Evolution of Thermal Management in Electronics
The need for thermal management in electronics has evolved rapidly in recent years. The number of applications requiring heat removal in the computing, lighting and handset markets is steadily increasing. Incremental improvements in the performance of the thermal solution are not expected to meet the future needs of OEM’s, requiring the need for more sophisticated solutions even in consumer products. Innovative approaches to thermal interface materials that require close collaboration between materials and systems designers are discussed. The increased cost of thermal management will have to be mitigated by integrating multiple functions into the thermal solution, and by offering the OEM’s a total thermal solution package that includes design, materials, components, assembly and quality on a global scale with local service. 
Dr. Richard Hill, Director of Technology
Laird Technologies

Dr. Hill joined Laird Technologies thermal business in 1999. He is the global director of Technology, and is primarily involved in new product development and strategic growth of its thermal business. He has more than 30 years experience in technology and new business development. He currently leads Laird Technologies’ thermal technology teams, whose primary focus is on thermal interface materials, thermally conductive printed circuit boards, and thermoelectric materials for use in heat transfer applications. He also leads the R&D effort in electrically conductive polymers for EMI shielding.

Thermal Management of Future Electronic Products through Airflow Monitoring
Most products today are cooled using airflow. Though the temperature rise is the primary factor in thermal control one also has to consider the power required to cool as an important factor. If airflow is too low the temperature rise can be very high, and as the airflow increases beyond some point the reduction in temperature rise is minimal. Power required to operate fans at higher speeds can be significantly higher leading to negative net returns. 
Temperature rise normally has a delayed response to a change in airflow due to the thermal inertia of the hardware. This means that the start of an impending temperature rise can be predicted through monitoring airflow. This early warning may be used for active airflow control or for graceful shutdown if the failure is critical.
In short, direct airflow measurement at critical locations on the board will soon become a necessity for future applications in markets such as telecommunications, servers, military and medical systems. Electronic products with high power density and expected high availability are the first ideal candidates.
Rajesh Nair, CTO and Founder
Degree Controls, Inc.

As an inventor and entrepreneur, Rajesh contributes technical leadership to the company in defining business opportunities, developing technologies and new business models. He has developed several products that are considered firsts in the industry and used all over the world as standard in the thermal and sensing industry. Rajesh was a co-founder of Degree Controls in 1997. He received a B.S. (Physics), Kerala University; B.S. (EE) and M.S. (Electronics Product Design), Indian Institute of Science; M.S. (Manufacturing Engineering), University of Massachusetts (Amherst).

Design Guidelines for Vapor Chamber Based Coolers
Since the late 1990s, thermal management has become an important factor in the performance and reliability of electronics. Thermal management products play a vital role in transferring the heat that is generated by the electronics to the working medium, and by far, the most commonly accepted thermal management product is the heat sink, which is generally made of extruded aluminum, although more recent heat sinks have embedded copper or heat pipes for increased heat dissipation capabilities. System designers are faced with an increasingly complex task in balancing the various constraints such as heat sink size, airflow speed, airflow distribution, noise, performance and costs. Recently, there has been increasing attention on vapor chambers, which is essentially a 3-D heat pipe. Since the vapor chamber operates on an evaporation/condensation principle, it has been shown to be more efficient than heat sinks. Indeed, some of the existing heat sink design rules may no longer applicable for vapor chamber based coolers. The objective of the present investigation is to provide detailed design information on vapor-chamber based coolers, and where applicable, comparisons are also made against the heat sink counterpart.
Dr. Steven Lee
CT Electronics Limited

Dr. Steven Lee has a background in mechanical engineering, academia, service and research in both Hong Kong and the US. Having been a faculty of Mechanical Engineering at the Hong Kong University of Science and Technology since 1993, Dr. Lee resigned his tenured post in 2006 to assume the position of chairman and CEO of CT Electronics Limited, a company which he founded and incorporated with the mission of delivering innovative, proprietary cooling products to the electronics industry. Dr. Lee received his Bachelor of Engineering degrees in Mechanical Engineering and Electrical Engineering from The Cooper Union and both his M.Phil and Ph.D. degrees in Mechanical Engineering from Rutgers University. Dr. Lee’s expertise is in thermodynamics, numerical and experimental heat transfer/fluid mechanics.

Selecting the Best Heat Sink Technology – Lowest Cost is Not Always the Optimum Thermal Solution
Engineers and designers are faced with many thermal problems during a design. One of the most difficult with the longest lasting impact is the type of heat sink that will give the best performance thermally and financially over the life of the product. Making this selection requires knowledge of not only CFD and air flow design but also the wide variety of available cooling solution styles.
All cooling devices have their limits and restrictions; extrusions are inexpensive but heavy and limited in cooling fin details, castings are expensive to tool and difficult to revise, liquid cooling requires significant support equipment. All manufacturing technologies have strengths and weaknesses that can be taken advantage of or should be avoided. This presentation will examine the pros and cons of most the popular heat sink styles, compare costs and deliveries and offer a few real world case studies.
Christopher Soule, Engineering Director
Thermshield, LLC

Christopher Soule is engineering director for Thermshield, LLC in New Hampshire. With more than 20 years of thermal management experience, Soule has authored more than 50 technical papers, conducted thermal training classes around the world and holds six US patents. He serves on the board of advisors for PowerSystems World and PCIM Germany and is a member of IMAPS. He holds BSET and MBA degrees.

Embedded Cooling for High-Density Equipment in Data Centers
Rising power prices and energy use are driving data center cooling into the cost realm of the IT equipment itself. In response, new strategies to reduce the computer room air conditioning (CRAC) equipment load are increasing energy efficiency by bringing cooling closer to the heat source. Embedded cooling rack architectures and direct heat transfer technologies are being developed to transport heat directly from the source to the refrigerant without compromising the cooling loop. This presentation will present results from numerical simulation of this approach, highlighting thermal performance at the rack level. Performance comparisons are provided between conventional cooling and a new embedded approach.
Dr. Girish Upadhya, Director of Applications Engineering
Cooligy, Inc.

Before Cooligy, Dr. Upadhya was at Brocade Communications, where he developed complete thermal management solutions through design, simulation, prototyping and thermal characterization. Girish received his Ph.D. from The University of Alabama and his Bachelor’s and Master’s from Indian Institute of Technology, Kanpur and Madras, respectively. Dr. Upadhya is a member of ASME.

Computational Fluid Dynamics Using EFD in the Design of Advanced LED-based Lighting Systems
Attend this session to learn more about EFD (Engineering Fluid Dynamics) from Flomerics, the only fluid flow and heat transfer simulation program that is fully embedded in Pro/ENGINEER. The case study described here highlights the quickly growing marketplace for LED technology, where cooling of electronics and devices is critical to long-term reliability. The presentation demonstrates how Dialight PLC uses the software to handle all the thermal transfer mechanisms for both its low-brightness and high-brightness products.
Chris Watson, Senior EFD Applications Engineer
Flomerics

Chris is the Thermo-Fluid Engineering supervisor for Flomerics, Inc. Chris is responsible for technical leadership of Flomerics' EFD product line in North America. Prior to Flomerics, Chris worked for NIKA and CD-adapco. He has more than 12 years of experience in the software market and plays a key part in both the sales and engineering departments. Chris received his B.S. in Aerospace Engineering from the University of Texas at Austin, and his M.S. in Mechanical Engineering from Texas A&M University.

Unique Fanless Air Cooling for LED Lighting
This presentation describes an innovative air cooling technology based on synthetic jets (Synjets) for meeting the increasing thermal needs of the LED industry. A synthetic jet is an intense, small-scale turbulent jet formed by the motion of a diaphragm bounding a cavity. The high momentum synthetic jet flow entrains a secondary flow that is several times the jet flow. Since Synjets do not have an inlet and an outlet like a fan, unique form factors can be realized to accommodate tight geometric constraints. Due to the higher heat transfer coefficients produced by the jets, they need lower flow rates, and thus produce lower acoustic emissions than a fan. Also, since synthetic jet actuators have no moving parts in friction, Synjet reliability is orders of magnitude higher than fans.
Raghav Mahalingam, Co-Founder and Director of Product Development
Nuventix, Inc.

Raghav Mahalingam is a co-founder and Director of Product Development at Nuventix, Inc. Prior to this, he developed synthetic jets as a thermal management technology at Georgia Tech. His research interests include fluid mechanics, heat transfer, acoustics and thermal management in microelectronics. He received his Ph.D. in Aerospace Engineering from Georgia Tech in 1999 and B. Tech in Aerospace Engineering from IIT-Madras, India in 1994.

Smart Control: Process Heating in Three Dimensions
Despite the fact that forced-air process heating devices (such as heat torches) are used in many processes where precise control is essential, conventional technology provides only the most basic level of process control. This presentation will examine the role that temperature along with airflow and mass-air play in thermal transfer. The presentation will examine traditional control using simple thermocouples with a control scheme that focuses on the relationship between all three variables (temperature, velocity and volume). Practical considerations such as heat source longevity as well as the effect of these parameters on heating rate and uniformity will be examined.
Paul Mills
EIT, Inc.

Paul Mills has been involved in the Process heating field since 1994 when he joined Nutro Corp., a turnkey finishing system supplier. Nutro designs and manufactures a wide range of convection and infrared ovens and control. Paul left Nutro in 2002 and consults to a number of industry suppliers. EIT, Inc. is a manufacturer of test instruments and custom engineering firm specializing in process control, especially in curing technologies including UV curing. EIT has partnered with Farnam Custom Products to produce a line of "smart" process air heaters with advanced controls.

The Data Center Cooling Problem Solved: Breakthrough Economization Strategies
The single most effective action for reducing the cost of cooling a data center while simultaneously protecting  greater densities of equipment from thermal events is to completely isolate supply air from return air and thereby raise supply temperatures to improve chiller plant efficiencies, eliminate wasted cooling capacity and gain access to greater hours of economization cooling. This presentation will explain the benefits of return air isolation and will introduce the concept of the KyotoCooling heat recovery wheel, capable of producing a coefficient of performance (COP) for the entire cooling function of up to 50.
Ian Seaton, Technology Marketing Manager
Chatsworth Products, Inc.

Seaton has more than 30 years of mechanical and electro-mechanical product development experience ranging in areas from multi-tenant HVAC control systems to switchable attenuators to automotive safety and comfort systems and controls. He serves on the BICSI Data Center Design Standard (TIA-942) Committee as editor of the rack and cabinet section and as a thermal consultant to the Mechanical Working Group. For the past 10 years, he has helped Chatsworth Products, Inc. with their server cabinet and thermal solution offerings and is currently Technology Marketing Manager.

FRIDAY

Emerging Thermal Management Market Opportunities
Thermal management, married as it is to electronics, is without doubt a growing industry.  But there is on the horizon a host of emerging market opportunities. Properly exploited, these markets can move nimble companies past incremental growth into exponential growth. The trick, of course, is identifying which of these emerging markets to enter. This presentation describes several of these emerging markets for thermal management solutions. Market drivers and needs are discussed for storage and batteries, printed and flexible electronics, solid state lighting, advanced biomedical systems, and next generation consumer electronics.
Kevin M. Closson, Analyst
Nerac, Inc.

Kevin is an analyst at Nerac, Inc. where he advises clients on business, technical and intellectual property issues. He has 11 years of experience in electronics manufacturing, photonics and telecommunications. Kevin has a BS in Mechanical Engineering from Penn State University, an MS in Mechanical Engineering from the University of Maryland and an MBA from the University of Baltimore. He is a member of IEEE and ASME.

Processing Effects on Indium Solder Thermal Interface Materials
In an effort to control heat dissipation from electronics, many designers have implemented indium solders as their thermal interface material of choice into their power devices. These thermal interfaces boast the potential to have the lowest resistance of all commercially available solutions if treated correctly. There are multiple factors however, such as the reflow profile used, the flux used, and the substrate metallization that strongly impact the material’s performance. This presentation discusses the variables which impact the performance of an indium solder joint and tests which have been conducted to optimize an indium soldering procedure.
Amanda Hartnett, Applications Engineer
Indium Corp.

Amanda is an applications engineer supporting Indium Corp.’s Engineered Solder Products. Amanda specializes in coaching manufacturing, process and design engineers on their choice and application of solders and other bonding materials to achieve reliable packaging and attachment solutions. Amanda received her B.S. in Chemistry from Utica College and worked as a research lab technician at Cornell University, focusing on the physical properties of silicon. She is a member of the American Chemical Society.

Going "Off the Curve" in Developing New Thermal Interface Materials
Reducing size of power electronic packages essentially means reducing the package footprints, which leads to higher power dissipation densities on the die as well as the modules. New technology to develop thermal interface materials (TIMs) is described that allows for TIMs that are ‘off the curve’ of the classic trade-offs that usually guide TIM development. This has resulted in new TIMs that have higher thermal conductivity that previously possible, and TIMs that have new properties that are better than possible with traditional polymers used in thermal management.
Sara N. Paisner, PhD, Senior Research Scientist
Lord Corp.

Dr. Paisner received her A.B. at Dartmouth College, and her Ph.D. at the University of California at Berkeley. During her postdoctoral research at the University of North Carolina-Chapel Hill, she worked on developing new types of low K dielectric materials. Dr. Paisner is a senior research scientist in the Electronic Materials Product Development Group at Lord Corp. She leads a variety of projects focused on developing Lord Corp.’s next generation of thermal interface gels, greases and adhesives for the microelectronics industry.

Platinum RTD Temperature Sensor Technology
High purity, chemical resistance, high stability and a virtual linear resistance response to temperature are some of the properties that make platinum an ideal base material for temperature measuring elements.  International standards defining the characteristics of platinum temperature sensors insure reproducibility and interchangeability. Recent developments include platinum RTD elements with operating temperatures up to 1,000°C. Conference attendees will receive an overview of the platinum temperature sensor characteristics, types of platinum temperature sensors, as well as automotive, appliance, life science and industrial applications.
Robert Gliniecki, Product Manager
DWM & Associates, Inc.

Robert Gliniecki has worked for several firms in the RTD element, thermistor and temperature probe industries, and has more than 20 years experience in manufacturing, quality, engineering, application and sales positions. Areas of concentration include automotive and biomedical temperature sensing applications. Robert has been employed at DWM & Associates for five years.

Non-intrusive Measurement of Surface Temperature and Heat Flux Transients
Using a high speed, ultrasonic time-of-flight measurement technique, thermal transients that are not accessible with traditional thermocouple or pyrometer techniques, can be monitored. This novel method is based on the temperature dependence of the elastic modulus of the material under test. Advantages include the ability to measure transients much faster than most thermocouple response times, localization of internal temperature, and sensor isolation from harsh, chemically reactive environments. This presentation will describe the measurement technique, analysis methods and successful applications in several commercial and military thermal transport studies which include research on large caliber guns, hypersonic aeroshells, and blow molding.
Mark J. Mutton BSEE, Project Engineer
Industrial Measurement Systems, Inc.

Mark J. Mutton graduated from Northern Illinois University in 2005 with a B.S. in Electrical Engineering. Mark was a member of the US Air Force National Guard, as an Electrical Power Production Specialist. At IMS, Mark is the chief project engineer and has been lead engineer on many commercial and government contracts including various measurement methodologies. He has started a software development branch. He is responsible for following measurement systems from analytical derivation through experimental verification and onto commercial deployment. Mutton’s research interests include the development and analysis of innovative measurement technologies and design of end-user systems.