eNewsletter

June 2009

In This Issue:

Product News

  • Mentor Graphics Releases FloEFD Functionality for Electronics Cooling Simulation and Analysis
  • Omega Engineering, Inc. Releases Thermocouple Temperature and Pressure Data Logger
  • National and Nuventix Introduce New Reference Design for LED Bulbs
  • CoolIT Systems Tapped by BOXX to Liquid Cool the 4850 Extreme Workstation
  • New Temperature Sensing Chips for Miniature, High Precision Applications

Industry News

  • Thermal Management & Technology Symposium Gains Pre-Conference Workshop
  • Chatsworth Announces Acquisition of Epicenter
  • Aavid Thermalloy to Globally Distribute Advanced Thermal Solutions Heat Sink and Attachment Products
  • Lord Corp. Opens New Facility in Mexico
  • CoolIT Systems Acquires Delphi Liquid Cooling Assets

Event Listing

  • Webinar: Thermal Management of LED Systems & Components Systems & Components

Thermal News Magazine

  • Download the Latest Issue!

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PRODUCT NEWS

Mentor Graphics Releases FloEFD Functionality for Electronics Cooling Simulation and Analysis
product imageMentor Graphics Corp. has released the FloEFD [Engineering Fluid Dynamics] v9.0 product suite from the company’s Mechanical Analysis Division (formerly known as Flomerics), with functionality specifically targeted for simulation and analysis of electronics cooling applications. As a “CAD-Embedded” application, the FloEFD suite integrates with all popular MCAD design solutions to enable mechanical designers to analyze sophisticated electronic products including those with complex geometries.

The FloEFD suite now complements Mentor’s FloTHERM product line to cover analysis by both the mechanical designer as well as the thermal analysis specialist. With FloEFD, the simulation models are easily and directly generated from the design database while in the MCAD environment, thus enabling a seamless, streamlined design flow for optimum designer productivity and accuracy. With analysis capabilities readily available to the designer, more simulations will result in higher product reliability and fewer prototypes/manufacturing re-spins.


Omproduct imageega Engineering, Inc. Releases Thermocouple Temperature and Pressure Data Logger
The OM-CP-PRTC210 series of pressure and thermocouple temperature data loggers accepts thermocouple types J, K, T, E, R, S, B and N. Models are available with pressure ranges from 2 to 345 bar (30 to 50,000 psi). It features high speed download, real-time operation, and programmable start time. The miniature sized OM-CP-PRTC210 is CE compliant and has up to two years of battery life. This product is well suited for the chemical and wastewater industries.

 


National and Nuventix Introduce New Reference Design for LED Bulbs
product imageNational Semiconductor Corp. and Nuventix, Inc. have released a new electronic drive and thermal management reference design that simplifies development of high-brightness light-emitting diode (LED) bulb fixtures that replace incandescent or compact fluorescent light bulbs in standard sockets.

A new reference design featuring National Semiconductor’s electronic drive board together with the SynJet cooling module from Nuventix provides lighting designers with a complete electronic drive and thermal management design for high-performance LED replacement bulbs.

The SynJet thermal management module from Nuventix features a synthetic jet cooling technology that utilizes turbulent pulses of air generated from an electromagnetic actuator to reliably and efficiently cool the LED. It is compatible with standard bulb form factors including MR16 and PAR 38.

The electronic drive board from National Semiconductor features the LM3429 buck-boost LED driver and LM2842 voltage regulator systems. The LM3429 system provides a constant current to the LEDs from input voltage rails of 9 V to 36 V, includes analog dimming capability and is configured to drive up to 12 series-connected LEDs. The LM2842 system powers the SynJet electromagnetic actuator. The form factor of the electronic drive board is compatible with the Nuventix SynJet MR16 and PAR38 modules.


product imageCoolIT Systems Tapped by BOXX to Liquid Cool the 4850 Extreme Workstation
BOXX Technologies, a company focused on high performance computing systems for visual effects, design professionals and advanced visualization, will implement a custom liquid cooling solution from CoolIT Systems to dissipate heat in the 3DBOXX 4850 Extreme Workstation.

 


New Temperature Sensing Chips for Miniature, High Precision Applications
The Temperature Products Group of Measurement Specialties has released surface mounted devices for varied contact temperature sensing applications.  The Ni1000Si is a nickel thin film resistance temperature detector (RTD) that is suitable for use in contact sensing. It complies with the former DIN 43760 standard, and is applicable for temperature sensing, control and compensation, general instrumentation and remote sensing. 

The devices are manufactured by PVD deposition on a silicon substrate. The thin film structure is covered by a passivation layer for environmental protection and enhanced stability. This allows the production of miniature, low-cost, high-precision temperature sensors. These sensors operate within a wide temperature range of -55°C to 160°C, with low power consumption.  A large temperature coefficient of resistance (6178 ppm/K - 0°C, 100°C) and good linearity between resistance and temperature (R V’s T) are inherent in the design.

INDUSTRY NEWS

thermal conference logoThermal Management & Technology Symposium Adds Pre-Conference Workshop
The newly added workshop has a track record of selling out. It will provide an interactive forum for attendees to learn and discuss the thermal systems modeling in a relaxed, classroom setting.

Introduction to Thermal Systems Modeling with Excel/VBA
Matt Moran, Owner, Isotherm Technologies LLC
October 19th, 8 a.m. - 5 p.m. with a one hour lunch break (lunch provided)
Save $100 if you register by September 18th!

This one-day workshop is for engineers, scientists, and others interested in developing custom thermal system models. Principles and practices are established for creating integrated models using Excel and its built-in programming environment, Visual Basic for Applications (VBA). Real-world techniques and tips not found in any other course, book or other resource are revealed. Step-by-step implementation, instructor-led interactive examples, and integrated participant exercises solidify the concepts introduced.
Read more about this workshop.


Chatsworth Announces Acquisition of Epicenter
Chatsworth Products, Inc. (CPI), a global manufacturer of products and service solutions that optimize, store and secure IT equipment, has acquired Epicenter, Inc., Westborough, Mass., an industry leading provider of data center infrastructure management tools to the enterprise and managed services market.

Epicenter provides data center products that address both the growing complexity of managing IT infrastructure spread and the increasing concerns regarding data center operating costs. Epicenter is a leader in delivering systems that provide the capability for advanced data center performance measurement such as compute per watt. Patented KVM solutions, IP-addressable power distribution units and software are all components of Epicenter’s versatile product set delivering centralized cross platform management of servers, network and storage.

With the integration of Epicenter technology, CPI can now further address today’s urgent customer needs regarding data center power and cooling with a solution set of hardware and software. CPI provides customers with the design assistance, product specification, customization, and implementation support necessary to make a future-proof data center infrastructure a reality.

With this acquisition, Epicenter Inc. becomes a wholly owned subsidiary of CPI and Epicenter’s products are being made available immediately through CPI’s global network of industry leading data communications distributors.


Aavid Thermalloy to Globally Distribute Advanced Thermal Solutions Heat Sink and Attachment Products
Aavid Thermalloy, LLC, a supplier of thermal management products for electronics, has signed a distribution agreement with Advanced Thermal Solutions, Inc. (ATS), a company focused on component cooling solutions. Aavid Thermalloy, with its global customer base and broad network of sales offices, representatives and distributors, will now have access to ATS’ high performance heat sink and attachment technologies to address the cooling of today’s and tomorrow’s electronic devices.

As part of the agreement, ATS will supply Aavid Thermalloy, with its complete line of maxiFLOW heat sinks. In addition, Aavid Thermalloy will also distribute ATS’ patented maxiGRIP heat sink attachment systems. Its compact design securely attaches heat sinks to hot components on densely populated PCBs and detaches quickly and cleanly when needed.


Lord Corp. Opens New Facility in Mexico
Lord Corp. has moved into its new sales and distribution facility in Mexico.

The 11,000-square-foot building is just outside of the city of Queretaro and located in El Marques Industrial Park and is triple the size of the previous facility, which was located in Toluca. The new free-standing building, comprised of 4,000-square-feet of office and 7,000-square-feet of warehouse space, was designed with growth in mind. In fact, the structure can be expanded to nearly three times its current size using the existing land.

According to Dave Ervin, director, Mexico and Central America, for Lord Corp., the expanded facility allows Lord to meet the increasing need for warehouse and office space for the growing Lord de Mexico staff, as well as improve service and delivery times for our automotive, industrial and electronics customers. Lord will continue to serve a variety of OEM and tier suppliers in the automotive industry, as well as general industrial application customers, from this facility.


CoolIT Systems Acquires Delphi Liquid Cooling Assets
CoolIT Systems has acquired Delphi Thermal Liquid Cooling assets including intellectual property, machinery and equipment. The Delphi acquisition will provide CoolIT the additional mass market production resources to better accommodate the rapidly growing global industry demand for liquid cooled computers. As part of the Purchase Agreement, CoolIT Systems will be immediately servicing industry giants including Dell and Apple.

EVENT LISTING

Thermal Management of LED Systems & Components Systems & Components
July 15 at 10-11 a.m. MDT
This webinar will provide an understanding of the issues involved in the thermal management of LED components systems. Learn the principles and the tools available to the design engineer. This course is designed to help engineers and technicians with some thermal background (but new to the implementation of LEDs) understand the thermal challenges and demands when designing LED components and systems.
Read more about this webinar!

THERMAL NEWS MAGAZINE  
Spring Cover

Download the THERMAL News spring issue PDF version today!

This issue includes articles on the following topics:

  • Thermal Management of LED Systems
  • Synthetic Jets: Solution for Active Cooling
  • Embedded CFD Helps Reduce Number of Thermal Prototypes from Up to 12 to One
  • EBM-Pabst and DSM Engineering Plastics Collaboration Leads to Innovative Fan in LED Headlamps for Hella
JOB LISTING
logo
Upcoming Industry Events - Click here to view full Calendar

June
3-4 International Reflective Insulation Manufacturers (I-RIM) Conference, Barcelona, Spain
8-10
Sensors Expo & Conference 2009, Rosemont, Ill.
8-11 MDM East, New York, N.Y.
8-11 NXT Comm, Chicago, Ill.

July
13-17 SemiconWest 2009, San Francisco, Calif.
7/19-23 ASME Thermal Engineering, San Francisco, Calif.


SemiCon WestSEMICON West 2009
July 14-16
San Francisco, CA

Connect with the latest trends and information about the microelectronics industry, discover solutions for today's critical challenges, and network with friends and colleagues.  It’s SEMICON West 2009, July 14-16, Moscone Center, San Francisco, CA. 

Keynote addresses from

  • Anand Chandrasekher, Intel
  • Walden Rhines, Mentor Graphics
  • Panel on the semiconductor industry roadmap (ITRS) 

TechXPOTS cover device scaling, assembly, test and packaging, solar/PV, EHS, and standards.  Themes include advances in semiconductor manufacturing; challenges for microelectronics manufacturing beyond 2010; new paradigms for packaging & test; integration across the supply chain; and new opportunities in photovoltaics.

Extreme Electronics sessions and networking highlight MEMS, nanoelectronics, LEDs/Solid State Lighting, and printed and flexible electronics.

Hundreds of exhibits and more! Register today at  www.semiconwest.org
Link: www.semiconwest.org


logoSMTA International 2009
Technical Conference: October 4-8 / Exhibition: October 6-7
Town and Country Resort and Convention Center
San Diego, CA

Come. Focus. SMTA International 2009
Don't miss the industry's strongest technical program.  Attendees at SMTAI 2009 can look forward to 120 papers, 18 short courses, Harsh Environment Electronics Symposium, Emerging Technologies, Lead-Free Symposium, Contract Manufacturing Symposium, and a special keynote speaker from Jet Propulsion Labs. 

SMTAI attracts the perfect blend of users, suppliers, academics, and technologists, making it the absolute location to learn and do business.  Early Bird rates still available to exhibit.  Get your booth before they are all gone!

Visit the Web site to learn more: http://smta.org/smtai/index.cfm

Garysguide is the #1 Business Events Calendar in the country covering Tech, Media, Finance, Legal, Biotech, Healthcare, Entrepreneurship &more across 30 cities. Our audience is a highly targeted mix of connectors and influencers including Entrepreneurs, VCs, CEOs, CTOs, Bloggers, Analysts and Technologists.

For more information please visit www.garysguide.org.

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