June 2008

Electrically Conductive Adhesive for Silicone and Florinated Surfaces

Creative Materials, Inc., manufacturer of electrically conductive ink, coating and adhesives, offers a flexible, re-workable, electrically conductive adhesive, 102-32, which has low temperature performance. The adhesive and has been found to be suitable in a wide range of fastening and bonding applications. Adhesion to metals, plastics and glass is also good.

During tests conducted by CMI, 102-32 proved to be resistant to flexing and creasing because of its low temperature flexibility. The low stress nature of the 102-32 allows for electrical attachment of stress sensitive devices. This electrically conductive adhesive is ready to be used as supplied. Also, by thinning 102-32 with a fast evaporating solvent, this product can be spray applied onto hard to stick surfaces and act as a conductive coating to provide EMI/RFI shielding or polymer thick film circuitry.

OptoTherm Offers Environmental Enclosure for EL System

OptoTherm has released the EL environmental enclosure. The 27-inch by 27-inch by 45-inch  enclosure provides a stable test environment by blocking energy emitted by the ambient environment and blocking air currents generated by heating and air conditioning ducts. A motorized camera slide and controller precisely position the EL camera for Model Board Comparison and short circuit tests. A platform with adjustable PCB mounts enable repeatable positioning of board sizes up to 22 inches by 20 inches. 

The EL system detects and locates PCBA defects, such as short circuits and stressed components, which are difficult to identify using conventional test methods. EL can also be used to verify PCBA functionality. No custom hardware is required and tests can usually be setup in less than an hour. 

Compact Radsok PCB Connector Series Provides More Power with Less Heat, Smaller Size

Mouser Electronics, Inc., is now stocking three compact, high amperage Radsok PCB connectors from Amphenol Industrial, a division of Amphenol Corp. and supplier of interconnect systems. 

Well suited for use in current, single-point connections to printed circuit boards (PCBs), the new PowerBlok, Radsert and PGY connector series incorporate Radsok technology to increase current and/or amperage, eliminate threaded connection failures and increase reliability, flexibility and available surface space within a board design. 

Housed in a 12.7 mm by 12.7 mm package, PowerBlok provides up to 70 amps to a board. The connector’s backplane power interface uses compliant pins that are press-fit into the board enabling a solid connection and even signal flow. PowerBlok features a radial design that ensures many points of contact and a touch-proof cover for safer operation. 

Available in either a 2.4 mm size carrying up to 35 amps or in a 3.6 mm size carrying up to 70 amps, Radsert offers a small footprint of the PCB devices, freeing up the most surface space for added design flexibility. Radsert enables designers to bring power to the board from busbars suspended above the board and its components. A standard Radsert is designed for a board thickness of 6.35 mm ± 0.0635 mm with custom sizes available for specific applications.

 The PGY is available in a 3.6 mm size carrying up to 70 amps and in a 5.7mm size carrying up to 120 amps, providing the highest amperage in the smallest package. The orthogonal card edge connector allows design engineers to achieve the needed size and weight reductions within their design without compromising the power needed for the board. 

The Radsock PCB connector series is RoHS compliant and can be applied manually (press-fit) or by a reflow solder process that eliminates the need for additional wires and special crimping tools.

Sedona Framework to Provide Software Infrastructure for Providing a Wired and Wireless VAV Product

Tridium, Inc., provider of device to enterprise automation, will collaborate with Belimo to develop a next-generation VAV controller featuring the Sedona Framework. The Sedona Framework is Tridium's newest automation platform targeted at application-specific controllers, smart sensors and other types of intelligent edge devices.

Belimo will integrate the capabilities of the Sedona Framework into its actuator platforms adding temperature control and communications to the pressure independent control that is available today. With Sedona's communication options, Tridium will give customers a VAV controller that is both BACnet compliant and can alternately communicate wirelessly over a 802.15.4 mesh network to lower the installation costs for the controller and associated space temperature sensor.

The Sedona Framework is an open source development framework that provides a comprehensive software platform for developing, deploying, integrating and managing pervasive device applications at the lowest level. Sedona distributes decision-making control and manageability to any device and brings intelligence and connectivity to the network edge and back.

The Sedona Framework will be released in the fourth quarter of 2008.

High Strength Epoxy Now Approved For Low Outgassing Applications

Master Bond EP121CL is a high temperature resistant epoxy resin system for service up to 500°F.

The two-component, optically clear, low viscosity epoxy features high thermal stability, well suited electrical insulation properties and good dimensional stability for casting, sealing, potting, encapsulation and impregnation applications. It features good mechanical properties.

Datapaq Releases New 12 Channel Temperature Data Logger

Datapaq’s Q18 data logger provides 12 channels in a narrow footprint using robust, standard thermocouple connectors, thus ensuring maximum ease of use and minimum cost of ownership for users.

The new 12 channel Q18 data logger was designed to assist high-end electronics manufacturing companies specializing in the production of large and complex PCBs. Using a Datapaq temperature profiling system to monitor this process can be an effective way to optimize product quality, increase yields and minimize the need for rework, save energy as well as expedite process set up.

Available with 6, 10 and12 channels, the Q18 has an accuracy of ±0.5°C and can store up to 18,000 readings per channel.

New Thermocouple Instruments Feature High Resolution Options

GEC Instruments has introduced its four-channel model S4TC and 16-channel model S16TC, thermocouple instruments for making temperature measurements with thermocouples with unprecedented accuracy. 

These units connect to a PC via RS-232 or USB, and are accompanied by a versatile and powerful software package for display, plotting, logging, retrieval and analysis of data. Measurement resolution is better than 0.01°C, and measurement accuracies better than 0.1°C are possible by means of simple calibration procedures within the software.  Custom instruments with one to 94 channels in the same enclosure are also available.

Three Workshops Offered with Thermal Management and Technology Symposium 2008
Arrive in Austin early, and participate in pre-conference workshops and short courses organized in conjunction with Thermal Management and Technology Symposium 2008!

Click Here Register! Register by Aug. 25th to save $100 on all workshop registrations.

One half-day and two full-day workshops and short courses are scheduled for Wednesday, Sept. 24. Lunch will be provided with full-day workshops and refreshments will be provided with the half-day workshop.

Half-Day Workshop

• Temperature Sensing for Embedded Systems
Highly accurate thermal-sensor instrumentation is critical for embedded-system applications where temperature monitoring is required.  Several temperature sensors are available on the market, such as Thermistor, Resistance Temperature Detector (RTD), Thermocouple and Silicon IC sensors. When designing temperature-sensor systems for embedded applications, sensor characteristics and circuit topology can make or break measurement accuracy.  This workshop will show how to identify the appropriate sensor for your application and discuss the pros and cons of each type of sensor. Attendees will learn design and development techniques for achieving ±0.05°C resolution and ±0.1°C accuracy from a -200°C to 1000°C temperature range. Additionally, practical and cost-effective solutions for each sensor type will be demonstrated using evaluation boards.  Attendees will receive USB-powered, stand-alone evaluation boards for each sensor type, and the supporting user-interface and temperature data log PC software.

Optional: Attendees can bring a laptop computer if they would like to follow the workshop hands on.  However, this is not required to benefit from attending the workshop.

Full-Day Workshops

• Air: The Ultimate Heat Sink
This full-day workshop will start by covering the following topics in the morning: air as the ultimate heat sink, heat transfer theory, lessons on air regarding insulation and heat transfer, cooling requirements and information about how to select the right air cooling scheme with hand calculations. In the afternoon, attendees will learn about selecting the right air cooling scheme with hand calculations including forced convection, radiation and assisted cooling. The workshop will also explore concepts of integrating cooling into systems, computational fluid dynamics, what happens at higher altitude, testing and test lab mistakes and the limits of air cooling.

• Advanced Thermal Management Materials
Heat dissipation, thermal stresses and warping are critical microelectronic and optoelectronic packaging problems. In response, suppliers are developing an increasing number of high-performance thermal management materials. This full-day course provides an in-depth discussion of the increasing number of ultrahigh-thermal-conductivity and other advanced materials. Topics include properties, manufacturing processes, applications, cost, lessons learned, and future directions, including carbon nanotubes, thermal interface materials and low-CTE solders. Traditional materials are included for reference.

 Global Market for Thermal Management worth $11.1 Billion by 2013

According to a new technical market research report, The Market for Thermal Management Technologies, from BCC Research, the global market for thermal management was worth $6.1 billion in 2007. This is expected to increase to $6.8 billion in 2008 and $11.1 billion by the end of 2013, a compound annual growth rate (CAGR) of 10.3 percent.

Thermal management hardware (e.g. fans and blowers, heat sinks, etc.) accounts for more than 80 percent of the total thermal management market. The other main thermal management product segments (software, interface materials and substrates) each account for between about 4 percent and 6 percent of the market.

The largest end markets for thermal management technologies in 2007 were the computer industry (57 percent of total revenues), telecommunications (16 percent) and industrial/military electronics (9 percent). By 2013, medical and office electronics should have moved into a tie for second place with telecommunications, each with a 12 percent market share, followed by consumer electronics (8 percent). 

The Americas, consisting of the US and Latin America, will maintain their No. 1 position throughout the period under review, with a market share of just below 40 percent, followed by Asia-Pacific with around 23 percent to 24 percent. The Asia-Pacific countries (except Japan) are not only the second-largest market in absolute terms, but they also have the highest projected growth rate.

New Software Simulates Use of Phase Change Materials in Buildings

Together with Dr. Valentin EnergieSoftware, the Fraunhofer Institute for Solar Energy Systems (ISE), maxit and DAW (Caparol), BASF is making the new simulation software “PCM express” available to architects, planners and house builders. The software makes it possible to calculate the advantages of using phase change materials (PCMs) in buildings. Users can now not only calculate simply and clearly how much more comfort can be gained by using phase change materials, but also the potential energy and cost savings compared with a non-PCM system. The software can currently be requested free of charge via the Internet. The project was supported by the Federal Ministry of Economics and Technology (BMWi).

According to Marco Schmidt of Technical Marketing in the Polymer Dispersions for Construction unit at BASF, there is another advantage for users: “Because the software is an express version, the program can be easily operated by virtually anyone familiar with the structural conditions of a specific building. The simulation software doesn’t only help house builders make decisions, it is also an analytical tool for architects and engineers”, he adds.

The settings make it possible to make calculations for individual rooms or up to 10 units of three rooms each. Variables such as construction method, windows, size or local climate are fed into the subsequent dynamic simulation. This means investors, architects and planners can for the first time draw concrete conclusions about the effectiveness and economic feasibility of a PCM solution, which is not possible with a rough estimate.

Projecting the future is always based on assumptions derived from current conditions. All the parameters, such as the rate of price increases, borrowing costs, period under consideration or the useful life of a facility can therefore be freely selected. On the basis of the specified investments, PCM express then dynamically calculates the expected payback period, the rate of return and the capital value of both variants on a comparative basis.

A broad-based portfolio of PCM construction materials is already available today and their impact is now quantifiable for a specific application. “This is another key step towards achieving energy efficient solutions for keeping buildings cool in summer,” said Schmidt.

Thermal Management & Technology Symposium 2008

Download the Conference Brochure Today!

Sept. 25-26, 2008
Hyatt Regency Austin in Austin, Texas

Thermal Management and Technology Symposium 2008 is a conference highlighting the latest advancements in thermal technology for product design, system development and process management, will be held September 25-26 in Austin, Texas.

This event will feature presentations on thermal manufacturing technology, materials and R&D. Topics will

include new thermal technology as well as the latest market trends affecting the industry. The conference is designed for design engineers, system engineers, process engineers, material scientists and R&D managers with organizations in a variety of industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.

If you are involved in electronics, semiconductor, manufacturing, process industries, food, healthcare, R&D or temperature control industries, this is a must attend event.

Register by August 1st and Save $300. Click Here to register today!

Contact Jeremy Fleming about sponsorship/exhibitor information.

Ecosystems Summit 2008 • Denver, Colo. • June 25-26

The rules are changing in IT alliances and partnerships. Today, more than ever, software, IT and technology companies need to know how to build their ecosystems of strategic alliances and partners, and how best to profit from these relationships.

At Ecosystems Summit 2008, Charles Weaver, President, Managed Services Alliance, will discuss the business drivers behind the growth in companies outsourcing key business processes such as network security, data protection, network administration and more, and what this growing acceptance of the service provider model means for future business opportunities. He'll also offer specific advice on how MSPs and vendors should work more closely together to benefit end-users.

Join alliance & partner program managers, C-level executives, channel managers, VARs, market development and product managers at Ecosystems Summit 2008, June 25-26 in Denver, to learn from the best at developing, managing and profiting from strategic alliances.

Click here to register: http://www.softwarebusinessonline.com/ses_conf08_reg.php.

SEMICON West 2008
July 15-17
San Francisco, Calif.

SEMICON West 2008–Infinite Innovations, Infinite Ideas SEMICON West is the place to see the companies, technologies, and people driving the future of micro design and manufacturing. No other event this year has more new products, more new technologies, and more solutions than SEMICON West.
From the latest developments in cutting-edge materials, to the systems and technologies driving semiconductor designs to the limits of Moore's Law, you'll find everything and everyone in the industry at SEMICON West.

Registration is now open! Plan now to participate and get ready to discover the infinite opportunities shaping the design and manufacture of semiconductors, MEMS, photovoltaics, flexible electronics, and more!

For more information, visit www.semiconwest.org.

SMTA International
August 17-21, 2008
Orlando, Florida

What’s New at SMTA International?
 
In addition to 130 exhibitors in the Technology Showcase and another outstanding technical conference, SMTAI, August 17-21 in Orlando, Florida…….What’s NEW in 2008?????.
 
An Alternative Energy Symposium will focus on Fuel and Solar Cells as they enter high volume manufacturing.  This symposium includes a keynote lunch address by Prismark Partners on Photovoltaics The Next Great Electronics Market.
 
Counterfeit electronics are becoming a huge issue in our industry.  Join us for the Opening Ceremony and get the latest information.
 
Our Harsh Environments Workshop is co-located with SMTAI and features a keynote by Harris Corporation on Design Challenges for Harsh Environment Military Applications.
 
The SMTA Annual Meeting speaker will be Dr. Sharon Nunes , Vice President of IBM addressing Big Green Innovations.  Learn how information technology addresses environmental concerns around the world.
 
It’s happening.  Come. Focus.  SMTA International.

Click Here for more info

IMAPS 2008
41st International Symposium on Microelectronics
Bringing Together The Entire Microelectronics Supply Chain!
November 2-6, 2008
Rhode Island Convention Center - Providence, Rhode Island, USA

The 41st International Symposium on Microelectronics will be held at the Rhode Island Convention Center, Providence, Rhode Island – USA and is being sponsored by the International Microelectronics And Packaging Society (IMAPS). The 41st Symposium on Microelectronics will focus in the areas of Industry, Systems & Applications, Design and Materials & Process. Sessions are tentatively planned to highlight the major contributions of the work in each these four areas of concentration.

http://www.imaps.org/imaps2008/index.htm

For more information on advertising in the Thermal News E-Report,
contact Jeremy Fleming at 800-803-9488 x 121.

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800-803-9488 x 126.

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