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JUne 2016



Feature Article



Heat Pipes and Vapor Chambers – What’s the Difference?

George Meyer, CEO
Celsia, Inc.

At some point in a thermal system design project it may become apparent that the tried and true methods of increasing thermal efficiency – solid base, fin & fan – just aren’t sufficient.

  • Keep out zones prohibit a larger heat sink (thicker base, added fin area, etc.)
  • Enclosure size and/or airflow can’t be increased.
  • Transitioning to a solid copper heat sink, in whole or in part, adds too much weight and in some cases too much cost.
  • Component power /density necessitates heat be moved to a location more than 40-50mm away from the heat source.

Regardless of the reason, most thermal engineers are going to need a two-phase cooling solution using either heat pipes or vapor chambers on numerous projects with which they are involved. But, which one is likely the best choice? 


Click Here to Read the Full Article


  Sponsored Announcement

Advancements in Thermal Management Final Program Announced

Thefinal program has been announced for the 2016 Advancements in Thermal Management Conference. The program will feature speakers from industry leaders such as IBM Research and the IBM Advanced Thermal Lab, University of California - Riverside, Outlast Technologies/CoorTek, FLIR, and many more. View the preliminary program.


Thermal 2016 will boast the largest program in the event's history with more sessions and several pre-conference workshops, making it the most comprehensive thermal educational conference experience in the industry. Sign up today.

  New Products

Thermalogic Master Series Temperature and Process Controls

Thermalogic’s line of Master Series temperature controls are ideal for those looking for a multitude of functions in a single controller. All functions, inputs, outputs, connectors, communication options and display options are defined by the customer. Thermalogic then designs the control based upon a variety of design platforms that already exist. Functions other than temperature can be integrated such as timers, other process inputs and on-board memory, just to name a few.  By eliminating the need for a variety of discrete control devices, Master Series controls are both cost and space effective.

For 45 years, Thermalogic has been manufacturing controls for OEM and Volume Users so you can be confident that you are using proven and reliable designs. Our built to order philosophy allows users to get a control configured to their exact requirements and specifications.

A wide variety of input, output and packaging options are available to fit virtually any application where accurate and reliable control are needed at a reasonable cost.   Our factory direct model insures that you only deal with knowledgeable Sales Engineers who understand our capabilities inside and out. 


Click Here for More Information

Laird’s Spindle Screw Pump Provides Higher Performance, Efficiency and Reliability for Liquid Cooling Systems

Laird has developed a spindle screw pump that delivers consistent and reliable performance in liquid cooling systems (LCS). Compared to centrifugal pumps, Laird’s spindle screw technology can pump fluids of higher viscosity without losing flow rate, and pressure changes have little impact on pump performance.  - Read More


Graphene Nanoflake-Based Films Developed as Thermal Interface Materials

Researchers at Chalmers University of Technology in Sweden have developed a new approach to cooling electronics using graphene nanoflake-based film. - Read More


Orion Fans Develops Speed Controllers To Reduce Energy Consumption & Costs

Orion Fans has expanded its fan control product offering to include new speed control units that provide precise airflow control. The field adjustable OA11/22 dual channel phase control unit allows the user to control fan speed for single or multiple fan assemblies.  - Read More


LumaSense Introduces Ratio Pyrometer

LumaSense Technologies, Inc. has introduced the IMPAC IGAR 6 Advanced infrared thermometer. The IGAR 6 Advanced is a digital, compact pyrometer with 1-color, 2-color, and smart operating modes for non- contact temperature measurement in ranges between 100 to 2,000°C. - Read More

  Industry News

6SigmaET Partners with Rescale to Bring Thermal Simulation to the Cloud

6SigmaET has formed a new partnership with Rescale, the high performance cloud computing platform. Through this partnership, electronics engineers will be able to offload complex CFD simulation to cloud-based servers on demand, drastically reducing simulation times without the need for expensive on-site hardware. - Read More


Thermacore k-Core Technology Cools NASA’s Earth Science Satellite Observatory

When NASA launched its environmental research satellite on January 31, 2015, it carried sensitive Soil Moisture Active Passive (SMAP) instrumentation that utilized mission-critical cooling components from k Technology, a Division of Thermacore, Inc. - Read More


Upsite Technologies Declares June as Airflow Management Awareness Month

In an effort to increase public awareness of the benefits of proper data center airflow management, Upsite Technologies, Inc. has announced June is Airflow Management Awareness Month. - Read More


Shin-Etsu MicroSi Eclipses Milestone, 50 Millionth Thermal Interface Syringe Package Sold

For over 18 years Shin-Etsu MicroSi has produced a convenient package to dispense and apply thermal grease material for the rework and repair of microprocessors. Today they are announcing that they have produced and shipped their 50 millionth package. - Read More



Event Listings


Battery Power 2016Battery Power 2016
August 3-4
Denver, Colo.


Battery Power 2016 is has released its Final Program. The conference highlights the latest developments impacting mobile, stationary and EV battery systems including smart phones, tablets, medical devices, critical power systems, telecom and automotive applications. Speaking slots are still available. Click here for additional information.

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