June 2015



Feature Article


The Five Stages of System and Component Thermal Design

Matt Romig, Analog Packaging Co-Design and Roadmap Manager

Texas Instruments

Thermal-performance questions for power-management components seem very simple at first. But many component engineers and system designers for applications such as industrial, automotive, communications and enterprise equipment have found that things can get complicated very quickly.


There are common questions like: “What is the maximum allowed temperature for this low-dropout regulator (LDO)?” “What is the operational lifetime of this high-voltage flyback switcher?” “Is this miniaturized MOSFET power stage qualified for the latest voltage regulator’s standard operating conditions?”


Click Here to Read the Full Article


Sponsored Announcement

Advancements in Thermal Management Full Conference Program Announced

The Advancements in Thermal Management 2015 conference has released its final event program. A great lineup of speakers has been confirmed, Check out the program HERE for session and event times.


2015 speaking companies include: IBM Research, Honeywell Electronic Materials, Cradle North America, University of Leeds, FLIR, United Arab Emirates University, Heraeus Electronic Materials and many more.


This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry. Register today.

New Products

Orion Fans Develops Super High-Performance DC Fan Series

Orion Fans has designed a super high-performance 60 mm 24 V DC fan that delivers airflow up to 86 CFM, an increase of more than 25 percent versus previously available DC fans. - Read More


Dow Corning Introduces Next-Generation Thermal Interface Material

Dow Corning has unveiled the Dow Corning TC-3040 Thermally Conductive Gel, a next-generation thermal interface material (TIM 1). Developed through the help of IBM, this material offers more effective and reliable thermal management, reduced stress and excellent under-die coverage for demanding flip chip applications. - Read More


Emerson Network Power Introduces New Generation of Thermal Controls

Emerson Network Power has introduced Liebert iCOM - thermal controls to offer data center managers higher energy efficiency, greater protection and deeper, actionable insight at the cooling unit and thermal management system levels. - Read More


FLIR Releases New Software for Research and Science Applications

FLIR Systems has released a new version 4.2 of its ResearchIR thermal imaging software. ResearchIR 4.2 provides researchers and scientists with a powerful tool for viewing, acquiring, analyzing, and sharing the thermal data captured with FLIR’s Scientific and R&D cameras. - Read More


ATS Raises the Bar in Heat Sink Thermal, Vibration and Shock Performance

Advanced Thermal Solutions, Inc. has introduced clipKIT, a heat sink attachment system that can be used with most industry standard, off the shelf straight fin, pin fin, cross cut or slant fin heat sinks. - Read More


Find More New Product News Below

Cooling - Materials - Temp. Sensing/Control

Test & Measurement - System Design

Industry News

Technology Changes Drive Thermal Camera Market to $500 Million by 2019

A new report by IHS Inc. estimates that the world market for uncooled thermal cameras in commercial security applications was worth $245.0 million in 2014, and will grow to nearly $500 million in 2019. IHS expects that within the next 12 month the market will start to shift away from 17 micron sensors, to smaller pixel pitch sensors. - Read More


Thermal Interface Pads & Material Market worth $1,379 Million by 2020

According to a new market research report “Thermal Interface Pads & Material Market by Type (Phase Change Material, Thermal Grease, Thermal Pads), Products (MOSFET, Thyristor, IGBT), Application (Consumer Electronics, Telecom Equipment, Power Supply Units) – Forecast to 2020”, published by MarketsandMarkets, the total thermal interface pads & material market is expected to reach $1379.02 million by 2020. - Read More


Onset’s Bluetooth Smart Data Logger Protects the Magna Carta

Onset has announced that the HOBO MX1101, the company’s first data logger that measures and transmits temperature and relative humidity data wirelessly to mobile devices via Bluetooth Smart technology, is helping to protect a copy of the Magna Carta. - Read More


Event Listings


Battery PowerBattery Power 2015 Digital Brochure Available

Join hundreds of design engineer, OEMs, end-users and battery manufacturers at Battery Power 2015, August 5-6 in Denver, Colo. This years event will provide OEM and mobile device engineers the tools and technologies to get the most from their mobile devices: from new battery designs to wireless charging.

The conference program has been finalized and the digital brochure is available. Click here to view the brochure, which details each session, workshops, exhibitor and the co-located event, Advancements in Thermal Management.

Register Today
for the Lowest Possible Rate - OEM and Team Discounts Available


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