Author Archives: Editorial Staff

Forty Percent of Electronics Design Engineers Don’t Think Thermal is a Priority

Cradle Releases PICLS V2

Two-Phase Liquid Cooling of Servers, Power Electronics, LED and Telecommunication Systems Workshop

August 2nd, 2016 – Denver, Co. Hyatt Denver Tech Center

Course Times – 9am – 5pm
Instructor - Prof. John R. Thome, Ecole Polytechnique Fédérale de Lausanne, Switzerland
Price – $895 – Register Here

This one-day workshop aims to provide a basic and practical understanding of active (pump driven) and passive (gravity driven) two-phase liquid cooling technologies for the thermal management of data center servers/racks, power electronics, LED and telecommunication systems. The course will depict videos of these two-phase heat transfer processes, provide an overview of prediction methods, and the principles of their design and operation, together with several case studies of actual systems. Continue reading

Managing Cooling Fan Noise in Product Design

August 2nd, 2016 – Denver, Co. Hyatt Denver Tech Center

Course Times – 1pm – 5pm
Instructor - David A. Nelson, Board Certified, Institute of Noise Control Engineering
Principal Consultant of Nelson Acoustics -
Price – $495 – Register Here

Fans seem to be everywhere, aiding in the cooling of myriad components and products.  For such a ubiquitous device, it seems reasonable to assume that quiet operation ought to just be “built in” at the factory.   But in order to be quiet, a fan must be both properly selected and wisely employed.  It’s important therefore for engineers and designers to have a working knowledge of the parameters governing fan noise, the perceptual aspects of sound (i.e., sound quality), and how fan noise fits into the overall product design process. Continue reading

Advancements in Thermal Management 2017

The 2017 dates have been announced for the Advancements in Thermal Management Conference. Being held August 9-10, 2017 in Denver, Co., this event educates attendees on the latest advancements in thermal management and temperature mitigation for electronics packaging, air and liquid cooling, thermal materials, temperature sensing and control, system design and management for optimizing thermal properties.


The conference is designed for design engineers, academia, system engineers, material scientists, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.


Subjects Covered at the Event Include:

  • Upcoming and Emerging Technologies for Thermal Management
  • Market Opportunities for Thermal Products and Services
  • Advanced Thermal Materials
  • Thermal Design and Modeling
  • Infrared/Thermography
  • Cooling Technology (including Air, Liquid and Vibration Cooling)
  • Characterization and Measurement for Thermal Materials
  • Thermal Ground Planes
  • IC Level Thermal Management
  • R&D in Thermal Management Related Spaces
  • Thermistors, Thermocouples, Thermoelectrics and Insulation
  • Thermal Sensing and Measurement (Sensors, Instruments, & Test Equipment)
  • Thermal Control