THERMAL News now offers relevant, insightful Web-based discussions on the latest technical advancements, best practices, products and services, as well as training courses and mini-bootcamps for the industries we serve.
What are the advantages to attendees? Attend technical presentations and training sessions and stay up to date with the latest industry best practices, as well as network with business colleagues without leaving your office.
For vendors, market analysts and consultants, with the new webinar capability, you will be able to produce your own webinar. You will have the ability to reach and engage targeted attendees from organizations worldwide. Our extensive range of industry publications and databases enable us to market to your defined audience. |
Other Webinars
• Methodologies for Fan Characterization and Deployment within a System - Thursday, July 22, 2010 2:00 PM - 3:00 PM EDT
• Ask the Expert - Linking HFSS to ANSYS Mechanical for Thermal Applications - Wednesday, August 11 at 4:00 p.m. EDT, 8:00 p.m. GMT
• Thermal Management of a Data CenterThermal Management of a Data Center - Thursday, August 12, 2010 2:00 PM - 3:00 PM EDT
• Ask the Expert - Advanced Fan and Blower Modeling with the MRF Technique in ANSYS Icepak - Wednesday, August 25, 2010
9:00 A.M. EDT, 1:00 P.M. GMT or Wednesday, September 15, 2010 4:00 P.M. EDT, 8:00 P.M. GMT
• Selecting and Designing Liquid Cold Plates for Deployment in Electronic Systems - Thursday, August 26, 2010 2:00 PM - 3:00 PM EDT
• Thermal Management of Defense Electronics - Thursday, October 14, 2010 2:00 PM - 3:00 PM EDT
• Using Thermal Interface Materials to Improve Heat Sink Thermal Performance - Thursday, October 28, 2010 2:00 PM - 3:00 PM EDT
• Basics and Options in Thermal Modeling and Analysis of Electronic Systems - Thursday, November 18, 2010 2:00 PM - 3:00 PM EST
• Thermal Management of Telecomm Equipment - Thursday, December 9, 2010 2:00 PM - 3:00 PM EST
• Power and Cooling Challenges for Ultra-High Density Racks and Blade Servers
• Thermal Management For High Performance Processor Systems
• Thermal Stress Analysis on IGBT Power System Design
• Package and Board Thermal Design
• ANSYS Electronics System Level Thermal Management Solutions
• Electromagnetics and Thermal Multiphysics Analysis
Industrial Problem Solving of Polymeric Materials: Probing Micro and Nano-Scale Thermal Properties
Anasys Instruments and Eastman Chemical
Fan Characterization for Thermal Management
Advanced Thermal Solutions, Inc.
Liquid Cooling in Electronics Thermal Management
Advanced Thermal Solutions, Inc.
The Benefits of Thermal Interface Materials
Advanced Thermal Solutions, Inc.
Moore's Law, Thermal Management and Rocket Science
By RadiSys
Selecting the Ideal Temperature Sensor
By George Paparrizos, Product Marketing Manager, Analog and Interface Products
Smaller Packages = Bigger Thermal Challenges
By Terry Cleveland,
Analog/Mixed Signal Product Applications Engineer
How Dual Channel Pulse Testing Simplifies Characterizing RF Transistors
By Pete Hulbert is a Senior Applications Engineer at Keithley Instruments, Inc.
How to Avoid Self-Heating Effects on Nanoscale Devices
By Jonathan Tucker, Lead Marketing Engineer for Nanotechnology, Research and Education and the Sensitive Measurements Product Line Manager at Keithley Instruments
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