January 2013



Feature Article



How Do You Choose Between Hot and Cold Aisle Containment?
From the very beginning of data center’s using airflow containment strategies, there has been an ongoing debate about which form is the most efficient: hot aisle containment or cold aisle containment. The debate, based on equal parts vested vendor interest, intuition and anecdotal evidence, was addressed by the scientific study DataCenter 2020. Their conclusion is best summarized by the white paper’s title: “DataCenter 2020: Hot Aisle and Cold Aisle Containment Efficiencies Reveal No Significant Differences.”This study shows that data centers can deploy containment strategies based on specific architectural and business variables, rather than preference or even guesswork, and essentially achieve the same results. 


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  Sponsored Announcement

Advancements in Thermal Management 2013 Call for Papers Deadline Jan .28th
As the world moves to smaller and higher power electronics, the need to explore the depths of advanced thermal management technology has never been greater. These technologies will shape the future of electronics, and the Advancements in Thermal Management 2013 conference is looking for visionaries to speak on its technical program about the innovations that will help cool the powerful electronics that serve our digital world. Click Here to view the Call for Presentations Page


There are a limited number of speaking opportunities available, so it is imperative that you submit your abstract by January 28th.

Full-conference registration fees will be waived for all confirmed speakers.


Call for PresentationsExhibitor Information

  New Products

GELID Launches the Black Edition CPU Cooler
GELID Solutions has unveiled its The Black Edition CPU cooler with the Slim 12 PWM and Silent 12 PWM fan. The cooler is a product of GELID Solutions GAMER product line.


With 7 power heat pipes and providing the opportunity to attach up to three fans “The Black Edition” fulfills many requirements of professional users. Three pcs of 8 mm and 4 pcs of 6 mm power heat pipes were built into the cooler to ensure maximum heat transfer from the hottest area of the core to the aluminum fins at extreme condition. Then a unique heatsink design was created to achieve lower air flow resistance and to provide efficient air channels. The compact heatsink with even 7 power heat pipes ensures sufficient space for rams on Intel’s X79 motherboard. Thanks to the heatsink design up to three 120 mm fans can be attached to the cooler.


GELID Solutions provides two fans (Slim 12 PWM and Silent 12 PWM) with high airflow. Both fans run silently at low CPU temperature and thanks to their PWM fan control the fan speed accelerates immediately when CPU temperature becomes higher. Additionally mounting clips for AMD AM2, AM2+, AM3, AM3+, FM1, FM2 and for Intel 775, 1155 are available.

TECA Introduces 5,200 BTU/HR, High Efficiency Thermoelectric Air Conditioners
TECA Corp. has introduced the AHP-6200 family of thermoelectric air conditioners. The AHP-6200 provides cooling performance up to 5,200 BTU/hr in the 240 VAC configurations. The AHP-6200 air conditioners operate at high C.O.P. values, meeting TECA’s “Green Zone” standard of high energy-efficiency.

The AHP-6200 air conditioners include TECA’s temperature control design with Eco-Mode, which helps save energy by limiting the need for active cooling when it’s not needed. The Eco-Mode design lowers total power consumption of the AHP-6200 by up to 75 percent. The Eco-Mode switches on passive cooling when the enclosure reaches 25°C. Active cooling begins when the enclosure reaches 35°C and, on heat/cool configurations, active heating begins when the enclosure temperature drops to 10°C.

The AHP-6200 air conditioners are designed with a low profile, which translates into more available enclosure space. The mounting flange, gasket and hardware and centrally located power input contribute to user-friendly installation. High air-flow fans and high fin-density heat sinks on the cold side maximize performance and minimize condensation. An integral condensate removal system absorbs condensation and transports it to the hot side, where it gets evaporated into the ambient. The AHP-6200 air conditioners are available with industrial grade or military grade sealed fans, depending on what is required by the end user’s environment.

Ircon Announces Enhancements for New Modline 7 Infrared Thermometers
Ircon has introduced the 7V series of infrared sensors to the Modline 7. The models provide solutions for the semiconductor industry and are combined with Ircon ModView Pro software. The Modline 7 features the PROC-7 processor box that allows full sensor operation through a push button panel and is part of a full line of accessories offered for the Modline 7 series thermometers.


The Modline 7 is a rugged, IP65 (NEMA 4) sealed sensor system that meets nearly any continuous temperature monitoring and control requirement. The thermometers are used in a wide range of industrial applications, including semiconductor manufacturing, metals processing, furnace refractory, primary and secondary glass, as well as plastics thermoforming.


The Modline 7 offers versatility with extended temperature ranges (-40° to 3,000°C/5,432°F), high-resolution optics and fast response times. The thermometer's sensing head can operate as a stand-alone sensor, providing simultaneous analog and digital outputs of process temperatures. Motorized focus control and both through-the-lens and laser sighting are standard on all units.


The thermometer's intuitive sensor design features integral water-cooling in a stainless steel enclosure. The high-temperature water jacket with integrated air purge capability reduces installation and setup time and is intended for use in ambient temperatures up to 315°C/599°F. An optional air purge collar accessory enables the lens to be cooled and kept free of debris in hot dusty environments.

Instrument Measures Heat and Hydraulic Performance of Cold Plates
The iFLOW-200 system from Advanced Thermal Solutions assesses the thermal and hydraulic characteristics of cold plates in electronics cooling. It measures the coolant’s temperature at inlet and outlet, fluid flow rate and pressure drop and surface temperature. The iFLOW-200 can be used to simulate a range of conditions to optimize a cold plate’s performance before it is commercialized or prior to its use in an actual application.


The iFLOW-200 measures coolant temperature from 0°C to 70°C with an accuracy of ± 1°C. Differential pressure of the coolant in the cold plate is measured up to 103,000 Pa (15 psi). Distilled water is the reference coolant. For test comparisons, the system’s coolingVIEW software can also calculate thermal resistance and pressure drop as a function of flow rate for selected liquids.


The iFLOW-200 system features easy set up and operation to save time when evaluating different cold plate models. Designed for accuracy and convenience, the iFLOW-200 simply requires setting the starting and ending coolant flow rates, and choosing the dwell time, pumping power and other parameters. These are easily done on any PC using the system’s user-friendly application program.


The iFLOW-200 system features separate controller and hydraulics enclosures with USB connections. The hydraulic package includes a fluid level indicator, coolant inlets outlets from/to the cold plate under test, ports for surface temperature thermocouples, and a fluid cooling system for its internal heat exchanger.

  Industry News

NETZSCH to Supply SpaceX’s Thermal Analysis Laboratory
Netzsch Instruments North America, LLC (Netzsch) is currently the sole supplier to Space Exploration Technologies Corp. (SpaceX) of high temperature thermal analysis instruments used to characterize material properties for space applications. The instruments will be used to fine tune properties of existing materials and to develop materials for use in the demanding environments of space.


SpaceX is transforming the way rockets and spacecraft are made. It is the only private company ever to return a spacecraft from low-Earth orbit, and the first to send a spacecraft to the International Space Station. In October 2012. SpaceX’s Dragon spacecraft again successfully delivered cargo to and from the space station, in its first official cargo resupply mission for NASA.


Netzsch instruments will be used to measure basic material properties along with other thermophysical properties. Some of these properties will include 1st, 2nd and 3rd order transitions, coefficient of thermal expansion and contraction, modulus, energy adsorption dampening, heat capacity, thermal diffusivity, thermal conductivity along with software and heat transfer data to model and build heat management systems.

Experiments Bolster Theory of How Electrons Cool in Graphene
It's a basic tenet of physics that scientists are trying to explain in graphene, single-atom thick sheets of carbon: When electrons are excited, or heated, how quickly do they relax, or cool? A research team supported by the Kavli Institute at Cornell for Nanoscale Science has shed some light on the topic through the first known direct measurements of hot electrons cooling down in graphene.


When electrons travel through graphene, they create a quantum lattice vibration, called a phonon. In doing so, the difference in energy the electron emits must equal the amount gained by the phonon; this is the "cooling" that happens as the system is returning to its equilibrium state, and this movement of electrons is at the heart of understanding how electronic devices work.


The Cornell experiment supports a previous theory that electrons in graphene experience super collisions as they cool. They bump into defects in the crystal lattice, imparting their momentum to the defects, thereby making the cooling process much faster than if the graphene were a perfectly repeating crystal.


Watching electrons move through graphene took some novel experimental legwork. Researchers conceived a setup in which they shot very short laser pulses, about 100 femtoseconds apart, at a piece of conventionally grown graphene. They observed the temperature of the graphene as it heated and cooled at a p-n junction, which is the interface at which electrons travel between two semiconductors. By tracking the magnitude of the current passing through the junction, they essentially used the junction as a tiny thermometer.


Heating the junction with an initial laser pulse, they hit it with a second pulse at specific time delays, comparing the crossover of temperatures. This technique allowed the team to measure the temperature of the system with sub-picosecond time resolution and within a few kelvins of accuracy. Their results agreed very well with the supercollision theory of the rate at which electrons cool in graphene.


The results provide further insights into the fundamental nature of graphene so it can one day be used in anything from photodetectors to non-silicon transistors. It is already well known that graphene shows promise for next-generation electronics because of its near-perfect conductivity, transparency and tensile strength.

Boosting Heat Transfer with Nanoglue
A team of interdisciplinary researchers at Rensselaer Polytechnic Institute has developed a method for increasing the heat transfer rate across two different materials. Results of the team’s study could enable new advances in cooling computer chips and lighting-emitting diode (LED) devices, collecting solar power, harvesting waste heat and other applications.


By sandwiching a layer of ultrathin “nanoglue” between copper and silica, the research team demonstrated a four-fold increase in thermal conductance at the interface between the two materials. Less than a nanometer thick, the nanoglue is a layer of molecules that form strong links with the copper (a metal) and the silica (a ceramic), which otherwise would not stick together well. This kind of nanomolecular locking improves adhesion, and also helps to sync up the vibrations of atoms that make up the two materials which, in turn, facilitates more efficient transport of heat particles called phonons. Beyond copper and silica, the research team has demonstrated their approach works with other metal-ceramic interfaces.


Heat transfer is a critical aspect of many different technologies. As computer chips grow smaller and more complex, manufacturers are constantly in search of new and better means for removing excess heat from semiconductor devices to boost reliability and performance. With photovoltaic devices, for example, better heat transfer leads to more efficient conversion of sunlight to electrical power. LED makers are also looking for ways to increase efficiency by reducing the percentage of input power lost as heat.

Asetek, Inc. Selected To Retrofit Major DoD Data Center with RackCDU Liquid Cooling
Asetek, Inc. has been selected to perform a $2 million project to retrofit of a major Department of Defense (DoD) data center with its direct-to-chip liquid-cooling technology. The product, called RackCDU (short for Rack Coolant Distribution Unit), brings high-performance liquid-cooling directly to the hottest elements inside every server in a data center. The net result is more than 50 percent cooling cost savings, oftentimes having an immediate payback.


 This project, which will be managed through DoD’s Environmental Security Technology Certification Program (ESTCP), will leverage Asetek’s technology to convert an existing air-cooled enterprise data center into a high-performance liquid-cooled enterprise data center, without disrupting operations during the transition and with improvements in energy consumption, density (enabling consolidation within existing facilities) and creating opportunities to reuse energy, a form of renewable energy under the Federal mandates.


“The Department of Defense has become very serious about improving data center efficiency, and they are seeking new approaches to address this mission-critical problem,” said Andre Eriksen, Asetek’s CEO and founder. “Hot water direct-to-chip liquid-cooling is a powerful approach that can capture more than 80 percent of the heat generated by a data center and remove it from the building, where it can be cooled for free by ambient air or even reused for building heating and hot water. No power what so ever goes in to actively chilling the water.”



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