The Thermal Management and Technology Symposium 2008 Conference committee is still accepting abstracts. Being held September 25-26 in Austin, Texas, the 2008 event will explore the important topics impacting the thermal management industry from materials to heat transfer.
The initial deadline for presentation abstracts has passed, and abstracts are now being accepted on a first-come-first-serve basis.
Here are some of the topics we are looking for:
Market Trends
• Upcoming and Emerging Technologies for Thermal Management
• Market Opportunities for Thermal Products and Services
• Supply, Demand and Pricing of Thermal Materials
• Supply, Demand and Pricing of Thermal Components
• Comparative price/performance of thermal materials
• Comparative price/performance of thermal components
Next-Generation Thermal Technology
• Cooling
• Components
• Heating
• Materials
• Modeling/Analysis
• Measurement
• Nanotechnology
• Thermal Imaging
Thermal Technology by Market
• Semiconductors
• PCBs
• Electronic Systems
• Non-Electronic Systems
• Process Industries
• Technology Transfer & Licensing
Thermal Management & Integration
• Material-Level
• System-Level
• Process Design & Management
• Component-Level
Advancements in Heat Transfer Technology
• Airflow
• Liquid Cooling
• Phase Change Heat Exchangers
• Thermoelectrics
Thermal Materials
• Interface Materials
• Phase Change Materials
• Substrates
Temperature Products
• Controls
• Coolers
• Heaters
• Instruments
• Software
Thermal Management and Technology Symposicum 2008 provides an excellent forum to discuss new developments in technology, market conditions and end-user requirements that are driving innovation, capabilities and features, application trends and performance improvements today and in the future. Attendees will include design engineers, system engineers, process engineers, material scientists and R&D managers with organizations in a variety of industries and markets whose products, operations and services depend upon sophisticated and precise control of thermal properties and states.
Full-conference registration fees will be waived for all confirmed speakers.
For more information on submitting an abstract contact Joanna Larez, program manager, 720-528-3770 or joannal@infowebcom.com.
The basis of the proposal or the presentation may not be the promotion or marketing of a product.
Please Note: Proposals and Submissions will be accepted only electronically by email. Send your proposal in the body of your email letter and include supporting material as attachments. Submit to Joanna Larez: joannal@infowebcom.com
THE PROPOSAL: The total length of each proposal should be a maximum of 1,000 words. It should include:
- A summary of the presentation content
- Brief description of the presentation for the conference program (100 words)
- Computer and equipment requirements (See Your Technology Needs)
- Presenter(s) biography and list of affiliations
- Contact information: name, title, company, address, office phone & fax, email address, and web site.
DESIRED TOPIC: In which topic does your proposal best fit: Heat Transfer, Next-Generation Thermal Technology, Thermal Materials, Market Trends or Technology Trends.
YOUR TECHNOLOGY NEEDS: Do you need an Internet connection? Will you use computer-generated slides or present from a presentation program? If yes, you must bring your own laptop. Indicate any other technology that you plan to bring. Include any other pertinent information about your technology requirements.
Optional: Each presenter may submit a 1,500-2,000 word paper or copies of their presentation for publication on ThermalNews.com and in the Conference Proceedings. Papers will also be considered for publication in THERMAL News magazine. |
