| Issue |
eNewsletter Highlights |
| September 2010 |
- Nanowick at Heart of New System to Cool Power Electronics
- Tactilus Sensor System Ensures Optimal Heat Sink Efficiency
- FLIR Lowers Infrared Camera Prices Under $1,600
- Orion Fans Develops Low Profile, Stackable DC Fans for Telecom, Appliance Applications
- Marlow Industries Awarded $3.9 Million DARPA Contract for Advanced Thermoelectric Materials and Device Construction
- Oak Ridge National Lab Achieves Unique Design for New Cooling Jacket
- Nextreme Expands Engineering Consulting Services to Solve Thermal and Power Management Issues
- Coolcentric Teams with SynapSense to Provide Data Center Thermal Management and Monitoring
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| August 2010 |
- Passive Thermal Technology: Small Solutions for Big Challenges
- AccuSense F333, Configurable Air Velocity Sensor for Embedded Applications
- Laird Technologies Releases Enhanced Cascade Series Thermoelectric Assemblies
- Shin-Etsu Develops Thermally Conductive Soft-Pad Silicones for Electronic Device Applications
- Thermal Gap Fillers Combine High Performance and Low Pricing
- Global Market for Thermal Management to be Worth $10.2 Billion by 2015
- Thermacore Acquires PMT and Expands Thermal Capabilities
- Nextreme Expands Engineering Consulting Services
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| July 2010 |
- PEC (Printed Electronic Circuit) Process for LED Interconnection
- Mentor Graphics Announces FloEFD Pro 9.3.1 Product for Heat Transfer Simulation
- New temperature control software package from B&R
- TDK-EPC Offers SMD NTC Thermistors Sample Kit
- Honeywell Debuts Thermal Management Materials for Portable Computing Devices
- Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
- Laird Technologies Releases the Newest in a Series of Thermal Management Application Notes
- Thermacore Leads Largest Collaborative Nanotechnology Project
- CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
- Webcom Communications Provides new Videos from Industry Leading Electronics Protection Companies
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| June 2010 |
- Selco’s Turnkey Temperature Control Solutions Provide Easy Drop-in-Place Installation
- STMicroelectronics Miniaturizes Digital Temperature Sensors for Protection of
- Portable Products New CE Compliant Cabinet Coolers For Electrical Enclosures
- Honeywell Debuts Thermal Management Materials for Portable Computing Devices
- Kooltronic Expands Line of NEMA 4 or 4/4X Air Conditioners
- Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
- Thermacore Acquires PMT and Expands Thermal Capabilities
- Lockheed Martin Subsidiary Signs Agreement With Owens Corning to Develop Next-Generation Composites
- CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
- Thermal Management and Technology Symposium – Register During the Month of June for Deep Registration Discounts
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May 2010
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- LORD Corp. Develops Thermal Conductivity Adhesive
- Laird Technologies Releases Low-Cost, High-Performance Thermal Substrate Specifically Designed for LED Module Applications
- Selco's Custom Thermistor Probe Assemblies Feature Turn-Key Readiness
- Alpha Releases New Quick Set Series Heat Sink
- Get Connected with Fujipoly’s Series 2005 Zebra Carbon Connector
- Coolcentric Opens New Briefing and Demonstration Center
- Indium Corp. Announces High-Melting, Lead-Free Solder Alternatives Agreement With Ormet Circuits
- Andrews Space Develops New High-Temperature Material
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| April 2010 |
- Balluff’s New High-Temperature RFID Tag Well-Suited for Industrial Manufacturing
- E Instruments International Introduces TH300 Humidity and Temperature Transmitter
- Fujipoly Sarcon GR-HF Gap Filler Pads Reinforced for Versatility
- THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
- Rehm Thermal Systems America to Begin User-Specific Condensation Reflow Process Characterizations
- Laird Technologies Launches New Online EMI, Thermal Management and Wireless M2M Solutions Stock Locator
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| March 2010 |
- Interview with Amanda Hartnett, applications engineer with Indium Corporation
- IRC’s Current Sense Resistors’ Flameproof Alloy, Open-Air Design Prevents Thermal Damage
- PA&E Announces New Ceramic Sealed Hermetic Windows
- Industrial Wireless Temperature Transmitter Powered by Heat
- Honeywell Announces New Thermal Management Materials for Portable Computing Devices
- Lockheed Martin Orion Team Fabricates World's Largest Heat Shield Structure
- POINTek Releases 10,000th Athermal AWG at New Plant in Seoul
- Southwall to Provide Technology in Super Insulating Windows for Empire State Building Energy Efficiency Retrofit Project
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| February 2010 |
- Thermoelectric Cooling for Industrial Enclosures
- Orion Fans Delivers New Line of Fan Accessories
- Triton Introduces High Thermal Conductivity Carbon Composites
- Rapid-pulse NtelliJet Provides New Spot Cooling Technology
- Low Profile Heat Sinks Cool Hot Components in Constricted Packages
- Are the Days of an American Market for Axial Fans Numbered?
- IQS Testing Purchased by the Compliance Management Group
- Caliente Earns ISO Certification in Quality Management Systems
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| January 2010 |
- Low Profile Heat Sinks Cool Hot Components in Constricted Packages
- ECD Announces New Calibration Plan to Reduce Costs and Downtime
- Infrared Thermometer with Patented Circle/Dot Laser Sighting and Wireless USB Model OS-DT8855W
- PerkinElmer Advances Thermal Analysis with Hyphenated Techniques for Evolved Gas Analysis
- AcuTemp Thermal Systems and CSafe, LLC to Offer Temperature Controlled Containers to Aid in Relief Efforts in Haiti
- Thermal Remediation Services, Inc. Renamed TRS Group, Inc.
- Thermal Management and Technology Symposium 2010 Call for Presentations
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| December 2009 |
- Nextreme Releases High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling
- Dickson Publishes Print and Video Support Guides for Chart Recorders and Data Loggers on Web
- Model 44900 Space Qualified Thermistors Feature High Sensitivity and Interchangeability
- High Temperature USB Data Logger in Stainless Steel Housing
- Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies\
- Thermal Management and Technology Symposium 2010 Accepting Papers
- AdaptivCool and Bluestone Energy Expand Data Center Efficiency Partnership
- PI System Used in Test of Leading Cooling Technologies for Data Centers
- Motor, Drive & Automation Systems 2010 Customizable to Match Your Areas of Interest
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| September 2009 |
- Indium Corp. Introduces a Thermal Interface Material for IGBT Modules
- New TCS 1200 High Accuracy Dry Block Calibrator
- Pfannenberg Introduces New DTT Series Top Mount Cooling Units
- Laird Technologies Releases the First in a Series of Thermal Management Application Notes
- Non-Silicone Thermal Grease
- Nextreme and Lockheed Martin Announce Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
- Behr America Forms New Battery Cooling Group
- A 2008 LED Projection Systems Report Focuses on the Roadmaps for LED Devices and Supporting Thermal Management and Driving Systems
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| August 2009 |
- New Induction Heating Systems Are Versatile, Powerful, Small
- Next Generation Electronic Cooling Software Streamlines Model Creation, Gridding, Solving and Post-Processing
- Thermally Conductive Two Part Epoxy for Enhanced Heat Dissipation
- New Technology Released in Intelligent Heating
- EasyHeat Goes Live with Updated Website
- Alfa Laval Group Acquires Heat Exchanger Service Company in Brazil
- New Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
- Arlington Capital Partners Acquires J.A. Reinhardt and Company Incorporated
- Lockheed Martin Selects Cuming Lehman Chambers
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| July 2009 |
- Lord Corp. Develops Thermally Conductive No Pump-Out Grease
- Galil Motion Control Announces Thermocouple and RTD Interface for RIO Pocket PLC
- Pfannenberg Inc. Releases Two New DTS 3000 Series Product Models
- Ideal Thermal Imager Helps Keep Server Rooms Up and Running
- Nextreme Raises $8 million in Corporate Funding
- American Standard Circuits, Inc Receives Second Technology Patent
- The Middleby Corp. Completes Acquisition of CookTek LLC
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| June 2009 |
- Mentor Graphics Releases FloEFD Functionality for Electronics Cooling Simulation and Analysis
- Omega Engineering, Inc. Releases Thermocouple Temperature and Pressure Data Logger
- National and Nuventix Introduce New Reference Design for LED Bulbs
- CoolIT Systems Tapped by BOXX to Liquid Cool the 4850 Extreme Workstation
- New Temperature Sensing Chips for Miniature, High Precision Applications
- Thermal Management & Technology Symposium Gains Pre-Conference Workshop
- Chatsworth Announces Acquisition of Epicenter
- Aavid Thermalloy to Globally Distribute Advanced Thermal Solutions Heat Sink and Attachment Products
- Lord Corp. Opens New Facility in Mexico
- CoolIT Systems Acquires Delphi Liquid Cooling Assets
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| May 2009 |
- Measurement Specialties Introduces Ni1000Si Temperature Sensing Chips for Miniature, Low Cost, High Precision Applications
- Wavelength Electronics Releases 2.2A Temperature Control
- COADE Releases New PV Fabricator for Automated Deliverables for Pressure Vessel and Heat Exchanger Design
- Nuventix Releases Compact SynJet Cooler for Philips Fortimo and Lexel LED Downlight Module
- Share Your Knowledge at Thermal Management and Technology Symposium 2009
- Rogers Corp. Reports 2009 First Quarter Results
- Tessera to Acquire Certain Assets from Dblur
- CoolIT Systems Acquires Delphi Liquid Cooling Assets
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| April 2009 |
- Thermal Property Mapping at the Micro and Nanoscale
- Electronic Interconnect Technology Offers PCB Thermal Management Materials, Constructions
- Induction Heating System for Nanoparticle Research
- REOTEMP Weld Pad/Tube Skin Thermocouples & RTD’s
- Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems
- Longwatch adds Thermal Imaging to Video Surveillance Software
- Thermal Management and Technology Symposium Sessions Announced
- Nuventix Secures $8 Million in New Funding
- CoolIT Systems Closes $6.2 Million Financing
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| March 2009 |
- Watlow Releases New Circulation Heater
- Reflow Compatible Low Noise Laser Diode Driver for RoHS Compliance SMT Features OEM Package Upgrade
- E Instruments Releases New Hot-Wire Thermo-Anemometer
- Flared Pin Fin Heat Sinks are Alternative for Natural Convection
- CPI Opens RD&T Center with Thermal and Product Test Labs
- DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement
- Fraunhofer Institute Berlin Selects Asymtek’s Dispensing and Coating Technology to Equip its Research Center
- Thermacore to Develop Active Heat Sink Technology
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| February 2009 |
- Omega Engineering, Inc. Has Released a New Video Borescope System
- Selco’s New OMH Thermostat Series Provides UL Approved High Limit Safety Device for Applications Requiring Manual Reset Temperature Control
- Thermal Imager Pinpoints Hottest and Coldest Temperatures on Live Screen
- Thermal Epoxy is an Excellent Potting Material
- Thermal Management and Technology Symposium 2009 Call for Papers
- CFdesign Creators Help Companies Convert Short-Term Challenges into Long-Term Benefits
- Netzsch Analyzing and Testing Acquires Advanced Adiabatic Reaction Calorimeters from Tiax
- Alfa Laval Group Acquires Heat Exchanger Company in Germany
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| January 2009 |
- Omega Engineering, Inc. Releases New Fan Heater
- Ircon Introduces IR Thermometer with New Signal Detection and Attenuation Alarming Capabilities
- Silicone-Free Interface Material Provides High Thermal Conductivity
- Kooltronic Releases Compact Solution for Electronic Cabinet Cooling
- New ABB Catalog Details Temperature Instrumentation
- Thermacore to Develop Active Heat Sink Technology
- Alfa Laval Strengthens Presence in South Korea, Acquires Local System Builder
- Nextreme Controls Polymerase Chain Reaction Process with Microscopic Peltier Heat Pump
- IBM Technology Licensed by Vette Receives Patent Approval
- Share Your Knowledge about the Industry in Web-Broadcasted Seminars
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| December 2008 |
- Koch Knight LLC Introduces Flexisaddle LPD Heat Transfer Media for RTO Applications in the Wood Industry
- REOTEMP’s Industrial Stainless Steel Pressure Gauge with Bayonet Case
- Omega Releases New Thermal Wind Tunnel
- Shin-Etsu Chemical Develops New Type of Thermally Conductive Phase Change Material
- Thermal Management and Technology Symposium 2009 Program Survey
- Rogers Corp Issues Patent Infringement Complaint
- Tyco Thermal Controls Selects Intergraph SmartPlant Enterprise
- Veolia Energy Purchases District Heating and Cooling System from Kent County, Mich.
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| November 2008 |
- Nextreme Releases New OptoCooler High Voltage Series
- Omega Engineering, Inc. Releases Tamperproof Thermostat FTO11 and FTD011 Series
- New Optran Polyimide UV/WF Fiber for High Temperature Environments
- Honeywell Low Voltage Wire for Climate System Control
- Jaro Thermal Releases Synergistic Super-Flow Turbo
- Fluke Application Note Provides a Guide to Under-Utilized Functions
- EaglePicher Selected to Supply Thermal Batteries to PATRIOT Missile Program
- Flex Interconnect Technologies Receives ITAR Registration
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| October 2008 |
- Rogers Releases New Advanced Circuit Material
- Omega Engineering Releases 1/16 DIN Temperature Controllers Series CN740
- RapidWrap Removable Thermal Insulation Covers Now Feature Aerogel Materials
- REOTEMP Releases Adjustable Angle Bimetal Thermometer
- JaroThermal’s “Air-Mover” Provides 417 CFM of Chilly Air
- Convergence Technologies Files Lawsuit Regarding Patents in Taiwan
- Parker Chomerics Announces AS9100B Quality System Registration
- Degree Controls, Inc. Announces ISO9001 Certification for its Tecate, Mexico Facility
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