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February 2015

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Feature Article

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Meeting the Thermal Management Needs of Evolving Electronics Applications

Hong Min Huang, Chris Lee, Hyo Xi, Yaqun Liu, Linda Shen
Honeywell Electronic Materials

 

We live in an exciting era of seemingly endless advances in electronics technologies that drive how we work and play. With this, comes the growth of increasingly powerful chips and the relentless demand for thermal management solutions that prevent heat build-up, enabling devices to stay cool, perform better and last longer.  Meeting this need is critical to competitive advantage and customer satisfaction.

 

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Improvements to Thermal Conductivity Using Thinner Die-Attach Film

Richard Amigh, AI Technology, Inc. (AIT)

 

Die-Attach Film (DAF) adhesive has been around for the last twenty years when it became popular with stack chip manufacturing to achieve larger capacities in 3-D packaging of flash memory devices.  Additionally, using DAF at the wafer-level has become increasingly prevalent in die-attach for memory modules.

 

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Sponsored Announcement
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Advancements in Thermal Management Call for Papers Deadline This Week

 

Join other industry visionaries and speak at Advancements in Thermal Management 2015. This event provides a technical forum to discuss developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements in the temperature management industry.

 

Full-conference registration fees will be waived for all confirmed speakers. Please note, the deadline to submit an abstract is Feb. 19th, 2015. Send abstracts to Nick Depperschmidt, program manager, at 720-528-3770, ext. 111 or NickD@WebcomCommunications.com.

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New Products

Celsia Achieves 1,000 w/cm2 with New Hybrid Two-Phase Cooling Design

Celsia Inc. has successfully tested its passive two-phase technology to 1,000 w/cm2. Available in different form factors down to 2.5 mm thick, these copper based devices are designed for applications using high power density laser diodes, power electronics, concentrating photovoltaics, or ultra-HB LEDs. - Read More

 

Jaro’s Micro, Ultra-Slim “Capillary” HeatPipes

Jaro Thermal’s new, maintenance free Ultra-slim heatpipes use water as a “working fluid” that continually alternates between evaporation and condensation. This constant cycling of water to vapor is caused by a high-capillary mesh wick inside of the heatpipe. - Read More

 

Lascar Electronics Introduces new Dual Channel Temperature WiFi Sensors

Corintech has introduced two new products to the FilesThruTheAir line-up of WiFi temperature and humidity sensors. The WiFi-DTP+ and the WiFi-DTC  bring dual channel temperature options to their range of advanced remote data loggers. - Read More

 

New Affordable, Cooled Science-Grade Thermal Cameras from FLIR

FLIR Systems, Inc. has released three new A-series science-grade thermal cameras, the A6200sc NIR, A8300sc HD MWIR and A6700sc LWIR. The units are designed for demanding science and research applications like electronics development, university research, and non-destructive testing. - Read More

Industry News

Air Force, Small Business Develop Technologies That Help Electronics Stay Cool

The Air Force Research Laboratory (AFRL) and a small business partner are developing technologies that they expect will enable successful use of high-power processors that operate on satellites with funding from the Air Force Small Business Innovation Research (SBIR) program. - Read More

 

Phononic Raises $44.5 Million in Funding

Phononic has raised $44.5 million in new funding to scale up its manufacturing and enhance its sales and marketing efforts. Phononic’s latest round of funding is far and away the largest round of venture capital funding raised by a Triangle company this year. Founded in 2009, Phononic previously raised a total of $43 million in outside funding. - Read More

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Event Listings

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IMAPS International Device Packaging Conference is one of the premier conferences held each year where the latest in packaging technology and trends is unveiled. The DPC provides the stage to showcase the best in packaging technology available today as well as those technologies soon to be released to the market.

 

The conference provides a focused forum on the latest technological developments in 4 topical workshop tracks related to microelectronic packaging: Advanced 3D IC Packaging; Flip Chip and Wafer Level Packaging; and Engineered Microsystems and Devices (including MEMS and Sensors).

 

The 2015 conference will feature 4 keynote speakers; a NEW Global Business Council (GBC) keynote and plenary session on the Internet of Things (IoT), 15 technical sessions featuring more than 80 technical presentations, a poster session, 9 professional development courses, a sold-out vendor exhibition and technology showcase, and more, all covering the latest in packaging technology innovation.

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Contact Us

Submit editorial content to Nick Depperschmidt at 720-528-3770 ext 111

For advertising information contact William Massey at 720-528-3770 ext 125

Webcom Communications • 7355 E. Orchard Road, Suite 100; Greenwood Village, CO 80111
Phone: 800-803-9488 • Fax: 720-528-3771 • www.webcomcommunications.com

© 2015 Webcom Communications Corp.