Join other industry visionaries and speak at the Advancements in Thermal Management 2012 event. Advancments in Thermal Management 2012 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

There are a limited number of speaking opportunities available, so it is imperative that you submit your abstract by the April 11th, 2012.

Here are some of the topics we are looking for:

• Upcoming and Emerging Technologies for Thermal Management  
• Market Opportunities for Thermal Products and Services 
• Thermal Sensing and Measurement
- Sensors, Instruments and Test Equipment
• Thermal Modeling
• Thermal Protection and Management
- Thermistors, Thermocouples, Heat Sinks, Thermoelectrics, Insulation and Materials
• Thermal Control 

Full-conference registration fees will be waived for all confirmed speakers.

For more information on submitting an abstract, contact Nick Depperschmidt, program manager, at 720-528-3770, ext. 111 or nickd@infowebcom.com.

Submitting a Proposal
The basis of the proposal or the presentation may not be the promotion or marketing of a product.
Please Note: Proposals and Submissions will be accepted only electronically by email. Send your proposal in the body of your email letter and include supporting material as attachments. Submit to Nick Depperschmidt.

Submission Guidelines
THE PROPOSAL: The total length of each proposal should be a maximum of 1,000 words. It should include:
- A summary of the presentation content
- Brief description of the presentation for the conference program (100 words)
- Computer and equipment requirements (See Your Technology Needs)
- Presenter(s) biography and list of affiliations
- Contact information: name, title, company, address, office phone & fax, email address, and web site.
DESIRED TOPIC: In which topic does your proposal best fit: Heat Transfer, Next-Generation Thermal Technology, Thermal Materials, Market Trends or Technology Trends.

YOUR TECHNOLOGY NEEDS: Do you need an Internet connection? Will you use computer-generated slides or present from a presentation program? If yes, you must bring your own laptop. Indicate any other technology that you plan to bring. Include any other pertinent information about your technology requirements.