• Nanowick at Heart of New System to Cool Power Electronics 
• Tactilus Sensor System Ensures Optimal Heat Sink Efficiency
• FLIR Lowers Infrared Camera Prices Under $1,600
• Orion Fans Develops Low Profile, Stackable DC Fans for Telecom, Appliance Applications
• Marlow Industries Awarded $3.9 Million DARPA Contract for Advanced Thermoelectric Materials and Device Construction
• Oak Ridge National Lab Achieves Unique Design for New Cooling Jacket
• Nextreme Expands Engineering Consulting Services to Solve Thermal and Power Management Issues
• Coolcentric Teams with SynapSense to Provide Data Center Thermal Management and Monitoring

• Passive Thermal Technology: Small Solutions for Big Challenges
• AccuSense F333, Configurable Air Velocity Sensor for Embedded Applications
• Laird Technologies Releases Enhanced Cascade Series Thermoelectric Assemblies
• Shin-Etsu Develops Thermally Conductive Soft-Pad Silicones for Electronic Device Applications
• Thermal Gap Fillers Combine High Performance and Low Pricing
• Global Market for Thermal Management to be Worth $10.2 Billion by 2015
• Thermacore Acquires PMT and Expands Thermal Capabilities
• Nextreme Expands Engineering Consulting Services

• PEC (Printed Electronic Circuit) Process for LED Interconnection
• Mentor Graphics Announces FloEFD Pro 9.3.1 Product for Heat Transfer Simulation
• New temperature control software package from B&R
• TDK-EPC Offers SMD NTC Thermistors Sample Kit
• Honeywell Debuts Thermal Management Materials for Portable Computing Devices
• Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
• Laird Technologies Releases the Newest in a Series of  Thermal Management Application Notes
• Thermacore Leads Largest Collaborative Nanotechnology Project
• CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
• Webcom Communications Provides new Videos from Industry Leading Electronics Protection Companies

• Selco’s Turnkey Temperature Control Solutions Provide Easy Drop-in-Place Installation
• STMicroelectronics Miniaturizes Digital Temperature Sensors for Protection of
• Portable Products New CE Compliant Cabinet Coolers For Electrical Enclosures
• Honeywell Debuts Thermal Management Materials for Portable Computing Devices
• Kooltronic Expands Line of NEMA 4 or 4/4X Air Conditioners
• Orion Fans’ 10-inch AC Fans Move Large Amount of Air in Confined Spaces
• Thermacore Acquires PMT and Expands Thermal Capabilities
• Lockheed Martin Subsidiary Signs Agreement With Owens Corning to Develop Next-Generation Composites
• CoolIT Systems Provides Dual CPU Liquid Cooling for MAINGEAR Quantum Shift PC
• Thermal Management and Technology Symposium – Register During the Month of June for Deep Registration Discounts

May 2010

• LORD Corp. Develops Thermal Conductivity Adhesive
• Laird Technologies Releases Low-Cost, High-Performance Thermal Substrate Specifically Designed for LED Module Applications
• Selco's Custom Thermistor Probe Assemblies Feature Turn-Key Readiness
• Alpha Releases New Quick Set Series Heat Sink
• Get Connected with Fujipoly’s Series 2005 Zebra Carbon Connector
• Coolcentric Opens New Briefing and Demonstration Center
• Indium Corp. Announces High-Melting, Lead-Free Solder Alternatives Agreement With Ormet Circuits
• Andrews Space Develops New High-Temperature Material

• Balluff’s New High-Temperature RFID Tag Well-Suited for Industrial Manufacturing
  
• E Instruments International Introduces TH300 Humidity and Temperature Transmitter
• Fujipoly Sarcon GR-HF Gap Filler Pads Reinforced for Versatility
• THERMINATOR Project Warms Efforts to Cool Semiconductor Design Solutions
• Rehm Thermal Systems America to Begin User-Specific Condensation Reflow Process Characterizations
• Laird Technologies Launches New Online EMI, Thermal Management and Wireless M2M Solutions Stock Locator

• Interview with Amanda Hartnett, applications engineer with Indium Corporation
• IRC’s Current Sense Resistors’ Flameproof Alloy, Open-Air Design Prevents Thermal Damage
• PA&E Announces New Ceramic Sealed Hermetic Windows
• Industrial Wireless Temperature Transmitter Powered by Heat
• Honeywell Announces New Thermal Management Materials for Portable Computing Devices
  
• Lockheed Martin Orion Team Fabricates World's Largest Heat Shield Structure
• POINTek Releases 10,000th Athermal AWG at New Plant in Seoul
• Southwall to Provide Technology in Super Insulating Windows for Empire State Building Energy Efficiency Retrofit Project

• Thermoelectric Cooling for Industrial Enclosures
• Orion Fans Delivers New Line of Fan Accessories
• Triton Introduces High Thermal Conductivity Carbon Composites
• Rapid-pulse NtelliJet Provides New Spot Cooling Technology
• Low Profile Heat Sinks Cool Hot Components in Constricted Packages
• Are the Days of an American Market for Axial Fans Numbered?
• IQS Testing Purchased by the Compliance Management Group
• Caliente Earns ISO Certification in Quality Management Systems

• Low Profile Heat Sinks Cool Hot Components in Constricted Packages
• ECD Announces New Calibration Plan to Reduce Costs and Downtime
• Infrared Thermometer with Patented Circle/Dot Laser Sighting and Wireless USB Model OS-DT8855W 
• PerkinElmer Advances Thermal Analysis with Hyphenated Techniques for Evolved Gas Analysis
• AcuTemp Thermal Systems and CSafe, LLC to Offer Temperature Controlled Containers to Aid in Relief Efforts in Haiti
• Thermal Remediation Services, Inc. Renamed TRS Group, Inc.
• Thermal Management and Technology Symposium 2010 Call for Presentations

• Nextreme Releases High Temperature Gold-Tin Thermoelectric Module for Optoelectronic Cooling
• Dickson Publishes Print and Video Support Guides for Chart Recorders and Data Loggers on Web
• Model 44900 Space Qualified Thermistors Feature High Sensitivity and Interchangeability
• High Temperature USB Data Logger in Stainless Steel Housing
• Laird Technologies Releases the Next Generation of Tunnel Series Thermoelectric Assemblies\
• Thermal Management and Technology Symposium 2010 Accepting Papers
• AdaptivCool and Bluestone Energy Expand Data Center Efficiency Partnership
• PI System Used in Test of Leading Cooling Technologies for Data Centers
• Motor, Drive & Automation Systems 2010 Customizable to Match Your Areas of Interest

• Indium Corp. Introduces a Thermal Interface Material for IGBT Modules
• New TCS 1200 High Accuracy Dry Block Calibrator
• Pfannenberg Introduces New DTT Series Top Mount Cooling Units
• Laird Technologies Releases the First in a Series of Thermal Management Application Notes
• Non-Silicone Thermal Grease
• Nextreme and Lockheed Martin Announce Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
• Behr America Forms New Battery Cooling Group
• A 2008 LED Projection Systems Report Focuses on the Roadmaps for LED Devices and Supporting Thermal Management and Driving Systems

• New Induction Heating Systems Are Versatile, Powerful, Small
• Next Generation Electronic Cooling Software Streamlines Model Creation, Gridding, Solving and Post-Processing
• Thermally Conductive Two Part Epoxy for Enhanced Heat Dissipation
• New Technology Released in Intelligent Heating
• EasyHeat Goes Live with Updated Website
• Alfa Laval Group Acquires Heat Exchanger Service Company in Brazil
• New Cooperation Agreement for Development of Next Generation Thermal and Power Management Solutions
• Arlington Capital Partners Acquires J.A. Reinhardt and Company Incorporated
• Lockheed Martin Selects Cuming Lehman Chambers

• Lord Corp. Develops Thermally Conductive No Pump-Out Grease
• Galil Motion Control Announces Thermocouple and RTD Interface for RIO Pocket PLC
• Pfannenberg Inc. Releases Two New DTS 3000 Series Product Models
• Ideal Thermal Imager Helps Keep Server Rooms Up and Running
• Nextreme Raises $8 million in Corporate Funding
• American Standard Circuits, Inc Receives Second Technology Patent
• The Middleby Corp. Completes Acquisition of CookTek LLC

• Mentor Graphics Releases FloEFD Functionality for Electronics Cooling Simulation and Analysis
• Omega Engineering, Inc. Releases Thermocouple Temperature and Pressure Data Logger
• National and Nuventix Introduce New Reference Design for LED Bulbs
• CoolIT Systems Tapped by BOXX to Liquid Cool the 4850 Extreme Workstation
• New Temperature Sensing Chips for Miniature, High Precision Applications
• Thermal Management & Technology Symposium Gains Pre-Conference Workshop
• Chatsworth Announces Acquisition of Epicenter
• Aavid Thermalloy to Globally Distribute Advanced Thermal Solutions Heat Sink and Attachment Products
• Lord Corp. Opens New Facility in Mexico
• CoolIT Systems Acquires Delphi Liquid Cooling Assets

• Measurement Specialties Introduces Ni1000Si Temperature Sensing Chips for Miniature, Low Cost, High Precision Applications
• Wavelength Electronics Releases 2.2A Temperature Control
• COADE Releases New PV Fabricator for Automated Deliverables for Pressure Vessel and Heat Exchanger Design
• Nuventix Releases Compact SynJet Cooler for Philips Fortimo and Lexel LED Downlight Module
• Share Your Knowledge at Thermal Management and Technology Symposium 2009
• Rogers Corp. Reports 2009 First Quarter Results
• Tessera to Acquire Certain Assets from Dblur
• CoolIT Systems Acquires Delphi Liquid Cooling Assets

• Thermal Property Mapping at the Micro and Nanoscale
• Electronic Interconnect Technology Offers PCB Thermal Management Materials, Constructions
• Induction Heating System for Nanoparticle Research
• REOTEMP Weld Pad/Tube Skin Thermocouples & RTD’s
• Simultaneous Lead and Lead-free Convection Soldering from Rehm Thermal Systems
• Longwatch adds Thermal Imaging to Video Surveillance Software
• Thermal Management and Technology Symposium Sessions Announced
• Nuventix Secures $8 Million in New Funding
• CoolIT Systems Closes $6.2 Million Financing

• Watlow Releases New Circulation Heater
• Reflow Compatible Low Noise Laser Diode Driver for RoHS Compliance SMT Features OEM Package Upgrade
• E Instruments Releases New Hot-Wire Thermo-Anemometer
• Flared Pin Fin Heat Sinks are Alternative for Natural Convection
• CPI Opens RD&T Center with Thermal and Product Test Labs
• DuPont Wafer Level Packaging Solutions, Nippon Kayaku and MicroChem Sign Joint Development Agreement
• Fraunhofer Institute Berlin Selects Asymtek’s Dispensing and Coating Technology to Equip its Research Center
• Thermacore to Develop Active Heat Sink Technology

• Omega Engineering, Inc. Has Released a New Video Borescope System
• Selco’s New OMH Thermostat Series Provides UL Approved High Limit Safety Device for Applications Requiring Manual Reset Temperature Control
• Thermal Imager Pinpoints Hottest and Coldest Temperatures on Live Screen
• Thermal Epoxy is an Excellent Potting Material
• Thermal Management and Technology Symposium 2009 Call for Papers
• CFdesign Creators Help Companies Convert Short-Term Challenges into Long-Term Benefits
• Netzsch Analyzing and Testing Acquires Advanced Adiabatic Reaction Calorimeters from Tiax
• Alfa Laval Group Acquires Heat Exchanger Company in Germany

• Omega Engineering, Inc. Releases New Fan Heater
• Ircon Introduces IR Thermometer with New Signal Detection and Attenuation Alarming Capabilities
• Silicone-Free Interface Material Provides High Thermal Conductivity
• Kooltronic Releases Compact Solution for Electronic Cabinet Cooling
• New ABB Catalog Details Temperature Instrumentation
• Thermacore to Develop Active Heat Sink Technology
• Alfa Laval Strengthens Presence in South Korea, Acquires Local System Builder
• Nextreme Controls Polymerase Chain Reaction Process with Microscopic Peltier Heat Pump
• IBM Technology Licensed by Vette Receives Patent Approval
• Share Your Knowledge about the Industry in Web-Broadcasted Seminars

• Koch Knight LLC Introduces Flexisaddle LPD Heat Transfer Media for RTO Applications in the Wood Industry
• REOTEMP’s Industrial Stainless Steel Pressure Gauge with Bayonet Case
• Omega Releases New Thermal Wind Tunnel
• Shin-Etsu Chemical Develops New Type of Thermally Conductive Phase Change Material
• Thermal Management and Technology Symposium 2009 Program Survey
• Rogers Corp Issues Patent Infringement Complaint
• Tyco Thermal Controls Selects Intergraph SmartPlant Enterprise
• Veolia Energy Purchases District Heating and Cooling System from Kent County, Mich.

• Nextreme Releases New OptoCooler High Voltage Series
• Omega Engineering, Inc. Releases Tamperproof Thermostat FTO11 and FTD011 Series
• New Optran Polyimide UV/WF Fiber for High Temperature Environments
• Honeywell Low Voltage Wire for Climate System Control
• Jaro Thermal Releases Synergistic Super-Flow Turbo
• Fluke Application Note Provides a Guide to Under-Utilized Functions
• EaglePicher Selected to Supply Thermal Batteries to PATRIOT Missile Program
• Flex Interconnect Technologies Receives ITAR Registration

• Rogers Releases New Advanced Circuit Material
• Omega Engineering Releases 1/16 DIN Temperature Controllers Series CN740
• RapidWrap Removable Thermal Insulation Covers Now Feature Aerogel Materials
• REOTEMP Releases Adjustable Angle Bimetal Thermometer
• JaroThermal’s “Air-Mover” Provides 417 CFM of Chilly Air
• Convergence Technologies Files Lawsuit Regarding Patents in Taiwan
• Parker Chomerics Announces AS9100B Quality System Registration
• Degree Controls, Inc. Announces ISO9001 Certification for its Tecate, Mexico Facility