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September 2016

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Feature Article

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How Does Bending Heat Pipes & Vapor Chambers Affect Performance?

George Meyer, CEO - Celsia, Inc.

The majority of applications for heat pipes, and to a lesser extent vapor chambers, require these products to be bent. Below are respective examples for high-performance graphics card, semiconductor equipment and networking applications.

 

But what effect does bending a heat pipe or vapor chamber have on their performance? To answer this, let’s first talk about bend parameters then we’ll move into the meat of it and discuss both evaporator and vapor resistances.

 

Click Here to Read the Full Article 

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Sponsored Announcement
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Advancements in Thermal Management Proceedings now Available

Did you miss the 2016 Advancements in Thermal Management Conference? If so, you can still download the presentations given at via the event.

 

Purchase the proceedings HERE

 

The program features speakers from industry leaders such as IBM Research and the IBM Advanced Thermal Lab, University of California - Riverside, Outlast Technologies, and many more.

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New Products

Ice Qube, Inc. Announces the Evolution Series Air Conditioners

Ice Qube, Inc. has introduced its next version of the Evolution series air conditioners for ordinary and hazardous locations Class 1 Division 2 Groups A, B, C, & D. - Read More

 

Laird’s Liquid Cooling Systems and Temperature Controllers Designed for Semiconductor Fabrication Equipment

Laird has developed custom cooling and temperature control systems for semiconductor fabrication equipment. The critical production tools used in semiconductor fabrication facilities must be reliable and easy to service to minimize downtime. - Read More

 

Customizable Options Plus Impressive CFM Equals Cooler Components

By providing a high level of static pressure (32.72 / 44.58 mmAq in free air – per rated voltage), Jaro Thermal’s new motorized (DC) impellers offer strong advantages over other types of air movers. - Read More

 

Emerson Network Power Introduces First IoT Mobile App for Thermal Monitoring and Troubleshooting

Emerson Network Power has introduced the iCOM CMS, a thermal system control aimed at giving IT professionals much needed monitoring and protection of equipment in small IT spaces supporting edge computing. The new system is available in North America. - Read More

Industry News

Carbodeon Ltd Oy Closes EUR 1.5 million Funding Round From Straightforward Capital

Carbodeon Ltd Oy has closed a EUR 1.5 million funding round from Straightforward Capital, a Finnish venture capital firm. The round follows major financing already received from biotech and advanced materials sector investor Enso Ventures. - Read More

 

‘Cooling the Edge’ Survey Shows North American Companies are Investing More in Edge-Computing Spaces

Emerson Network Power has released results of a new survey that shows IT and data center managers in North America are becoming more focused on how they manage remote network closets and server rooms used in edge computing. - Read More

 

Ventec International Doubles IMS Material Manufacturing Capacity with Equipment Investment

Ventec International Group has doubled its B-series Insulated Metal Substrate (IMS) materials production capacity at its Jiangyin, China facility. The company has invested $2 million in leading edge production equipment that boost IMS materials production capacity 100 percent above prior levels. - Read More

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Event Listings

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LowPower 2016Low-Power 2016 - Call for Presentations

November 3-4
Las Vegas, Nev.

 

Low-Power 2016 is an international conference highlighting the latest developments in low-power functionality and systems in portable & mobile electronics, medical & wellness devices, wearables, sensing, instrumentation and energy management.

 

Conference topics will include designing for low power, wireless charging, energy harvesting, low-power sensing, enabling smart & mobile apps, ICs, embedded electronics, power for mobility and the Internet of Things, new market opportunities and certification & testing.

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