There are a small number of speaking slots remaining for the Advancements in Thermal Management 2010 . The conference committee has extended the original March 12 deadline and is now accepting presentation abstracts on a first-come, first-serve basis. Being held October 19th in Dallas, Texas, the 2010 event will explore the important topics impacting the thermal management industry from materials to heat transfer.
There are a limited number of speaking opportunities available, so it is imperative that you submit your abstract as soon as possible to reserve a presentation slot.
Here are some of the topics we are looking for:
• Upcoming and Emerging Technologies for Thermal Management
• Market Opportunities for Thermal Products and Services
• Thermal Sensing and Measurement
- Sensors, Instruments and Test Equipment
• Thermal Modeling
• Thermal Protection and Management
- Thermistors, Thermocouples, Heat Sinks, Thermoelectrics, Insulation and Materials
• Thermal Control
Advancments in Thermal Management 2010 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and engineers, CTOs and R&D managers with organizations in industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
Full-conference registration fees will be waived for all confirmed speakers.
For more information on submitting an abstract, contact Nick Depperschmidt, program manager, at
720-528-3770, ext. 111 or nickd@infowebcom.com.
The basis of the proposal or the presentation may not be the promotion or marketing of a product.
Please Note: Proposals and Submissions will be accepted only electronically by email. Send your proposal in the body of your email letter and include supporting material as attachments. Submit to Nick Depperschmidt.
THE PROPOSAL: The total length of each proposal should be a maximum of 1,000 words. It should include:
- A summary of the presentation content
- Brief description of the presentation for the conference program (100 words)
- Computer and equipment requirements (See Your Technology Needs)
- Presenter(s) biography and list of affiliations
- Contact information: name, title, company, address, office phone & fax, email address, and web site.
DESIRED TOPIC: In which topic does your proposal best fit: Heat Transfer, Next-Generation Thermal Technology, Thermal Materials, Market Trends or Technology Trends.
YOUR TECHNOLOGY NEEDS: Do you need an Internet connection? Will you use computer-generated slides or present from a presentation program? If yes, you must bring your own laptop. Indicate any other technology that you plan to bring. Include any other pertinent information about your technology requirements.
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