microelectronics – Enabled by Low Viscosity Nanocomposite Materials

Dr. Andreas Funck, Head of AT Electronics, Evonik Nutrition & Care GmbH
Torsten Lubenow, AT Electronics, Evonik Nutrition & Care GmbH

Epoxy resins commonly used for the encapsulation of electronic materials are often filled with various inorganic materials to reduce the coefficient of thermal expansion (CTE), improve thermal conductivity and feature other  mechanical properties. The increase in viscosity that accompanies the increase in filler loading, limits the amount of filler that can be added to a liquid encapsulation system. As a result, highly filled systems are difficult to use in applications that require better flow characteristics such as, flip chip under-fills, transfer molding masses and encapsulates. Moreover, trends of miniaturization require encapsulation systems with much lower viscosity, but with more efficient thermal management. MORE

Potting Compounds Market to Reach $3,460 Million, Globally by 2022
Element Six Sees Growth in Chemical Vapor Deposition Synthetic Diamond Shipments in the United States in 2016
Future Facilities Releases 3rd Video in Binghamton University ES2 Research Project Series
GlacialTech Announces New 400 W LED Flood Light Heatsink Kit
Cooling Units Ideal for Kiosk and OEM
Jaro’s New Micro-Sized Whisper Blower
Form-in-Place TIM Fills Large Gap
RAMPF – Powering into the Electrical Future
Ventec Launches VT-5A2 High Tg Thin-Core and Pre-Preg Material
Future Facilities Significantly Increases Data Center Simulation Capabilities with Release 11 of 6SigmaDCX
Vertiv Introduces Autotuning Control for Enhanced Cooling Efficiency and Protection
Electronic Temperature Controllers Provide User-Friendly Technology