Participating Companies

Below is a list of companies that are attending the 2017 Advancements in Thermal Management Conference, or have attended in the past.


3M
Aavid Thermalloy
ABS Qaulity Evaluations
Academia Sinica
ADA Technologies
ADDA USA
Agilent Technologies
AllCell Technologies
Alphatek
American Standard Circuits
Alternative Engineering Solutions
Anritsu Company
APEX Microtechnology
Applied Materials
Arlon Silicon Technologies
AT&S AG
Axon
AzTrong, Inc.
BAE Systems
Ball Aerospace
Bechtel Plant Machinery, Inc.
Bergquist Company
C-Therm Technologies
Calienté
CD-adapco
Celisa, Inc.
CenturyLink
CermaTec GmbH
Ceramatec
Cerapax
Clarkson Aerospace
Colorado State University
CoorsTek
CPS Technologies
Cradle North America
Cristie Digital
CRODA, Inc.
Dana Corp.
Dana Long
Degree Controls
Delphia
Delta Products Corp.
Delta-Q Technologies Corp.
Dexmet Corp.
Dialog Semiconductor
Diemat, Inc.
Dupont
E-Globaledge America, Inc.
Eaton
Ebullient LLC
Ecole Polytechnique Fédérale de Lausanne
El Medical Imaging
Electronic Cooling Solutions
Energizer
Entropy Solutions, Inc.
Evonik
EOTRON LLC
F2 Chemicals Limited
Fabrico
Flex
FLEXcon
FTG Corp.

FLIR
Ford Motor Company
GE Appliances
GenTherm, Inc.
GrafTech International
Hamamatsu Corp.
Henkel Electronic Materials
Heraeus Electronic Materials
Heroux Devtek
Hewlett PackardHoffman Engineered Systems
Honeywell Electronic Materials
Hotblock OnBoard SAS
HP
HPI
Hubbell Lighting, Inc.


Hypertherm
i2C Solutions LLC
IBM Research
IBM Advance Thermal Lab
Indium Corp.
Infrared Camera, Inc.
Instec, Inc.
Intel
Invetus
John Deere
Kelvin Thermal Technologies
Keysight Technologies
KIC
KULR Technology
LGS Innovations
LITEN/CEAN
LiquidCool Solutions
LORD Corp.
MacDermid Enthone Electronics
Mentor Graphics
Meteksan Defence Industries
Materion Ceramics
Microchip Technology
MicroCoat Technologies
Micron Technology, Inc.
Microtek Laboratories
Microsemi DPG
Minco Products
Minteq International
MJM Engineering
Multek
Murata Americas
Namics
National Instruments
Naval Surface Warfare Center
NERAC
NGK Sparkplugs
Nissan Chemical Ind. Ltd.
Northrop Grumman
NREL
ON Semiconductor
Outlast Technologies
Pacific Star Communications
Phase Change Materials Ltd.
Phoseon Technology
PMIC
RCF Technologies, Inc.
Ricoh
Rogers Corp.
SABIC
SanDisk
SAPA Extrusions
SEAKR Engineering
Schlegel Electronic Materials, Inc.
Schoeller Electronics Systems
Shedahl
Shin-Etsu Chemical Co.
Solta Medical
Sparton Security
SPEX SamplePrep
STATS ChipPAC Inc.
TA Instruments
Taica North America Corp.
TE Connectivity
Technology Applications, Inc.
Texas Instruments
Textile Testing & Innovation LLC
The Durbin Group
ThermaCore
Thermal Form and Funcation Group
Thermal Management LLC
ThermAvant Technologies
Thermotion LLC
Toyota Motor Engineering & Manufacturing
UL
Universal Air Filter (UAF)
University of Arkansas
University of California-Riverside
University of Colorado
University of Denver
University of New Mexico
Ventec International
Western Digital
Woodward, Inc.
Zeus Industrial Products, Inc