May 2015



Feature Article


Benefits of Temporary Wafer Bonding

Traditional temporary bonding adhesives have had significant drawbacks in high temperature applications where solvents are present, begging the question, how do you make adhesives that both “adhere” as well as release on demand? You use temporary bonding liquids and films for 3D wafer processing. Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. 

Click Here to Read the Full Article


Sponsored Announcement

Advancements in Thermal Management Full Conference Program Announced

The Advancements in Thermal Management 2015 conference has released its event program. A great lineup of speakers has been confirmed, with more speakers and official times to be announced in April. Check out the program HERE.


2015 speaking companies include: IBM Research, Honeywell Electronic Materials, Cradle North America, University of Leeds, FLIR, United Arab Emirates University, Heraeus Electronic Materials and many more.


This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry. Register today.

New Products

Rittal 3R Air Conditioners Reduce Energy Consumption up to 70 Percent

Rittal Corp. has expanded its TopTherm Blue e Wall-Mounted Cooling Units with the introduction of its NEMA Type 3R air conditioners. These are off-the-shelf solutions that are UL listed and ready for UL508A applications in both indoor and outdoor environments. - Read More


Two Component Epoxy Polysulfide System Features High Thermal Conductivity

Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, oils, hydraulic fluids and related compounds. - Read More


Protect Electronics from Heat With Digital Control

EXAIR’s digital ETC (Electronic Temperature Control) is now available for Dual Cabinet Cooler Systems installed on large or high heat load enclosures. An ETC Dual Cabinet Cooler system will keep electrical enclosures cool while minimizing compressed air use. - Read More


FLIR Systems Announces New FLIR Vue Thermal Cameras for sUAS

FLIR Systems, Inc. has released its FLIR Vue – a compact thermal camera specifically designed for use on commercial sUAS. FLIR Vue makes FLIR’s thermal imaging capability more accessible to commercial drone operators by being easier to integrate, small and lightweight, and vastly more affordable than other sUAS-based thermal imaging solutions. - Read More


Find More New Product News Below

Cooling - Materials - Temp. Sensing/Control

Test & Measurement - System Design

Industry News

Versarien Technologies Appoints Mouser in Global Distribution Deal

Versarien Technologies Limited  has appointed Mouser Electronics, Inc. as an authorized global distributor. Under the agreement, Mouser will sell and promote the Versarien standard range of heat sink products based upon the VersarienCu micro-porous metallic copper foam technology. - Read More


Kooltronic Introduces Online Sizing and Selection Program

Kooltronic, Inc. has released its updated sizing software, now expanded to include all of their air conditioners, heat exchangers, fans and blowers in a single user-friendly program. - Read More


FLIR Systems Makes Lepton Camera Module Available Worldwide

FLIR Systems, Inc. has reached agreements with two prominent electronic component distributors, Digi-Key Electronics and Avnet, Inc., to make the FLIR Lepton micro thermal camera available worldwide in single-unit quantities. - Read More


Event Listings


Battery PowerBattery Power 2015 Digital Brochure Available

Join hundreds of design engineer, OEMs, end-users and battery manufacturers at Battery Power 2015, August 5-6 in Denver, Colo. This years event will provide OEM and mobile device engineers the tools and technologies to get the most from their mobile devices: from new battery designs to wireless charging.

The conference program has been finalized and the digital brochure is available. Click here to view the brochure, which details each session, workshops, exhibitor and the co-located event, Advancements in Thermal Management.

Register Today
for the Lowest Possible Rate - OEM and Team Discounts Available


Contact Us

Submit editorial content to Nick Depperschmidt at 720-528-3770 ext 111

For advertising information contact William Massey at 720-528-3770 ext 125

Webcom Communications • 7355 E. Orchard Road, Suite 100; Greenwood Village, CO 80111
Phone: 800-803-9488 • Fax: 720-528-3771 •

© 2015 Webcom Communications Corp.