Call for Papers Open

Join other industry visionaries and speak at†Advancements in Thermal Management Conference. This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry.

Topics we are Looking for:

  • Upcoming and Emerging Technologies for Thermal Management
  • Market Opportunities for Thermal Products and Services
  • Advanced Thermal Materials
  • Thermal Design and Modeling
  • Infrared/Thermography
  • Cooling Technology (including Air, Liquid and Vibration Cooling)
  • Characterization and Measurement for Thermal Materials
  • Thermal Ground Planes
  • IC Level Thermal Management
  • R&D in Thermal Management Related Spaces
  • Thermistors, Thermocouples, Thermoelectrics and Insulation
  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)
  • Thermal Control

Full-conference registration fees will be waived for all confirmed speakers.

Please note, the†deadline to submit an abstract†is February 16th, 2017. Send abstracts to Nick Depperschmidt, program manager, at 720-528-3770, ext. 111 or†NickD@WebcomCommunications.com. Visit our call for papers page to learn more.

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