Advanced Cooling Technologies, Inc. • Applied Nanotech, Inc. • Cooligy, Inc.
Electronic Cooling Solutions • Eurotherm • Future Facilities Inc. • Integrity Testing Laboratory Inc.
Nuventix • Oasis Materials Corp. • Solidica, Inc. • Thermotion Corp. • Tracewell Systems

8:00 a.m. – Keynote
Defense and High-End Commercial OEM Electronics
Mercury Computer Systems has initiated the formation of the OpenVPX Industry Working Group, an independent association comprised of both leading defense industry prime contractors and COTS systems developers. As a result, investment of high-profile committee members, who are competitors, to “fix” the VPX spec, has set the stage for implementation of their most advanced, highest density and thermally challenging designs. The OpenVPX Industry Working Group must characterize the limits of possibility for both conduction and convection cooling for the entire class of cards and chassis that package them. These characterizations will guide future end applications and card designs. This presentation will include results from three case studies that Tracewell Systems and Mercury Computer are currently preparing for the OpenVPX Working Group. The case studies are in progress and will be complete by early summer 2009. Learn about 3U conduction cooling to cold plate, 6U Conduction cooling to air and 6U convection cooling.

Matt Tracewell, Executive Vice President
Tracewell Systems

9:10 a.m.
Creating Useful Mechanical Work through Effective Thermal Management Techniques
If Thermal Management is the challenge of dealing with waste heat as a byproduct of the “core” process, what happens when Thermal Management is itself the “core” process, utilized to develop mechanical work?  Electro-Thermal Actuators employ Thermal Management to convert electrical input into mechanical motion through vaporizing a fluid, resulting in high output forces and long stroke lengths in a compact device.  By balancing thermal input with force output, these devices have been used to engage 4WD drivetrains, control airflow louvers and dampers, regulate valves, and open/close dispensing mechanisms.  Competing against solenoids and synchronous motors, Electro-Thermal Actuators use Thermal Management to bring a unique solution to motion control applications.

Gary Swanson, President
Thermotion Corp.

10:45 a.m.
Advanced Cooling Solutions for High Power Laser Diodes & IGBTs
This presentation will provide information on newly developed solutions for laser diode and IGBT cooling applications. The high performing and reliable solutions consist of a combination of conduction plates and liquid microheat exchangers. Compared to conventional direct bonded copper (DBC), the novel approach for bonding aluminum nitride to copper provides higher yield and better thermal performance of the conduction plate. Key features of the new microheat exchanger design include high rate of heat transfer, uniform coolant flow and heat transfer rate over large surfaces and low pressure drop at high flow rates. Reliability test data will be presented that demonstrate the minimized erosion-corrosion and particle blockage issues in the cooling system.

Madhav Datta, Chief Scientist, Mark McMaster, Vice President, and Fred Rebarber, Director of Sales & Marketing
Cooligy, Inc.

11:40 a.m.
Smarter Solutions for Heat Treatment
Discover the next level in accurate control of the Carburizing process through Simulation and true online carbon diffusion packages. These system modules provide a true scalable (and sustainable) solution. Full automation solutions using the Eycon/T2550 (sequential control as well as temperature and atmosphere control) are now provided for Integral Quench Furnaces, Vacuum Furnaces, Continuous and batch Annealing Furnaces. Great value Nitriding solutions now exist allowing the user to have simple control over Nitriding potential or Dissociation levels using Eurotherm controllers. All this as well as solutions to help process owners meet the stringent NADCAP/AMS2750D and CQI-9 quality standards through specialized data capturing systems, such as the AeroDAQ, and automated reporting systems which allow Temperature Uniformity Surveys (TUS) reports to be produced at a touch of a button.

Peter Sherwin, Business Development Manager, Heat Treatment
Eurotherm

2:00 p.m.
Heat Pipe Assisted Spreader Plates
This presentation will review the benefits and applications of embedded heat pipes technology in the area of conduction cooled electronics. Attendees will learn about real world applications. Detailed thermal modeling and the validated characterization testing will be discussed. Attendees will gain knowledge about engineering guidelines for applying the technology. 

Scott Garner, Vice President Sales and Marketing
Advanced Cooling Technologies, Inc.

2:55 p.m.
Thermal Management Device Fabrication Using Ultrasonic Additive Manufacturing
This session will provide an overview of the Ultrasonic Consolidation (UC) additive metal fabrication technology. The UC technology utilizes solid state sequential ultrasonic deposition of thin foils, integrated with a 3 axis CNC machining center, to produce net shape articles with highly unique geometries and material properties. The speaker will also discuss recent advancements in the use of UC to produce high strength, lightweight structures and thermal management devices. Specifically, examples of utilizing the UC process to embed fibers, sensors, and electronics will be reviewed in addition to a discussion of emerging high performance bi-metallic laminate materials enabled by the process.

John Sheridan, Advanced Engineering Manager
Solidica, Inc.

4:15 p.m.
A Simulation-based Approach to Maximizing Data Center Cooling System Efficiency
Computational Fluid Dynamics (CFD) modeling software are effective for improving the cooling efficiency in data centers and reducing cooling system operational costs. A new, holistic CFD modeling capability provides a direct means to maximize cooling system efficiency as a function of cost. This is accomplished by monitoring the impact of design options on a system bypass and recirculating airflow and facility PUE. A case study will be used to illustrate the methodology, highlight common cooling system inefficiencies and compare the ROI of multiple cooling system design options that can reduce cooling system operating costs by up to 25 percent.

Sherman Ikemoto, General Manager
Future Facilities Inc.

8:00 a.m. – Keynote
Outstanding Problems in the Development of a Thermal Physical Properties Database for Solid and Liquid Materials: Research and Solutions
Available data on thermal physical properties database for dense and insulation materials will be discussed. We will investigate a number of thermal physical problems related to the most energy consuming industries: construction industry, metallurgy, refrigeration industry, aerospace industry, etc. Theoretical analysis of some experimental data will be presented.

The important theoretical and experimental problems in the development of a database of thermal physical properties for solid and liquid materials are analyzed, including determination of the apparent and true thermal physical properties. The developed approach takes into account latent heat effects, as well as combined heat and mass transfer in the materials.

E. Litovsky, Head Thermophysical Division
Integrity Testing Laboratory Inc.

9:10 a.m.
Advanced Ceramic Thermal Control Options
The presentation will include proven concepts for the addition and elimination of heat from structures. The interactions of material properties and construction process capabilities will be explored. There will be a focus on the properties, and techniques for the use of non-toxic, high thermal conductivity aluminum nitride in these applications. Applications and construction guidelines for high flux heaters, coolers, and integrated devices will provide real food for new design ideas. Critical enabling processes of metallization, plating, brazing and so on will be discussed.

PC Smith, President
Oasis Materials Corp.

10:30 a.m.
Carbon Aluminum Composites – High Efficiency Thermal Management Materials
Attendees will learn about a novel carbon-based thermal material comprised of a porous carbonaceous matrix and dispersed aluminum has been developed by means of high-pressure impregnation process. The carbon-aluminum composite presents a unique microstructure, low thermal expansion, high thermal conductivity and excellent thermal diffusivity. Its superior thermal properties originate from a comprehensive optimization of materials selection, process control and tailoring the interface region between the two main components. This kind of carbon-aluminum composite shows promise for advancing high-power, high-speed electronic devices and systems.  
Nan Jiang, Scientist
Applied Nanotech, Inc.

11:25 a.m.
Designing with Thermoelectric Coolers and Generators
With increasing interest in solid-state cooling and power generation, the use of Thermoelectric Coolers (TECs) and Thermoelectric Generators (TEGs) is on the upswing.  This presentation will cover the advantages and limitations of designing with and using TECs and TEGs. 

Techniques will be demonstrated showing how to efficiently use iterative techniques within a spreadsheet to effectively run a transient thermal analysis involving a TEC.  Also demonstrated will be the use of the TEC SmartPart model within Flotherm to analyze the performance of a system using a TEC.  Other topics discussed will be the use of TEGs to generate electric power from the waste exhaust gas heat of an internal combustion engine and solar electric power generation using TEGs.

Guy Wagner, Senior Thermal Consultant
Electronic Cooling Solutions Inc.

12:20 p.m.
Active vs. Passive Cooling, the Synthetic Jet Cooling Solution
Passive cooling has always been the first choice in thermal design, due to limited cost, acceptable performance, orientation, size and weight.  As products become more complex, an active cooling solution becomes necessary.  Nuventix has pitted passive cooling solutions vs. active cooling solutions.  Results and effective new active cooling solutions for thermal management design will be discussed, focusing on synthetic jet active cooling instead of the classic fan solution. 

Brandon Noska, Thermal Application Engineer
Nuventix