| Issue |
eNewsletter Highlights |
| August 2008 |
- New Kalrez 8900 Parts to Help Increase Uptime and Improve Wafer Yields in Semiconductor Thermal Processes
- Jaro Thermal Releases New Neon-Sink
- Lord Corp. Develops Thermally-Conductive Flip Chip Underfill Technology
- AKCP Launches Daisy-Chainable Temperature Sensor
- Tellurex Corp. Releases New Thermoelectric Dual Cupholder in the 2009 Cadillac Escalade Platinum
- ECD Appoints KIE GmbH As New Distributor in Germany and Austria
- Indium Corp. Expands Sales Network in Western US
- Avnet and Nuventix Ink Americas Distribution Agreement
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| July 2008 |
- Tempil Introduces Electronic Temperature Indicator
- Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50 Percent
- KNF Specialized Diaphragm Pumps for Hot Gases Prevent Condensation and Contamination
- New Zeotherm 110-70B Provides Noise and Vibration Dampening in a Cost-Effective, 150°C-Capable Thermoplastic Elastomer
- Multi-Language Web Site for Precision Induction Heating Solutions
- Agilent Technologies Acquires RVM Scientific
- Data Loggers Aid Indoor Air Quality Research in Test Homes Across the US
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| June 2008 |
- Electrically Conductive Adhesive for Silicone and Florinated Surfaces
- OptoTherm Offers Environmental Enclosure for EL System
- Compact Radsok PCB Connector Series Provides More Power with Less Heat, Smaller Size
- Sedona Framework to Provide Software Infrastructure for Providing a Wired and Wireless VAV Product
- High Strength Epoxy Now Approved For Low Outgassing Applications
- Datapaq Releases New 12 Channel Temperature Data Logger
- New Thermocouple Instruments Feature High Resolution Options
- Three Workshops Offered with Thermal Management and Technology Symposium 2008
- Global Market for Thermal Management worth $11.1 Billion by 2013
- New Software Simulates Use of Phase Change Materials in Buildings
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| May 2008 |
- Watt-Flex Cartridge Heaters Available with External Thermocouple for Accurate Control
- Camera upgrade for EL thermal imaging system
- StratEdge Unveils Series of Small Outline Thermally Enhanced Packages for Power Semiconductors
- Cool Polymers Introduces Next Generation Thermally Conductive Polymers for Heat Sinks
- New Thermoelectric Cooler (TEC) Module Addresses Applications with High Heat-Flux Requirements in Small Optoelectronic Packages
- Dylon Technology Evolves Gear Lubricant
- Thermal Management and Technology Symposium Program Updates Announced
- ECD Receives Vision Award for MegaM.O.L.E.20 Thermal Profiler
- Laird Technologies, Inc. Opens India Manufacturing Operation
- Microchip Technology Ships 600,000th Development Tool to Emerson
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| April 2008 |
- Wahl’s New Thermal Imager Locates Hot Spots
- Breathing Hot Air Into the Car's Lungs
- Wireless Monitoring Savings Calculator for Engineers Now Available
- Shin-Etsu Chemical Develops a Thermally Conductive, Double-Sided Silicone Adhesive Tape
- Two New Workshops Announced for Thermal Management and Technology Symposium 2008
- Parker Chomerics New Extruded Gaskets Catalog Provides EMI Solutions for Electronics Design Engineers
- Texys Creates New Subsidiary in North America for its Line of Texense Sensors for Automotive and Industrial Use
- Chromalox Unveils New Web Site Emphasizing Applications Engineering Expertise and Tools
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| March 2008 |
- ThermoSafe Brands Introduces a Greener Packaging Solution
- Moore Industries Introduces HTZ Smart HART Humidity and Temperature Transmitter
- New Military-Approved Controllers from DegreeC
- Low Viscosity Silicone Potting Compound Assures Complete Fill-In
- Selco’s New T60 Encapsulated Thermostat Offers OEM’s Reliable, Low Cost Solution for Damp Environments
- First Full-Day Workshop Scheduled for Thermal Management and Technology Symposium 2008
- BAE Systems Receives $130 Million U.S. Army Order for Thermal Weapon Sights
- Flame Seal Products, Inc. Signs Sales and Distribution Agreements with Specialty Products, Inc. for Flame Seal’s New Thermal Barrier Coating for Foam Materials
- Future Lighting Solutions Offers the Industry's First Thermal Simulation Software for High-Power LEDs that Accelerates Development and Decreases Costs
- IceBank Ice Storage System Provides Alternative to Traditional Air Conditioning Systems
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| February 2008 |
- Warner Instruments’ New Thermal Cooling Module Includes Quiet Features
- Honeywell Introduces R300 Series Temperature Sensor with Improved Accuracy and Reliability in Harsh High-Temperature Environments
- New Temperature/Humidity Monitoring Tools for Engineers
- New Cost Effective, Space Saving, Dual Zone Temperature Controller for Runnerless Molding Applications
- Laird Technologies , Inc. Acquires Ezurio, Ltd.
- Amtech Systems Announces New Solar Orders Totaling $4.3 Million
- Skyworks Significantly Increases Shipments of GPRS Front-End Modules for SoC Applications
- Don’t Miss the Deadline for Thermal Management & Technology Symposium 2008 Call for Presentations
- Webcom Presents Multiple Industries Patent Workshop ~ at the 2008 Magnetics Conference in Denver, Colo., May 14, 2008 ~
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| January 2008 |
- Fluke Ti25 and Ti10 Thermal Imagers: A Complete, Affordable Solution for Industrial and Electrical Troubleshooting and Maintenance Applications
- Nextreme Announces New UPF OptoCooler Thermoelectric Platform
- King Polytechnic Engineering Adopts Victrex’s VICOTE® Coatings on Its Medium- to Large-sized SPIN/DIP Equipment
- CPS Aluminum Silicon Carbide Metal Matrix Composite Heat Spreader Flip Chip Lids for Advanced Telecommunications Computing Architectures (ACTA)
- Webcom Communications Announces Thermal Management and Technology Symposium 2008
- MSC.Software Acquires Network Analysis, Inc., Strengthens MD Strategy with Advanced Thermal Simulation
- ON Semiconductor Completes Acquisition of CPU Voltage and PC Thermal Monitoring Business from Analog Devices, Inc.
- Nickel Batteries Expand Growth in Industrial and Automotive Applications
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| December 2007 |
- New Thermal Insert Is Versatile Platform
- New Thermal-Eye X-50 Makes Thermal Imaging Technology Affordable for Law Enforcement
- New 20-Channel Profiler Is Data-Rich and Saves Time
- Southwall's Heat Mirror Insulating Glass Achieves Insulation Value of R-20/U-0.05
- austriamicrosystems’ New 20V Step-Down DC-DC Regulator Offers up to 96 Percent Efficiency
- TSI Group, Inc. Announces the Acquisition of Three Companies
- Alfa Laval Acquires Fincoil
- IBM Grants Water-Cooling Intellectual Property License to Vette Corp.
- Carbon Nanotube Tool Developer Appoints AxR as US Representative
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| November 2007 |
- Horizontal Conveyorized Gas-Fired and Electrically Heated Drying and Curing Systems Feature Improvements
- Heating Block Performance and Utility Compared in New Technical Bulletin
- CPI’s N-Series TeraFrame Network Cabinet Ss Preserving Network Infrastructure Survival
- Advanced Copper-and-Brass Heat Exchangers Well Suited for Clean Diesel Passenger Vehicles
- Nuventix Introduces Two New Cooling Modules for LED Thermal Management
- New Thermal Interface Sleeves for Semiconductor Packages and Thermistors
- Laird Technologies Relocates Corporate Headquarters
- Nextreme Expands Manufacturing Capacity to Meet Flip Chip Demand
- RIMA Elects New Board for 2008-2009
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| October 2007 |
- Moore Industries Announces Free Sensor Giveaway
- High Temperature Coatings Apply Directly to Hot Surfaces
- Honeywell Introduces HCH-1000 Series Capacitive Humidity Sensors
- MTS Enhances Level Plus MG Sensor with Redesigned Temperature Capabilities
- EIC Solutions Offers Complete Line of Enclosure Air Conditioners
- Ball Corp. Selects Allpax Retort to Test Shaka Process
- Industrial Nanotech, Inc. Announces New International Supply Chain Expansion, Severs Relationship with Mercatus and Partners, Ltd.
- Frost & Sullivan Recognizes MEMSIC for its Technological Edge in the MEMS-based Accelerometers Market
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| September 2007 |
- Unifin Announces Removable Cover Plate Generator Coolers
- Momentive Launches FRV138 Fluorosilicone Encapsulant to Protect Components from Shock, Heat and Chemicals
- New Mini Spring Clip Improves Air Filter Performance and Versat
- Skymark Uses New Arnitel VT Thermoplastic Elastomers in Skyair and Skyair XT Breathable Membranes
- Chomerics Launches Thermal Interface Material for Next Generation Microprocessors
- New Findings Contradict Common Perception of Parallel Fan Efficiency
- July Central AC, Heat Pump Shipments Drop 3 Percent
- NanoDynamics Subsidiary Receives $150,000 Phase I STTR Grant from National Science Foundation
- New Catalysts May Create More, Cheaper Hydrogen
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| August 2007 |
- New Snap-In Air Temperature Sensor Features Good Thermal Response
- Nanostructured Thin Film TEG Harvests and Converts Waste Heat into Electricity
- Cedip Infrared Systems Releases Third-Generation Thermal Camera
- Singe-Piece Raytek XR Infrared Thermometer Provides Continuous Monitoring
- Microbridge Increases Accuracy of Temperature Compensation by More Than 10 Times with Flexible Rejustors
- Premix Thermoplastics Develops New Compound for Self-Contained Breathing Apparatus
- Knowledge Center to Launch in September
- THERMAL News Online Continues Survey Question of the Month
- Laird Technologies Establishes Corporate Research Laboratory
- Advanced Thermal Solutions, Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions
- Yokogawa and Moore Industries Expand Global Preferred Vendor Agreement to include HCS HART Concentrator System
- Solar Power Generation Benefits from Dow Performance Fluid Chemistry
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| July 2007 |
- VEI Introduces Thermal Imaging Cameras with Night Vision
- ThermaFreeze Launches New Web Site
- Sylvania’s New Air Heater Features Long Life and Easy Maintenance
- UFP Technologies, Inc. Improves Clean Environment Stainless Steel Tube Insulation
- Posiflex Launches New KS Fan-free Touch Terminal Series Aluminum Enclosure for Optimal Heat Distribution
- Raycap’s SPD Protects Mission Critical Government and Defense Facilities
- Worm Temperature Sensor Installs without Removing Enclosure, Thermowell or Union Components
- Fairchild Controls Expands its Headquarters with New Development Facilities and a High-Power Electronics Laboratory
- Luvata Expands Global Presence in Heat Transfer with Acquisition of ECO Group
- OCZ and PC Power & Cooling Join Forces in Power Management
- Alfa Laval Strengthens Position in US Sanitary Market
- THERMAL News Online Launches Survey Question of the Week Survey
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| June 2007 |
- Nextreme Improves Thin Film Thermoelectric Material
- Jumbo-CelsiDot Excess Temperature Labels Are Easy to Read
- TC-LINK Wireless Thermocouple Node Now Has Six Thermocouple Channels
- CPS Offers AlSiC Pin Fin Coolers for Hybrid Electric Vehicle IGBT Applications
- DeWAL Industries Introduces Adhesive-Backed, PTFE-Coated Aluminum Tape
- eTEC Technology Provides Hot Spot Cooling for ICs
- Unifrax Completes Acquisition in the Czech Republic
- New Web Site Makes Specifying Air Filters Easier for Design Engineers
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| May 2007 |
- IBM Unveils Plan to Combat Data Center Energy Crisis; Allocates $1 Billion to Advance "Green" Technology and Services
- Communications Platforms Trade Association and DegreeC Develop Thermal Test Tools for AdvancedTCA Interoperability Testing
- Nextreme Funds Heat Transport Research at the University of Waterloo
- ARI Launches New Certification Program for Commercial Refrigeration Equipment
- New Rugged Temperature Sensor Designed for Difficult Environments
- New Mega-Pixel Infrared Camera Generates More Than 1 Million Pixels In Sharp, High Resolution
- Flomerics Releases Flotherm Version 7 with Unrivalled Design Optimization Capability
- Raytek Introduces Marathon MM 3M Infrared Thermometer
- Extreme Develops Multi-spectral Thermal Sensing Moondance PTZ
- Advanced Fiber Technology is Newest Target for GE Innovation Including Installation of High-Temperature Melt Spinning Fiber Line
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