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March 2015

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Feature Article

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Using Air Handling Units in the Data Center

John Peter Valiulis, Emerson Network Power

Today’s data center managers are looking for proven, innovative technology that will help provide substantial reductions in energy usage and greater design flexibility with higher levels of IT equipment protection. One such technology is advanced, custom air handling systems.

 

While adequate for most commercial buildings, the familiar standard rooftop air handling units often are not the ideal choice for data centers Given the criticality of data center operations, there are higher expectations and demands for efficiency, redundancy and uptime. Typical standard rooftop air handling units are simply unable to maintain the precise temperature control and redundancy demanded by mission-critical environments.

 

Click Here to Read the Full Article


Building a Meaningful Relationship While Selecting the Best Thermal Interface Material

William Nicholson Jr.. Application Engineer, AI Technology, Inc.

AI Technology, Inc. (AIT) regularly receives requests through our website for the ‘best’ thermal interface material. Generally, the request is from an unknown sender and contains barely enough information for AIT staff to understand the application.  As a member of AIT’s sales team, I obviously want to help but also wonder, ‘how can I recommend a material if I don’t truly know the intended use of the device?

 

Click Here to Read the Full Article

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Sponsored Announcement
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Advancements in Thermal Management Preliminary Program Announced

The Advancements in Thermal Management 2015 conference has released its preliminary program. A great lineup of speakers has been confirmed, with more speakers and official times to be announced in April. Check out the program HERE.

 

2015 speaking companies include: IBM Research, Honeywell Electronic Materials, Cradle North America, University of Leeds, FLIR, United Arab Emirates University, Heraeus Electronic Materials and many more.

 

This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry. Register today.

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New Products

High Density, Lighter Weight Zipper Fins Improve Heat Sink Performance

New zipper fin heat sinks from Advanced Thermal Solutions, Inc. (ATS) are protecting thousands of components from the dangers of excess heat at a lower cost than other high fin density heat sink types. - Read More

 

Temperature Cycling of Traveling Wave Tubes

inTEST Thermal Solutions (iTS) has designed a multi-zone thermal plate for hot/cold temperature cycling of microwave signal amplifiers used in satellite data communications. - Read More

 

Jaro Releases Powerful “Fan to Sink” Coolers

The design of Jaro Thermal’s new IC coolers combines natural and forced-air convection by embedding a bracket fan into a heat sink design, ranging in sizes from 35 by 35 mm to 52 by 52 mm, with heights from 8 mm up to 12 mm. - Read More

 

Built-In Advantages for New Thermal Interface Materials

Fujipoly’s Sarcon 250G-HF2d thermal interface material is manufactured with a reinforced nylon mesh inner layer as well as a low-tac surface treatment. These features prevent die-cut holes from collapsing and help maintain original spec tolerances during final assembly. - Read More

 

Ametek Land Launches Cyclops Logger App

Ametek Land has launched a new App for Cyclops, its portable thermometer. The Cyclops Logger App, which is now available to download free on Google play, enhances Cyclops operation by making it even easier for anyone with a smartphone or tablet to capture and share live data from a Land Cyclops portable thermometer. - Read More

 

Find More New Product News Below

Cooling - Materials - Temp. Sensing/Control

Test & Measurement - System Design

Industry News

Honeywell’s Thermal Management Materials Now Being Used for PC Graphics Systems

Honeywell Electronic Materials has announced that its advanced Thermal Interface Materials (TIMs) are being integrated into the production of Video Graphic Array (VGA) cards, helping them stay cool and perform better. - Read More

 

North American PCB Business Growth Sags in January

IPC — Association Connecting Electronics Industries announced the January findings from its monthly North American Printed Circuit Board (PCB) Statistical Program. Despite sluggish sales and orders in January, the positive book-to-bill ratios of the past four months indicate sales growth in the first half of 2015. - Read More

 

Thermacore Recertified to AS9100 and ISO9001 Quality Standards

Thermacore, Inc. has received full recertification to both AS9100:2009 Rev. C and ISO 9001:2008 Quality Standards at its Lancaster, Penn., headquarters and manufacturing facility through the independent Lloyd’s Register Quality Assurance (LRQA) registrar. Thermacore has been recertified to these two quality standards for the design, manufacture and distribution of thermal management components and systems. - Read More

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Event Listings

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IMAPS International Device Packaging Conference is one of the premier conferences held each year where the latest in packaging technology and trends is unveiled. The DPC provides the stage to showcase the best in packaging technology available today as well as those technologies soon to be released to the market.

 

The conference provides a focused forum on the latest technological developments in 4 topical workshop tracks related to microelectronic packaging: Advanced 3D IC Packaging; Flip Chip and Wafer Level Packaging; and Engineered Microsystems and Devices (including MEMS and Sensors).

 

The 2015 conference will feature 4 keynote speakers; a NEW Global Business Council (GBC) keynote and plenary session on the Internet of Things (IoT), 15 technical sessions featuring more than 80 technical presentations, a poster session, 9 professional development courses, a sold-out vendor exhibition and technology showcase, and more, all covering the latest in packaging technology innovation.

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Critical PowerCritical Power 2015, May 13-14, 2015 at the Milwaukee Convention Center, has announced its preliminary program. The conference and exhibition will highlight the latest advancements in UPS/standby power supply and power quality solutions for industrial, facilities and emergency applications and serve the needs of managers and technical professionals involved in manufacturing, industrial and facility operations where reliable and continuous power is a critical factor.

 

Participating companies include GE Critical Power, Doosan Fuel Cell America, Fairbanks Morse Engine, Active Power, Blue Pillar, Inc., Canara, Plug Power and Eaton.

 

Limited speaking slots are still available - Click here for details.

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