Title: Air: The Ultimate Heat Sink
Presented by: Tony Kordyban
When: September 24th, 8:00 a.m. - 4:00 p.m. with a one hour lunch break
Cost: $450.00 registering before August 25th, $550.00 registering after August 25th.

This full-day workshop will start by covering the following topics in the morning: air as the ultimate heat sink, heat transfer theory, lessons on air regarding insulation and heat transfer, cooling requirements and information about how to select the right air cooling scheme with hand calculations. In the afternoon, the course will cover selecting the right air cooling scheme with hand calculations including forced convection, radiation and assisted cooling. Tony Kordyban will also teach about integrating cooling into systems, computational fluid dynamics, what happens at higher altitude, testing and test lab mistakes and the limits of air cooling.

About the instructor: Tony Kordyban spent 25 years engineering cooling solutions in the power, telecom and military electronics industries, and has written about it in Hot Air Rises and Heat Sinks: Everything You Know About Cooling Electronics Is Wrong.

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Title: Advanced Thermal Management Materials
Presented by: Dr. Carl Zweben, Advanced Thermal Materials Consultant
When: September 24th, 8:00 a.m. - 5:00 p.m. with a one hour lunch break
Cost: $495.00 registering before August 25th, $595.00 registering after August 25th.

Heat dissipation, thermal stresses and warping are critical microelectronic and optoelectronic packaging problems. In response, suppliers are developing an increasing number of high-performance thermal management materials. This full-day course provides an in-depth discussion of the increasing number of ultrahigh-thermal-conductivity and other advanced materials. Topics include properties, manufacturing processes, applications, cost, lessons learned, and future directions, including carbon nanotubes, thermal interface materials and low-CTE solders. Traditional materials are included for reference.

About the instructor: Dr. Carl Zweben, now an independent consultant on composites and advanced thermal materials, was for many years Advanced Technology Manager and Division Fellow at GE Astro Space, which was acquired by Lockheed Martin. He directed the Composites Center of Excellence of the seventeen-department GE Aerospace Group, and led the Lockheed Martin Space and Strategic Missiles Sector Composite Structures Center of Excellence Team. Dr. Zweben has more than 40 years of commercial and aerospace experience in polymer matrix-, metal matrix-, ceramic matrix- and carbon/carbon composite materials technology, including: design, manufacturing, product development, material development and characterization, test method development, material and structural testing and basic research in micromechanics and material behavior. He also has served as an expert witness. Dr. Zweben is a Life Fellow of ASME International (the American Society of Mechanical Engineers), a Fellow of ASM International (formerly the American Society for Materials) and the Society for the Advancement of Material and Process Engineering (SAMPE), an Associate Fellow of the American Institute of Aeronautics and Astronautics, and a Life Member of the American Society of Civil Engineers.

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Title: Temperature Sensing for Embedded Systems
Presented by: Microchip Technology, Inc.
When: September 24th, 1 p.m. - 5:00 p.m.
Cost: $200.00 registering before August 25th, $300.00 registering after August 25th.

Highly accurate thermal-sensor instrumentation is critical for embedded-system applications where temperature monitoring is required.  Several temperature sensors are available on the market, such as Thermistor, Resistance Temperature Detector (RTD), Thermocouple and Silicon IC sensors. When designing temperature-sensor systems for embedded applications, sensor characteristics and circuit topology can make or break measurement accuracy.  This workshop will show how to identify the appropriate sensor for your application and discuss the pros and cons of each type of sensor. Attendees will learn design and development techniques for achieving ±0.05°C resolution and ±0.1°C accuracy from a -200°C to +1000°C temperature range. Additionally, practical and cost-effective solutions for each sensor type will be demonstrated using evaluation boards.  Attendees will receive USB-powered, stand-alone evaluation boards for each sensor type, and the supporting user-interface and temperature data log PC software.

Optional: Attendees can bring a laptop computer if they would like to follow the workshop hands on.  However, this is not required to benefit from attending the workshop.

About the instructor: As Mixed Signal/Analog Senior Applications Engineer, Ezana Haile supports Microchip’s linear and thermal-management product lines.  This involves new product design architecture development, product development and customer support.  Additionally, Ezana is responsible for hardware, software and firmware design and development for Microchip’s reference-design and evaluation boards for linear and thermal applications.  Ezana joined Microchip in 2000.  

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If you are interested in hosting a workshop, please contact Joanna Larez at
800-803-9488 ext 126 or e-mail.