Non-intrusive Measurement of Surface Temperature and Heat Flux Transients
Using a high speed, ultrasonic time-of-flight measurement technique, thermal transients that are not accessible with traditional thermocouple or pyrometer techniques, can be monitored. This novel method is based on the temperature dependence of the elastic modulus of the material under test. Advantages include the ability to measure transients much faster than most thermocouple response times, localization of internal temperature, and sensor isolation from harsh, chemically reactive environments. This presentation will describe the measurement technique, analysis methods and successful applications in several commercial and military thermal transport studies which include research on large caliber guns, hypersonic aeroshells, and blow molding.
Mark J. Mutton BSEE, Project Engineer
Industrial Measurement Systems, Inc.

Computational Fluid Dynamics Using EFD in the Design of Advanced LED-based Lighting Systems
Attend this session to learn more about EFD (Engineering Fluid Dynamics) from Flomerics, the only fluid flow and heat transfer simulation program that is fully embedded in Pro/ENGINEER. The case study described here highlights the quickly growing marketplace for LED technology, where cooling of electronics and devices is critical to long-term reliability. The presentation demonstrates how Dialight PLC uses the software to handle all the thermal transfer mechanisms for both its low-brightness and high-brightness products.
Chris Watson, Senior EFD Applications Engineer
Flomerics

Advancements in Heat Transfer Technology
Rising power prices and energy use are driving data center cooling into the cost realm of the IT equipment itself. In response, new strategies to reduce the computer room air conditioning (CRAC) equipment load are increasing energy efficiency by bringing cooling closer to the heat source. Embedded cooling rack architectures and direct heat transfer technologies are being developed to transport heat directly from the source to the refrigerant without compromising the cooling loop. This presentation will present results from numerical simulation of this approach, highlighting thermal performance at the rack level. Performance comparisons are provided between conventional cooling and a new embedded approach.
Dr. Girish Upadhya, Director of Applications Engineering
Cooligy, Inc.

The Data Center Cooling Problem Solved: Breakthrough Economization Strategies
The single most effective action for reducing the cost of cooling a data center while simultaneously protecting  greater densities of equipment from thermal events is to completely isolate supply air from return air and thereby raise supply temperatures to improve chiller plant efficiencies, eliminate wasted cooling capacity and gain access to greater hours of economization cooling. This presentation will explain the benefits of return air isolation and will introduce the concept of the KyotoCooling heat recovery wheel, capable of producing a coefficient of performance (COP) for the entire cooling function of up to 50.
Ian Seaton, Technology Marketing Manager
Chatsworth Products, Inc.

Selecting the Best Heat Sink Technology – Lowest Cost is Not Always the Optimum Thermal Solution
Engineers and designers are faced with many thermal problems during a design. One of the most difficult with the longest lasting impact is the type of heat sink that will give the best performance thermally and financially over the life of the product. Making this selection requires knowledge of not only CFD and air flow design but also the wide variety of available cooling solution styles.
All cooling devices have their limits and restrictions; extrusions are inexpensive but heavy and limited in cooling fin details, castings are expensive to tool and difficult to revise, liquid cooling requires significant support equipment. All manufacturing technologies have strengths and weaknesses that can be taken advantage of or should be avoided. This presentation will examine the pros and cons of most the popular heat sink styles, compare costs and deliveries and offer a few real world case studies.
Christopher Soule, Engineering Director
Thermshield, LLC

Going "Off the Curve" in Developing New Thermal Interface Materials
Reducing size of power electronic packages essentially means reducing the package footprints, which leads to higher power dissipation densities on the die as well as the modules. New technology to develop thermal interface materials (TIMs) is described that allows for TIMs that are ‘off the curve’ of the classic trade-offs that usually guide TIM development. This has resulted in new TIMs that have higher thermal conductivity that previously possible, and TIMs that have new properties that are better than possible with traditional polymers used in thermal management.
Sara N. Paisner, PhD, Senior Research Scientist
Lord Corp.

Design Guidelines for Vapor Chamber Based Coolers
Since the late 1990s, thermal management has become an important factor in the performance and reliability of electronics. Thermal management products play a vital role in transferring the heat that is generated by the electronics to the working medium, and by far, the most commonly accepted thermal management product is the heat sink, which is generally made of extruded aluminum, although more recent heat sinks have embedded copper or heat pipes for increased heat dissipation capabilities. System designers are faced with an increasingly complex task in balancing the various constraints such as heat sink size, airflow speed, airflow distribution, noise, performance and costs. Recently, there has been increasing attention on vapor chambers, which is essentially a 3-D heat pipe. Since the vapor chamber operates on an evaporation/condensation principle, it has been shown to be more efficient than heat sinks. Indeed, some of the existing heat sink design rules may no longer applicable for vapor chamber based coolers. The objective of the present investigation is to provide detailed design information on vapor-chamber based coolers, and where applicable, comparisons are also made against the heat sink counterpart.
S. K. Chu, R&D Engineer
CT Electronics Limited

Smart Control: Process Heating in Three Dimensions
Despite the fact that forced-air process heating devices (such as heat torches) are used in many processes where precise control is essential, conventional technology provides only the most basic level of process control. This presentation will examine the role that temperature along with airflow and mass-air play in thermal transfer. The presentation will examine traditional control using simple thermocouples with a control scheme that focuses on the relationship between all three variables (temperature, velocity and volume). Practical considerations such as heat source longevity as well as the effect of these parameters on heating rate and uniformity will be examined.
Paul Mills
EIT, Inc.

Platinum RTD Temperature Sensor Technology
High purity, chemical resistance, high stability and a virtual linear resistance response to temperature are some of the properties that make platinum an ideal base material for temperature measuring elements.  International standards defining the characteristics of platinum temperature sensors insure reproducibility and interchangeability. Recent developments include platinum RTD elements with operating temperatures up to 1,000°C. Conference attendees will receive an overview of the platinum temperature sensor characteristics, types of platinum temperature sensors, as well as automotive, appliance, life science and industrial applications.
Robert Gliniecki, Product Manager
DWM & Associates, Inc.

Thermal Management of Future Electronic Products through Airflow Monitoring
Most products today are cooled using airflow. Though the temperature rise is the primary factor in thermal control one also has to consider the power required to cool as an important factor. If airflow is too low the temperature rise can be very high, and as the airflow increases beyond some point the reduction in temperature rise is minimal. Power required to operate fans at higher speeds can be significantly higher leading to negative net returns. 
Temperature rise normally has a delayed response to a change in airflow due to the thermal inertia of the hardware. This means that the start of an impending temperature rise can be predicted through monitoring airflow. This early warning may be used for active airflow control or for graceful shutdown if the failure is critical.
In short, direct airflow measurement at critical locations on the board will soon become a necessity for future applications in markets such as telecommunications, servers, military and medical systems. Electronic products with high power density and expected high availability are the first ideal candidates.
Rajesh Nair, CTO and Founder
Degree Controls, Inc.